JPS6014416A - 電子部品の製造方法 - Google Patents
電子部品の製造方法Info
- Publication number
- JPS6014416A JPS6014416A JP12106783A JP12106783A JPS6014416A JP S6014416 A JPS6014416 A JP S6014416A JP 12106783 A JP12106783 A JP 12106783A JP 12106783 A JP12106783 A JP 12106783A JP S6014416 A JPS6014416 A JP S6014416A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- silicone
- chips
- chip
- beaker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 11
- 239000003822 epoxy resin Substances 0.000 claims abstract description 3
- 239000005011 phenolic resin Substances 0.000 claims abstract description 3
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 3
- 229920003002 synthetic resin Polymers 0.000 claims description 6
- 239000000057 synthetic resin Substances 0.000 claims description 6
- 239000003989 dielectric material Substances 0.000 claims description 5
- 239000000696 magnetic material Substances 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 abstract description 15
- 238000005470 impregnation Methods 0.000 abstract description 11
- 238000007747 plating Methods 0.000 abstract description 5
- 239000008151 electrolyte solution Substances 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract 1
- 239000011259 mixed solution Substances 0.000 abstract 1
- 238000009713 electroplating Methods 0.000 description 8
- 239000011148 porous material Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003792 electrolyte Substances 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000859 α-Fe Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Capacitors (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12106783A JPS6014416A (ja) | 1983-07-05 | 1983-07-05 | 電子部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12106783A JPS6014416A (ja) | 1983-07-05 | 1983-07-05 | 電子部品の製造方法 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4245269A Division JP2641010B2 (ja) | 1992-09-14 | 1992-09-14 | チップ状電子部品 |
| JP4245272A Division JP2700978B2 (ja) | 1992-09-14 | 1992-09-14 | 電子部品及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6014416A true JPS6014416A (ja) | 1985-01-25 |
| JPH0155566B2 JPH0155566B2 (enrdf_load_stackoverflow) | 1989-11-27 |
Family
ID=14802019
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12106783A Granted JPS6014416A (ja) | 1983-07-05 | 1983-07-05 | 電子部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6014416A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0446513U (enrdf_load_stackoverflow) * | 1990-08-28 | 1992-04-21 | ||
| JPH04250607A (ja) * | 1991-01-25 | 1992-09-07 | Taiyo Yuden Co Ltd | チップ状電子部品 |
| WO2010026825A1 (ja) * | 2008-09-04 | 2010-03-11 | 株式会社村田製作所 | 積層コイル部品およびその製造方法 |
| JP2013045926A (ja) * | 2011-08-25 | 2013-03-04 | Taiyo Yuden Co Ltd | 電子部品の電極形成方法 |
| JP2017017366A (ja) * | 2016-10-27 | 2017-01-19 | 太陽誘電株式会社 | 電子部品 |
| CN111006456A (zh) * | 2019-11-20 | 2020-04-14 | 浙江省海洋水产研究所 | 一种水样悬浮物烘干盒 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109074956B (zh) | 2016-04-28 | 2020-07-10 | 株式会社村田制作所 | 陶瓷电子部件及陶瓷电子部件的制造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS543260A (en) * | 1977-06-08 | 1979-01-11 | Sony Corp | Method of coating electronic parts |
-
1983
- 1983-07-05 JP JP12106783A patent/JPS6014416A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS543260A (en) * | 1977-06-08 | 1979-01-11 | Sony Corp | Method of coating electronic parts |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0446513U (enrdf_load_stackoverflow) * | 1990-08-28 | 1992-04-21 | ||
| JPH04250607A (ja) * | 1991-01-25 | 1992-09-07 | Taiyo Yuden Co Ltd | チップ状電子部品 |
| WO2010026825A1 (ja) * | 2008-09-04 | 2010-03-11 | 株式会社村田製作所 | 積層コイル部品およびその製造方法 |
| JP5229323B2 (ja) * | 2008-09-04 | 2013-07-03 | 株式会社村田製作所 | 積層コイル部品およびその製造方法 |
| JP2013045926A (ja) * | 2011-08-25 | 2013-03-04 | Taiyo Yuden Co Ltd | 電子部品の電極形成方法 |
| JP2017017366A (ja) * | 2016-10-27 | 2017-01-19 | 太陽誘電株式会社 | 電子部品 |
| CN111006456A (zh) * | 2019-11-20 | 2020-04-14 | 浙江省海洋水产研究所 | 一种水样悬浮物烘干盒 |
| CN111006456B (zh) * | 2019-11-20 | 2021-11-23 | 浙江省海洋水产研究所 | 一种水样悬浮物烘干盒 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0155566B2 (enrdf_load_stackoverflow) | 1989-11-27 |
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