JPS60161569A - プリント基板試験装置に用いられる接点配列のピツチ変更用アダプタ - Google Patents
プリント基板試験装置に用いられる接点配列のピツチ変更用アダプタInfo
- Publication number
- JPS60161569A JPS60161569A JP59233382A JP23338284A JPS60161569A JP S60161569 A JPS60161569 A JP S60161569A JP 59233382 A JP59233382 A JP 59233382A JP 23338284 A JP23338284 A JP 23338284A JP S60161569 A JPS60161569 A JP S60161569A
- Authority
- JP
- Japan
- Prior art keywords
- contacts
- pitch
- contact
- substrate
- array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims description 52
- 238000012360 testing method Methods 0.000 title claims description 39
- 239000004020 conductor Substances 0.000 claims description 13
- 238000003491 array Methods 0.000 abstract 2
- 239000011295 pitch Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 7
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000011152 fibreglass Substances 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000013507 mapping Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
- 230000002747 voluntary effect Effects 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3340179.9 | 1983-11-07 | ||
| DE3340179A DE3340179C1 (de) | 1983-11-07 | 1983-11-07 | Anordnung an einem Leiterplattenpruefgeraet zur Anpassung der Abstaende von Kontakten |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60161569A true JPS60161569A (ja) | 1985-08-23 |
| JPH0519662B2 JPH0519662B2 (en, 2012) | 1993-03-17 |
Family
ID=6213643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59233382A Granted JPS60161569A (ja) | 1983-11-07 | 1984-11-07 | プリント基板試験装置に用いられる接点配列のピツチ変更用アダプタ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4614386A (en, 2012) |
| EP (1) | EP0142119B1 (en, 2012) |
| JP (1) | JPS60161569A (en, 2012) |
| AT (1) | ATE24614T1 (en, 2012) |
| CA (1) | CA1221470A (en, 2012) |
| DE (2) | DE3340179C1 (en, 2012) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62188979A (ja) * | 1985-11-12 | 1987-08-18 | マニア・エレクトロニツク・アウトマテイザチオン・エントビツクルンク・ウント・ゲレ−テバウ・ゲ−エムベ−ハ− | 高密度接続ポイントの回路基板試験装置 |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3630548A1 (de) * | 1986-09-08 | 1988-03-10 | Mania Gmbh | Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster |
| DE3638372A1 (de) * | 1986-11-11 | 1988-05-26 | Lang Dahlke Helmut | Vorrichtung zum pruefen von elektrischen leiterplatten |
| DE3806792A1 (de) * | 1988-02-29 | 1989-09-07 | Siemens Ag | Vorrichtung zum pruefen von leiterplatten |
| DE3806793A1 (de) * | 1988-02-29 | 1989-09-07 | Siemens Ag | Adaptereinrichtung fuer eine vorrichtung zum pruefen von leiterplatten |
| DE8908326U1 (de) * | 1989-07-07 | 1989-09-07 | Siemens AG, 1000 Berlin und 8000 München | Adaptiervorrichtung zur Prüfung von filmmontierten integrierten Bausteinen |
| US5061190A (en) * | 1990-08-14 | 1991-10-29 | Ziatech Corporation | Double density backward and forward compatible card edge connector system |
| DE69212195T2 (de) | 1991-04-11 | 1996-12-19 | Methode Electronics Inc | Gerät zum elektronischen Testen von gedruckten Leiterplatten oder ähnlichem |
| US5216361A (en) * | 1991-07-10 | 1993-06-01 | Schlumberger Technologies, Inc. | Modular board test system having wireless receiver |
| JPH07244116A (ja) * | 1994-03-07 | 1995-09-19 | Hitachi Chem Co Ltd | 半導体特性測定用治具とその製造法並びにその使用方法 |
| TW381328B (en) * | 1994-03-07 | 2000-02-01 | Ibm | Dual substrate package assembly for being electrically coupled to a conducting member |
| IT1282689B1 (it) * | 1996-02-26 | 1998-03-31 | Circuit Line Spa | Dispositivo di conversione della griglia di punti di test di una macchina per il test elettrico di circuiti stampati non montati |
| DE19932849C2 (de) * | 1999-07-14 | 2003-07-03 | Herbert Amrhein | Kontaktiereinrichtung zum Herstellen einer elektrisch leitfähigen Verbindung |
| DE19943388B4 (de) | 1999-09-10 | 2010-04-08 | Atg Luther & Maelzer Gmbh | Vorrichtung zum Prüfen von Leiterplatten |
| US7587289B1 (en) * | 2007-02-13 | 2009-09-08 | American Megatrends, Inc. | Data cable powered sensor fixture |
| US20080238461A1 (en) * | 2007-04-02 | 2008-10-02 | Ken Skala | Multi-type test interface system and method |
| FR2935203B1 (fr) * | 2008-08-20 | 2014-12-12 | Centre Nat Etd Spatiales | Dispositif de fils electriques et boitier de fils electriques |
| ITVI20110343A1 (it) * | 2011-12-30 | 2013-07-01 | St Microelectronics Srl | Sistema e adattatore per testare chips con circuiti integrati in un package |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3911361A (en) * | 1974-06-28 | 1975-10-07 | Ibm | Coaxial array space transformer |
| US3963986A (en) * | 1975-02-10 | 1976-06-15 | International Business Machines Corporation | Programmable interface contactor structure |
| US4250536A (en) * | 1978-12-26 | 1981-02-10 | General Electric Company | Interconnection arrangement for circuit boards |
| US4340858A (en) * | 1979-08-13 | 1982-07-20 | Philip M. Hinderstein | Test fixture |
| DE2933862A1 (de) * | 1979-08-21 | 1981-03-12 | Paul Mang | Vorrichtung zur elektronischen pruefung von leiterplatten. |
-
1983
- 1983-11-07 DE DE3340179A patent/DE3340179C1/de not_active Expired
-
1984
- 1984-11-06 EP EP84113375A patent/EP0142119B1/de not_active Expired
- 1984-11-06 DE DE8484113375T patent/DE3461867D1/de not_active Expired
- 1984-11-06 CA CA000467102A patent/CA1221470A/en not_active Expired
- 1984-11-06 AT AT84113375T patent/ATE24614T1/de not_active IP Right Cessation
- 1984-11-07 US US06/669,309 patent/US4614386A/en not_active Expired - Lifetime
- 1984-11-07 JP JP59233382A patent/JPS60161569A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62188979A (ja) * | 1985-11-12 | 1987-08-18 | マニア・エレクトロニツク・アウトマテイザチオン・エントビツクルンク・ウント・ゲレ−テバウ・ゲ−エムベ−ハ− | 高密度接続ポイントの回路基板試験装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE3461867D1 (en) | 1987-02-05 |
| JPH0519662B2 (en, 2012) | 1993-03-17 |
| ATE24614T1 (de) | 1987-01-15 |
| EP0142119A1 (de) | 1985-05-22 |
| CA1221470A (en) | 1987-05-05 |
| EP0142119B1 (de) | 1986-12-30 |
| DE3340179C1 (de) | 1985-05-09 |
| US4614386A (en) | 1986-09-30 |
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