JPH0335824B2 - - Google Patents

Info

Publication number
JPH0335824B2
JPH0335824B2 JP59278881A JP27888184A JPH0335824B2 JP H0335824 B2 JPH0335824 B2 JP H0335824B2 JP 59278881 A JP59278881 A JP 59278881A JP 27888184 A JP27888184 A JP 27888184A JP H0335824 B2 JPH0335824 B2 JP H0335824B2
Authority
JP
Japan
Prior art keywords
jig
wafer
rod
heat treatment
inner tube
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59278881A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60167322A (ja
Inventor
Masakuni Akiba
Hiroto Nagatomo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP27888184A priority Critical patent/JPS60167322A/ja
Publication of JPS60167322A publication Critical patent/JPS60167322A/ja
Publication of JPH0335824B2 publication Critical patent/JPH0335824B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP27888184A 1984-12-28 1984-12-28 半導体ウエハの熱処理方法 Granted JPS60167322A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27888184A JPS60167322A (ja) 1984-12-28 1984-12-28 半導体ウエハの熱処理方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27888184A JPS60167322A (ja) 1984-12-28 1984-12-28 半導体ウエハの熱処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP4445677A Division JPS53129964A (en) 1977-04-20 1977-04-20 Method and device for inserting and taking out of heat treatment jig

Publications (2)

Publication Number Publication Date
JPS60167322A JPS60167322A (ja) 1985-08-30
JPH0335824B2 true JPH0335824B2 (enrdf_load_stackoverflow) 1991-05-29

Family

ID=17603410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27888184A Granted JPS60167322A (ja) 1984-12-28 1984-12-28 半導体ウエハの熱処理方法

Country Status (1)

Country Link
JP (1) JPS60167322A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10879095B2 (en) * 2018-02-26 2020-12-29 Samsung Electronics Co., Ltd. Jig for evaluating semiconductor processing chamber

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53129964A (en) * 1977-04-20 1978-11-13 Hitachi Ltd Method and device for inserting and taking out of heat treatment jig

Also Published As

Publication number Publication date
JPS60167322A (ja) 1985-08-30

Similar Documents

Publication Publication Date Title
JPS623571B2 (enrdf_load_stackoverflow)
US4468195A (en) Thermal treatment apparatus
KR100285081B1 (ko) 웨이퍼보트 회전장치
JPH0335824B2 (enrdf_load_stackoverflow)
JPS633446B2 (enrdf_load_stackoverflow)
US4440538A (en) Apparatus for loading and unloading a furnace
JP2003309166A (ja) 半導体ウェハの移載装置
JPS6235261B2 (enrdf_load_stackoverflow)
JPS6221229A (ja) 処理装置
JPS60167323A (ja) 横型半導体ウエハ・バツチ処理装置
JPS59130421A (ja) 熱処理治具の插入取出し用治具
JPH05343377A (ja) 半導体製造ウェット処理装置
JP2000507501A (ja) サブストレートを処理する方法並びに装置
JP2000111254A (ja) ディスク用カセットの乾燥装置
JPS59208824A (ja) 半導体部材等の加熱装置
US6520348B1 (en) Multiple inclined wafer holder for improved vapor transport and reflux for sealed ampoule diffusion process
JPH1067428A (ja) ウエハスライス収納・取出方法
JP2590352B2 (ja) 縦型熱処理装置
JP2522901B2 (ja) ウォ―キングビ―ム式搬送装置
JPH0870031A (ja) 基板保持具、基板の処理槽、及び基板の洗浄・乾燥方法及び同装置
JP2550553Y2 (ja) 表面処理装置のウエハ移替装置
JPS6384021A (ja) 熱処理装置
KR0161457B1 (ko) 웨이퍼 낱장 취급 장치
JPH0394097A (ja) めっき処理装置
JPS6372112A (ja) 熱処理装置