JPS60167322A - 半導体ウエハの熱処理方法 - Google Patents

半導体ウエハの熱処理方法

Info

Publication number
JPS60167322A
JPS60167322A JP27888184A JP27888184A JPS60167322A JP S60167322 A JPS60167322 A JP S60167322A JP 27888184 A JP27888184 A JP 27888184A JP 27888184 A JP27888184 A JP 27888184A JP S60167322 A JPS60167322 A JP S60167322A
Authority
JP
Japan
Prior art keywords
jig
heat
treatment chamber
heat treatment
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27888184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0335824B2 (enrdf_load_stackoverflow
Inventor
Masakuni Akiba
秋葉　政邦
Hiroto Nagatomo
長友　宏人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP27888184A priority Critical patent/JPS60167322A/ja
Publication of JPS60167322A publication Critical patent/JPS60167322A/ja
Publication of JPH0335824B2 publication Critical patent/JPH0335824B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP27888184A 1984-12-28 1984-12-28 半導体ウエハの熱処理方法 Granted JPS60167322A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27888184A JPS60167322A (ja) 1984-12-28 1984-12-28 半導体ウエハの熱処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27888184A JPS60167322A (ja) 1984-12-28 1984-12-28 半導体ウエハの熱処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4445677A Division JPS53129964A (en) 1977-04-20 1977-04-20 Method and device for inserting and taking out of heat treatment jig

Publications (2)

Publication Number Publication Date
JPS60167322A true JPS60167322A (ja) 1985-08-30
JPH0335824B2 JPH0335824B2 (enrdf_load_stackoverflow) 1991-05-29

Family

ID=17603410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27888184A Granted JPS60167322A (ja) 1984-12-28 1984-12-28 半導体ウエハの熱処理方法

Country Status (1)

Country Link
JP (1) JPS60167322A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190267269A1 (en) * 2018-02-26 2019-08-29 Samsung Electronics Co., Ltd. Jig for evaluating semiconductor processing chamber

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190267269A1 (en) * 2018-02-26 2019-08-29 Samsung Electronics Co., Ltd. Jig for evaluating semiconductor processing chamber
US10879095B2 (en) * 2018-02-26 2020-12-29 Samsung Electronics Co., Ltd. Jig for evaluating semiconductor processing chamber

Also Published As

Publication number Publication date
JPH0335824B2 (enrdf_load_stackoverflow) 1991-05-29

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