DE69302400T2 - Testanordnung mit filmadaptor fuer leiterplatten - Google Patents
Testanordnung mit filmadaptor fuer leiterplattenInfo
- Publication number
- DE69302400T2 DE69302400T2 DE69302400T DE69302400T DE69302400T2 DE 69302400 T2 DE69302400 T2 DE 69302400T2 DE 69302400 T DE69302400 T DE 69302400T DE 69302400 T DE69302400 T DE 69302400T DE 69302400 T2 DE69302400 T2 DE 69302400T2
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- adapter
- tested
- test points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
- H01R11/18—End pieces terminating in a probe
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R31/00—Coupling parts supported only by co-operation with counterpart
- H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE69302400T DE69302400T2 (de) | 1992-11-06 | 1993-06-09 | Testanordnung mit filmadaptor fuer leiterplatten |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4237591A DE4237591A1 (de) | 1992-11-06 | 1992-11-06 | Leiterplatten-Prüfeinrichtung mit Folienadapter |
DE69302400T DE69302400T2 (de) | 1992-11-06 | 1993-06-09 | Testanordnung mit filmadaptor fuer leiterplatten |
PCT/EP1993/001468 WO1994011743A1 (en) | 1992-11-06 | 1993-06-09 | Printed circuit board testing device with foil adapter |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69302400D1 DE69302400D1 (de) | 1996-05-30 |
DE69302400T2 true DE69302400T2 (de) | 1996-08-14 |
Family
ID=6472318
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4237591A Withdrawn DE4237591A1 (de) | 1989-11-13 | 1992-11-06 | Leiterplatten-Prüfeinrichtung mit Folienadapter |
DE69302400T Expired - Fee Related DE69302400T2 (de) | 1992-11-06 | 1993-06-09 | Testanordnung mit filmadaptor fuer leiterplatten |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE4237591A Withdrawn DE4237591A1 (de) | 1989-11-13 | 1992-11-06 | Leiterplatten-Prüfeinrichtung mit Folienadapter |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0667962B1 (de) |
JP (1) | JP2755486B2 (de) |
KR (1) | KR950704689A (de) |
AT (1) | ATE137338T1 (de) |
CA (1) | CA2148106C (de) |
DE (2) | DE4237591A1 (de) |
WO (1) | WO1994011743A1 (de) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6246247B1 (en) | 1994-11-15 | 2001-06-12 | Formfactor, Inc. | Probe card assembly and kit, and methods of using same |
US6741085B1 (en) | 1993-11-16 | 2004-05-25 | Formfactor, Inc. | Contact carriers (tiles) for populating larger substrates with spring contacts |
US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
US6624648B2 (en) | 1993-11-16 | 2003-09-23 | Formfactor, Inc. | Probe card assembly |
DE9401114U1 (de) * | 1994-01-24 | 1995-02-16 | Siemens Ag | Anschlußmodul |
EP0792462B1 (de) * | 1994-11-15 | 2004-08-04 | Formfactor, Inc. | Testkarte und ihre anwendung |
DE19511565A1 (de) * | 1995-03-29 | 1996-10-02 | Atg Test Systems Gmbh | Prüfadapter |
EP0886894B1 (de) * | 1995-05-26 | 2005-09-28 | Formfactor, Inc. | Kontakträger zum bestücken von substraten mit federkontakten |
DE19535733C1 (de) * | 1995-09-26 | 1997-04-17 | Atg Test Systems Gmbh | Prüfadapter |
JP3099873B2 (ja) * | 1996-12-05 | 2000-10-16 | 日本電産リード株式会社 | プリント基板検査装置およびユニバーサル型プリント基板検査装置の使用方法 |
DE29616272U1 (de) * | 1996-09-18 | 1998-01-29 | Atg Test Systems Gmbh | Adapter zum Prüfen von elektrischen Leiterplatten |
DE19644725C1 (de) * | 1996-10-28 | 1998-04-02 | Atg Test Systems Gmbh | Vorrichtung und Verfahren zum Prüfen von Leiterplatten |
TW360790B (en) | 1996-10-28 | 1999-06-11 | Atg Test Systems Gmbh | Printed circuit board test apparatus and method |
US6690185B1 (en) | 1997-01-15 | 2004-02-10 | Formfactor, Inc. | Large contactor with multiple, aligned contactor units |
DE19703982B4 (de) * | 1997-02-03 | 2004-06-09 | Atg Test Systems Gmbh & Co.Kg | Verfahren zum Prüfen von Leiterplatten |
US6137297A (en) * | 1999-01-06 | 2000-10-24 | Vertest Systemsn Corp. | Electronic test probe interface assembly and method of manufacture |
