JPS60141873A - 化学メツキ用接着剤組成物 - Google Patents
化学メツキ用接着剤組成物Info
- Publication number
- JPS60141873A JPS60141873A JP58249263A JP24926383A JPS60141873A JP S60141873 A JPS60141873 A JP S60141873A JP 58249263 A JP58249263 A JP 58249263A JP 24926383 A JP24926383 A JP 24926383A JP S60141873 A JPS60141873 A JP S60141873A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- nbr
- chemical plating
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 36
- 239000000126 substance Substances 0.000 title claims abstract description 34
- 239000000203 mixture Substances 0.000 title claims abstract description 15
- 239000000853 adhesive Substances 0.000 title claims description 22
- 229920005989 resin Polymers 0.000 claims abstract description 42
- 239000011347 resin Substances 0.000 claims abstract description 42
- 239000003822 epoxy resin Substances 0.000 claims abstract description 31
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 31
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 28
- 239000007787 solid Substances 0.000 claims abstract description 18
- 229920001971 elastomer Polymers 0.000 claims abstract description 10
- 125000000524 functional group Chemical group 0.000 claims abstract description 9
- 239000005060 rubber Substances 0.000 claims abstract description 8
- 239000002904 solvent Substances 0.000 claims abstract description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 claims abstract description 5
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 4
- 239000003607 modifier Substances 0.000 claims abstract description 4
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 9
- 230000000379 polymerizing effect Effects 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 238000013329 compounding Methods 0.000 abstract description 5
- 239000003054 catalyst Substances 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000004848 polyfunctional curative Substances 0.000 abstract description 2
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 abstract 1
- 238000010137 moulding (plastic) Methods 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 17
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 239000012790 adhesive layer Substances 0.000 description 10
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 238000002156 mixing Methods 0.000 description 7
- 238000007788 roughening Methods 0.000 description 7
- 239000000654 additive Substances 0.000 description 5
- 230000000996 additive effect Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000006011 modification reaction Methods 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000006864 oxidative decomposition reaction Methods 0.000 description 3
- 239000002685 polymerization catalyst Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- -1 2-ethyl Chemical group 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000806 elastomer Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 229920003987 resole Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- JZUFKLXOESDKRF-UHFFFAOYSA-N Chlorothiazide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC2=C1NCNS2(=O)=O JZUFKLXOESDKRF-UHFFFAOYSA-N 0.000 description 1
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical group CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 238000001493 electron microscopy Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 230000003631 expected effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C23C18/1641—Organic substrates, e.g. resin, plastic
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Chemically Coating (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58249263A JPS60141873A (ja) | 1983-12-27 | 1983-12-27 | 化学メツキ用接着剤組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58249263A JPS60141873A (ja) | 1983-12-27 | 1983-12-27 | 化学メツキ用接着剤組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60141873A true JPS60141873A (ja) | 1985-07-26 |
| JPH0314871B2 JPH0314871B2 (enrdf_load_stackoverflow) | 1991-02-27 |
Family
ID=17190357
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58249263A Granted JPS60141873A (ja) | 1983-12-27 | 1983-12-27 | 化学メツキ用接着剤組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60141873A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226096A (ja) * | 1988-07-15 | 1990-01-29 | Yokohama Rubber Co Ltd:The | アディティブ法配線板の製造方法 |
| JPH06299133A (ja) * | 1993-04-14 | 1994-10-25 | Tomoegawa Paper Co Ltd | エポキシ樹脂接着組成物 |
| US5807910A (en) * | 1997-06-23 | 1998-09-15 | Industrial Technology Research Institute | Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive |
| WO2022163547A1 (ja) * | 2021-01-29 | 2022-08-04 | 日東電工株式会社 | 表面改質シート、積層体、表面改質部材、塗装物、表面改質部材の製造方法、及び塗装物の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122823A (en) * | 1980-02-29 | 1981-09-26 | Nitto Electric Ind Co Ltd | Flexible epoxy resin powder composition |
-
1983
- 1983-12-27 JP JP58249263A patent/JPS60141873A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56122823A (en) * | 1980-02-29 | 1981-09-26 | Nitto Electric Ind Co Ltd | Flexible epoxy resin powder composition |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0226096A (ja) * | 1988-07-15 | 1990-01-29 | Yokohama Rubber Co Ltd:The | アディティブ法配線板の製造方法 |
| JPH06299133A (ja) * | 1993-04-14 | 1994-10-25 | Tomoegawa Paper Co Ltd | エポキシ樹脂接着組成物 |
| US5807910A (en) * | 1997-06-23 | 1998-09-15 | Industrial Technology Research Institute | Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive |
| WO2022163547A1 (ja) * | 2021-01-29 | 2022-08-04 | 日東電工株式会社 | 表面改質シート、積層体、表面改質部材、塗装物、表面改質部材の製造方法、及び塗装物の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0314871B2 (enrdf_load_stackoverflow) | 1991-02-27 |
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