JPH023559B2 - - Google Patents

Info

Publication number
JPH023559B2
JPH023559B2 JP57502196A JP50219682A JPH023559B2 JP H023559 B2 JPH023559 B2 JP H023559B2 JP 57502196 A JP57502196 A JP 57502196A JP 50219682 A JP50219682 A JP 50219682A JP H023559 B2 JPH023559 B2 JP H023559B2
Authority
JP
Japan
Prior art keywords
circuit
cards
card
motherboard
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP57502196A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59501031A (ja
Inventor
Piitaa Furanku Hyuuzu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TORANSUPASU Ltd
Original Assignee
TORANSUPASU Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TORANSUPASU Ltd filed Critical TORANSUPASU Ltd
Publication of JPS59501031A publication Critical patent/JPS59501031A/ja
Publication of JPH023559B2 publication Critical patent/JPH023559B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1438Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1439Back panel mother boards
    • H05K7/1444Complex or three-dimensional-arrangements; Stepped or dual mother boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)
JP57502196A 1982-06-07 1982-06-07 回路構造 Granted JPS59501031A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US1982/000776 WO1983004466A1 (en) 1982-06-07 1982-06-07 Tiered orthogonal related 3-d printed boards circuit

Publications (2)

Publication Number Publication Date
JPS59501031A JPS59501031A (ja) 1984-06-07
JPH023559B2 true JPH023559B2 (en, 2012) 1990-01-24

Family

ID=22168031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57502196A Granted JPS59501031A (ja) 1982-06-07 1982-06-07 回路構造

Country Status (5)

Country Link
JP (1) JPS59501031A (en, 2012)
CA (1) CA1193350A (en, 2012)
DE (1) DE3249507T1 (en, 2012)
GB (1) GB2133223B (en, 2012)
WO (1) WO1983004466A1 (en, 2012)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9100403D0 (en) * 1991-01-09 1991-02-20 Plessey Telecomm Orthogonal interconnection
US5335146A (en) * 1992-01-29 1994-08-02 International Business Machines Corporation High density packaging for device requiring large numbers of unique signals utilizing orthogonal plugging and zero insertion force connetors
US5352123A (en) * 1992-06-08 1994-10-04 Quickturn Systems, Incorporated Switching midplane and interconnection system for interconnecting large numbers of signals
FI991028A7 (fi) * 1999-05-05 2000-11-06 Nokia Corp Järjestely ja menetelmä ristikytkentäsolmun telineessä
GB2381953B (en) * 2001-11-08 2004-04-28 Sun Microsystems Inc Rack-mountable systems
GB2381955B (en) 2001-11-08 2005-06-22 Sun Microsystems Inc Electronic circuits

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2955236A (en) * 1960-10-04 Printed circuit package
US2799837A (en) * 1957-07-16 Connector strip and chassis for interconnecting
US2701346A (en) * 1953-11-05 1955-02-01 Hughes Aircraft Co Connector for circuit cards
US3206648A (en) * 1961-07-21 1965-09-14 Bunker Ramo Coordinate array structure
US3355722A (en) * 1965-04-20 1967-11-28 Ibm Compact semi-permanent information storage unit
US3660803A (en) * 1969-10-08 1972-05-02 Ncr Co Electrical connectors
US3668476A (en) * 1970-09-11 1972-06-06 Seeburg Corp Self-locking enclosure for electronic circuitry and method of assembling the same
DE2214678C3 (de) * 1972-03-25 1979-06-13 Stocko Metallwarenfabriken Henkels Und Sohn, Gmbh & Co, 5600 Wuppertal Steckkartenanordnung für elektronische Schaltungen
LU77607A1 (en, 2012) * 1976-04-02 1977-10-03
US4220382A (en) * 1978-12-15 1980-09-02 Amp Incorporated Bussing connector

Also Published As

Publication number Publication date
CA1193350A (en) 1985-09-10
GB2133223B (en) 1985-10-23
GB2133223A (en) 1984-07-18
GB8402267D0 (en) 1984-02-29
JPS59501031A (ja) 1984-06-07
WO1983004466A1 (en) 1983-12-22
DE3249507T1 (de) 1984-09-06

Similar Documents

Publication Publication Date Title
US4472765A (en) Circuit structure
US3838317A (en) Cross connect switch
US5887158A (en) Switching midplane and interconnecting system for interconnecting large numbers of signals
DE60201349T2 (de) Elektrische verbinderbaugruppe zur orthogonalen verbindung von leiterplatten
US4241381A (en) Bus bar assembly for circuit cards
DE60130485T2 (de) Vebindungsanordnung für eine rückwandverdrahtung einer elektronischen anlage
DE3853764T2 (de) Zwischenschaltungssystem für integrierte Halbleiterschaltungen.
US4876630A (en) Mid-plane board and assembly therefor
US7012196B2 (en) Apparatus, method and system for interfacing electronic circuits
EP0631678B1 (en) Low-neighborhood three-dimensional interconnect
US3715629A (en) Wiring device for interconnecting module circuit units
US20020181215A1 (en) Midplane circuit board assembly
DE2362939A1 (de) Raumsparende zusammenschaltungs- und zusammenbauanordnung fuer komplexe digitalsysteme und verfahren zu ihrer herstellung
DE2130637A1 (de) Elektronischer Baustein und aus mehreren solcher Bausteine gebildete Schaltungsanordnung
JPS62274692A (ja) プリント回路板
US2951184A (en) Printed wiring assembly
EP0261194A1 (en) INTERCONNECTION SYSTEMS FOR ELECTRICAL CIRCUITS.
DE69127874T2 (de) Signalweglenkung für aufeinandergestapelte Multiprozessormodule
JPH023559B2 (en, 2012)
US6274824B1 (en) Method of arranging signal and destination pads to provide multiple signal/destination connection combinations
JPS6115395A (ja) 半導体チツプ用モジユ−ル
US6382983B2 (en) Module mounting system
EP0493876B1 (en) Reducing circuit path crossovers in stacked multiprocessor board arrays
EP0276052A2 (en) Memory system assembly
DE2616975B2 (de) Anordnung von Nutzsignal- und Steuersignalleitungen zum kopplungsarmen Verdrahten von Halbleiterschaltern