ATE137338T1 - Testanordnung mit filmadaptor fuer leiterplatten - Google Patents

Testanordnung mit filmadaptor fuer leiterplatten

Info

Publication number
ATE137338T1
ATE137338T1 AT93912939T AT93912939T ATE137338T1 AT E137338 T1 ATE137338 T1 AT E137338T1 AT 93912939 T AT93912939 T AT 93912939T AT 93912939 T AT93912939 T AT 93912939T AT E137338 T1 ATE137338 T1 AT E137338T1
Authority
AT
Austria
Prior art keywords
circuit board
printed circuit
adapter
tested
test points
Prior art date
Application number
AT93912939T
Other languages
English (en)
Inventor
Paul Mang
Hubert Driller
Original Assignee
Mania Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=6472318&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE137338(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mania Gmbh filed Critical Mania Gmbh
Application granted granted Critical
Publication of ATE137338T1 publication Critical patent/ATE137338T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/18—End pieces terminating in a probe
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Pens And Brushes (AREA)
  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
AT93912939T 1992-11-06 1993-06-09 Testanordnung mit filmadaptor fuer leiterplatten ATE137338T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4237591A DE4237591A1 (de) 1992-11-06 1992-11-06 Leiterplatten-Prüfeinrichtung mit Folienadapter

Publications (1)

Publication Number Publication Date
ATE137338T1 true ATE137338T1 (de) 1996-05-15

Family

ID=6472318

Family Applications (1)

Application Number Title Priority Date Filing Date
AT93912939T ATE137338T1 (de) 1992-11-06 1993-06-09 Testanordnung mit filmadaptor fuer leiterplatten

Country Status (7)

Country Link
EP (1) EP0667962B1 (de)
JP (1) JP2755486B2 (de)
KR (1) KR950704689A (de)
AT (1) ATE137338T1 (de)
CA (1) CA2148106C (de)
DE (2) DE4237591A1 (de)
WO (1) WO1994011743A1 (de)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6624648B2 (en) 1993-11-16 2003-09-23 Formfactor, Inc. Probe card assembly
US6246247B1 (en) 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
WO1996038858A2 (en) * 1995-05-26 1996-12-05 Formfactor, Inc. Method and probe card for testing semiconductor devices
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6741085B1 (en) 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
DE9401114U1 (de) * 1994-01-24 1995-02-16 Siemens AG, 80333 München Anschlußmodul
EP0792462B1 (de) * 1994-11-15 2004-08-04 Formfactor, Inc. Testkarte und ihre anwendung
DE19511565A1 (de) * 1995-03-29 1996-10-02 Atg Test Systems Gmbh Prüfadapter
DE19535733C1 (de) * 1995-09-26 1997-04-17 Atg Test Systems Gmbh Prüfadapter
JP3099873B2 (ja) * 1996-12-05 2000-10-16 日本電産リード株式会社 プリント基板検査装置およびユニバーサル型プリント基板検査装置の使用方法
DE29616272U1 (de) * 1996-09-18 1998-01-29 atg test systems GmbH, 97877 Wertheim Adapter zum Prüfen von elektrischen Leiterplatten
US6154863A (en) * 1996-10-28 2000-11-28 Atg Test Systems Gmbh Apparatus and method for testing non-componented printed circuit boards
DE19644725C1 (de) * 1996-10-28 1998-04-02 Atg Test Systems Gmbh Vorrichtung und Verfahren zum Prüfen von Leiterplatten
US6690185B1 (en) 1997-01-15 2004-02-10 Formfactor, Inc. Large contactor with multiple, aligned contactor units
DE19703982B4 (de) * 1997-02-03 2004-06-09 Atg Test Systems Gmbh & Co.Kg Verfahren zum Prüfen von Leiterplatten
US6137297A (en) * 1999-01-06 2000-10-24 Vertest Systemsn Corp. Electronic test probe interface assembly and method of manufacture
US7215131B1 (en) 1999-06-07 2007-05-08 Formfactor, Inc. Segmented contactor
JP3865115B2 (ja) * 1999-09-13 2007-01-10 Ｈｏｙａ株式会社 多層配線基板及びその製造方法、並びに該多層配線基板を有するウエハ一括コンタクトボード
DE10043728C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens
DE10043726C2 (de) * 2000-09-05 2003-12-04 Atg Test Systems Gmbh Verfahren zum Prüfen von Leiterplatten mit einem Paralleltester und eine Vorrichtung zum Ausführen des Verfahrens
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
JP2013148464A (ja) * 2012-01-19 2013-08-01 Rato High Tech Corp 回路基板の試験治具構造

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3479341D1 (en) * 1983-11-07 1989-09-14 Martin Maelzer Adapter for a printed-circuit board testing device
DK291184D0 (da) * 1984-06-13 1984-06-13 Boeegh Petersen Allan Fremgangsmaade og indretning til test af kredsloebsplader
DE3441578A1 (de) * 1984-11-14 1986-05-22 Riba-Prüftechnik GmbH, 7801 Schallstadt Leiterplatten-pruefeinrichtung
DE8809592U1 (de) * 1987-08-26 1988-09-22 Siemens AG, 1000 Berlin und 8000 München Rangierleiterplatte für einen Leiterplattenprüfautomat

Also Published As

Publication number Publication date
JP2755486B2 (ja) 1998-05-20
DE4237591A1 (de) 1994-05-11
KR950704689A (ko) 1995-11-20
CA2148106A1 (en) 1994-05-26
EP0667962A1 (de) 1995-08-23
EP0667962B1 (de) 1996-04-24
WO1994011743A1 (en) 1994-05-26
DE69302400D1 (de) 1996-05-30
JPH08504504A (ja) 1996-05-14
CA2148106C (en) 1999-06-22
DE69302400T2 (de) 1996-08-14

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
EEIH Change in the person of patent owner
REN Ceased due to non-payment of the annual fee