JPS60141874A - 無電解メツキ方法 - Google Patents

無電解メツキ方法

Info

Publication number
JPS60141874A
JPS60141874A JP25119683A JP25119683A JPS60141874A JP S60141874 A JPS60141874 A JP S60141874A JP 25119683 A JP25119683 A JP 25119683A JP 25119683 A JP25119683 A JP 25119683A JP S60141874 A JPS60141874 A JP S60141874A
Authority
JP
Japan
Prior art keywords
electroless plating
transparent conductive
substrate
plating
conductive film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP25119683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0585637B2 (enExample
Inventor
Yoshihiro Ono
大野　好弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KK filed Critical Seiko Epson Corp
Priority to JP25119683A priority Critical patent/JPS60141874A/ja
Publication of JPS60141874A publication Critical patent/JPS60141874A/ja
Publication of JPH0585637B2 publication Critical patent/JPH0585637B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP25119683A 1983-12-28 1983-12-28 無電解メツキ方法 Granted JPS60141874A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25119683A JPS60141874A (ja) 1983-12-28 1983-12-28 無電解メツキ方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25119683A JPS60141874A (ja) 1983-12-28 1983-12-28 無電解メツキ方法

Publications (2)

Publication Number Publication Date
JPS60141874A true JPS60141874A (ja) 1985-07-26
JPH0585637B2 JPH0585637B2 (enExample) 1993-12-08

Family

ID=17219108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25119683A Granted JPS60141874A (ja) 1983-12-28 1983-12-28 無電解メツキ方法

Country Status (1)

Country Link
JP (1) JPS60141874A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0196384A (ja) * 1987-10-08 1989-04-14 Seiko Instr & Electron Ltd 透明導電膜パターン上へのめっき方法
JP2010155040A (ja) * 2009-01-02 2010-07-15 Suenori Yamashita ゴルフのパッティング練習具
JP2014031583A (ja) * 2006-11-01 2014-02-20 Bar-Ilan Univ 集電体及び導電性配線としてのニッケル−コバルト合金、並びに透明導電性酸化物上へのこれらの堆積

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949013A (enExample) * 1972-05-25 1974-05-13
JPS5125226A (ja) * 1974-08-25 1976-03-01 Nippon Soken Shototsukenchisochi
JPS5794563A (en) * 1980-12-02 1982-06-12 Seiko Epson Corp Electroless plating method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4949013A (enExample) * 1972-05-25 1974-05-13
JPS5125226A (ja) * 1974-08-25 1976-03-01 Nippon Soken Shototsukenchisochi
JPS5794563A (en) * 1980-12-02 1982-06-12 Seiko Epson Corp Electroless plating method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0196384A (ja) * 1987-10-08 1989-04-14 Seiko Instr & Electron Ltd 透明導電膜パターン上へのめっき方法
JP2014031583A (ja) * 2006-11-01 2014-02-20 Bar-Ilan Univ 集電体及び導電性配線としてのニッケル−コバルト合金、並びに透明導電性酸化物上へのこれらの堆積
JP2010155040A (ja) * 2009-01-02 2010-07-15 Suenori Yamashita ゴルフのパッティング練習具

Also Published As

Publication number Publication date
JPH0585637B2 (enExample) 1993-12-08

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term