US7215131B1 (en) | 1999-06-07 | 2007-05-08 | Formfactor, Inc. | Segmented contactor |
JP3865115B2 (ja) * | 1999-09-13 | 2007-01-10 | Hoya株式会社 | 多層配線基板及びその製造方法、並びに該多層配線基板を有するウエハ一括コンタクトボード |
DE10043728C2 (de) * | 2000-09-05 | 2003-12-04 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens |
DE10043726C2 (de) * | 2000-09-05 | 2003-12-04 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten mit einem Paralleltester und eine Vorrichtung zum Ausführen des Verfahrens |
US7759949B2 (en) | 2004-05-21 | 2010-07-20 | Microprobe, Inc. | Probes with self-cleaning blunt skates for contacting conductive pads |
US9476911B2 (en) | 2004-05-21 | 2016-10-25 | Microprobe, Inc. | Probes with high current carrying capability and laser machining methods |
US9097740B2 (en) | 2004-05-21 | 2015-08-04 | Formfactor, Inc. | Layered probes with core |
US8988091B2 (en) | 2004-05-21 | 2015-03-24 | Microprobe, Inc. | Multiple contact probes |
USRE43503E1 (en) | 2006-06-29 | 2012-07-10 | Microprobe, Inc. | Probe skates for electrical testing of convex pad topologies |
US7659739B2 (en) | 2006-09-14 | 2010-02-09 | Micro Porbe, Inc. | Knee probe having reduced thickness section for control of scrub motion |
US7649367B2 (en) | 2005-12-07 | 2010-01-19 | Microprobe, Inc. | Low profile probe having improved mechanical scrub and reduced contact inductance |
US7312617B2 (en) | 2006-03-20 | 2007-12-25 | Microprobe, Inc. | Space transformers employing wire bonds for interconnections with fine pitch contacts |
US8907689B2 (en) | 2006-10-11 | 2014-12-09 | Microprobe, Inc. | Probe retention arrangement |
US7514948B2 (en) | 2007-04-10 | 2009-04-07 | Microprobe, Inc. | Vertical probe array arranged to provide space transformation |
US8723546B2 (en) | 2007-10-19 | 2014-05-13 | Microprobe, Inc. | Vertical guided layered probe |
US8230593B2 (en) | 2008-05-29 | 2012-07-31 | Microprobe, Inc. | Probe bonding method having improved control of bonding material |
JP2013148464A (ja) * | 2012-01-19 | 2013-08-01 | Rato High Tech Corp | 回路基板の試験治具構造 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0144682B1 (de) * | 1983-11-07 | 1989-08-09 | Martin Maelzer | Adapter für ein Leiterplattenprüfgerät |
DK291184D0 (da) * | 1984-06-13 | 1984-06-13 | Boeegh Petersen Allan | Fremgangsmaade og indretning til test af kredsloebsplader |
DE3441578A1 (de) * | 1984-11-14 | 1986-05-22 | Riba-Prüftechnik GmbH, 7801 Schallstadt | Leiterplatten-pruefeinrichtung |
DE8809592U1 (de) * | 1987-08-26 | 1988-09-22 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De |
-
1992
- 1992-11-06 DE DE4237591A patent/DE4237591A1/de not_active Withdrawn
-
1993
- 1993-06-09 KR KR1019950701825A patent/KR950704689A/ko not_active Application Discontinuation
- 1993-06-09 DE DE69302400T patent/DE69302400T2/de not_active Expired - Fee Related
- 1993-06-09 AT AT93912939T patent/ATE137338T1/de not_active IP Right Cessation
- 1993-06-09 EP EP93912939A patent/EP0667962B1/de not_active Expired - Lifetime
- 1993-06-09 WO PCT/EP1993/001468 patent/WO1994011743A1/en active IP Right Grant
- 1993-06-09 JP JP6511626A patent/JP2755486B2/ja not_active Expired - Fee Related
- 1993-06-09 CA CA002148106A patent/CA2148106C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE69302400D1 (de) | 1996-05-30 |
JPH08504504A (ja) | 1996-05-14 |
CA2148106C (en) | 1999-06-22 |
JP2755486B2 (ja) | 1998-05-20 |
EP0667962B1 (de) | 1996-04-24 |
KR950704689A (ko) | 1995-11-20 |
WO1994011743A1 (en) | 1994-05-26 |
CA2148106A1 (en) | 1994-05-26 |
DE4237591A1 (de) | 1994-05-11 |
EP0667962A1 (de) | 1995-08-23 |
ATE137338T1 (de) | 1996-05-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8363 | Opposition against the patent | ||
8327 | Change in the person/name/address of the patent owner |
Owner name: MANIA TECHNOLOGIE BELGIUM N.V., GENT, BE |
|
8328 | Change in the person/name/address of the agent |
Representative=s name: RUSCHKE HARTMANN MADGWICK & SEIDE PATENT- UND RECH |
|
8339 | Ceased/non-payment of the annual fee |