JPH0314871B2 - - Google Patents

Info

Publication number
JPH0314871B2
JPH0314871B2 JP58249263A JP24926383A JPH0314871B2 JP H0314871 B2 JPH0314871 B2 JP H0314871B2 JP 58249263 A JP58249263 A JP 58249263A JP 24926383 A JP24926383 A JP 24926383A JP H0314871 B2 JPH0314871 B2 JP H0314871B2
Authority
JP
Japan
Prior art keywords
resin
epoxy resin
chemical plating
weight
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58249263A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60141873A (ja
Inventor
Hitoshi Doi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Risho Kogyo Co Ltd
Original Assignee
Risho Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Risho Kogyo Co Ltd filed Critical Risho Kogyo Co Ltd
Priority to JP58249263A priority Critical patent/JPS60141873A/ja
Publication of JPS60141873A publication Critical patent/JPS60141873A/ja
Publication of JPH0314871B2 publication Critical patent/JPH0314871B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP58249263A 1983-12-27 1983-12-27 化学メツキ用接着剤組成物 Granted JPS60141873A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58249263A JPS60141873A (ja) 1983-12-27 1983-12-27 化学メツキ用接着剤組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58249263A JPS60141873A (ja) 1983-12-27 1983-12-27 化学メツキ用接着剤組成物

Publications (2)

Publication Number Publication Date
JPS60141873A JPS60141873A (ja) 1985-07-26
JPH0314871B2 true JPH0314871B2 (enrdf_load_stackoverflow) 1991-02-27

Family

ID=17190357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58249263A Granted JPS60141873A (ja) 1983-12-27 1983-12-27 化学メツキ用接着剤組成物

Country Status (1)

Country Link
JP (1) JPS60141873A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0728125B2 (ja) * 1988-07-15 1995-03-29 横浜ゴム株式会社 アディティブ法配線板の製造方法
JP2649473B2 (ja) * 1993-04-14 1997-09-03 株式会社巴川製紙所 エポキシ樹脂接着組成物
US5807910A (en) * 1997-06-23 1998-09-15 Industrial Technology Research Institute Preolymerizing epoxy resin, functionalized rubber with filler to form adhesive
US20240026100A1 (en) * 2021-01-29 2024-01-25 Nitto Denko Corporation Surface-modifying sheet, laminate, surface-modified member, coated article, method for producing surface-modified member, and method for producing coated article

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5825391B2 (ja) * 1980-02-29 1983-05-27 日東電工株式会社 可撓性エポキシ樹脂粉末組成物

Also Published As

Publication number Publication date
JPS60141873A (ja) 1985-07-26

Similar Documents

Publication Publication Date Title
JP4911795B2 (ja) 積層体の製造方法
EP1960192B1 (en) Laminates for high speed and high frequency printed circuit boards
US5707729A (en) Adhesive for copper foils and adhesive-backed copper foil
JPH0314871B2 (enrdf_load_stackoverflow)
JP3870811B2 (ja) プリント配線板用リン変性エポキシ樹脂組成物及びその製造方法
JP3396578B2 (ja) プリプレグ及びそれを用いた銅張積層板
JP4214573B2 (ja) 積層板の製造方法
KR20170005506A (ko) 동박 적층판용 접착제
JP2002064275A (ja) 多層プリント配線板用絶縁樹脂フィルム
JP2001102758A (ja) プリント配線板とそのプリント配線板に用いる絶縁樹脂シート並びにその絶縁樹脂シートの製造方法
JP2650158B2 (ja) フレキシブル印刷回路基板用接着剤組成物
JP3906547B2 (ja) 銅張り積層板、多層積層板
JP3119578B2 (ja) 印刷回路用積層板の製造方法
JPS6128545A (ja) 樹脂組成物及び積層板
KR101102218B1 (ko) 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판
JPS6176579A (ja) 耐燃性接着剤組成物
JP3536937B2 (ja) アディティブ法プリント配線板用接着剤及びその接着剤を用いた配線板の製造法
KR101556657B1 (ko) 수지 조성물, 이를 이용한 프리프레그 및 프린트 배선판
JP2000133900A (ja) 印刷配線板用プリプレグ
JPH104270A (ja) 多層プリント配線板の製造方法
JPH0251470B2 (enrdf_load_stackoverflow)
JPH06179800A (ja) エポキシ樹脂硬化剤及びエポキシ樹脂組成物
JPH1135909A (ja) 無電解めっき用接着剤、無電解めっき用フィルム状接着剤及び多層プリント配線板の製造方法
JPH104268A (ja) 多層プリント配線板の製造方法
JPH0149379B2 (enrdf_load_stackoverflow)