JPS60137884A - セラミツク多層配線回路基板の製造法 - Google Patents

セラミツク多層配線回路基板の製造法

Info

Publication number
JPS60137884A
JPS60137884A JP24402283A JP24402283A JPS60137884A JP S60137884 A JPS60137884 A JP S60137884A JP 24402283 A JP24402283 A JP 24402283A JP 24402283 A JP24402283 A JP 24402283A JP S60137884 A JPS60137884 A JP S60137884A
Authority
JP
Japan
Prior art keywords
firing
parts
ceramic
wiring circuit
glass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24402283A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0470124B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
信之 牛房
荻原　覚
永山　更成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24402283A priority Critical patent/JPS60137884A/ja
Publication of JPS60137884A publication Critical patent/JPS60137884A/ja
Publication of JPH0470124B2 publication Critical patent/JPH0470124B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP24402283A 1983-12-26 1983-12-26 セラミツク多層配線回路基板の製造法 Granted JPS60137884A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24402283A JPS60137884A (ja) 1983-12-26 1983-12-26 セラミツク多層配線回路基板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24402283A JPS60137884A (ja) 1983-12-26 1983-12-26 セラミツク多層配線回路基板の製造法

Publications (2)

Publication Number Publication Date
JPS60137884A true JPS60137884A (ja) 1985-07-22
JPH0470124B2 JPH0470124B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-11-10

Family

ID=17112540

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24402283A Granted JPS60137884A (ja) 1983-12-26 1983-12-26 セラミツク多層配線回路基板の製造法

Country Status (1)

Country Link
JP (1) JPS60137884A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247196A (ja) * 1985-08-26 1987-02-28 松下電器産業株式会社 セラミツク多層基板
JPH01104729U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-12-28 1989-07-14
US5669136A (en) * 1994-06-24 1997-09-23 International Business Machines Corporation Method of making high input/output density MLC flat pack

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5724526A (en) * 1980-07-22 1982-02-09 Tdk Electronics Co Ltd Method of producing laminated porcelain condenser
JPS5732657A (en) * 1980-07-14 1982-02-22 Ibm Method of rpoducing glass ceramic substrate
JPS57135777A (en) * 1981-02-13 1982-08-21 Hitachi Ltd Ceramic board sintering method
JPS57190400A (en) * 1981-05-20 1982-11-22 Nippon Electric Co Method of producing ceramic substrate
JPS58151099A (ja) * 1982-03-03 1983-09-08 日立化成工業株式会社 セラミツク多層配線板の製造法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5732657A (en) * 1980-07-14 1982-02-22 Ibm Method of rpoducing glass ceramic substrate
JPS5724526A (en) * 1980-07-22 1982-02-09 Tdk Electronics Co Ltd Method of producing laminated porcelain condenser
JPS57135777A (en) * 1981-02-13 1982-08-21 Hitachi Ltd Ceramic board sintering method
JPS57190400A (en) * 1981-05-20 1982-11-22 Nippon Electric Co Method of producing ceramic substrate
JPS58151099A (ja) * 1982-03-03 1983-09-08 日立化成工業株式会社 セラミツク多層配線板の製造法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6247196A (ja) * 1985-08-26 1987-02-28 松下電器産業株式会社 セラミツク多層基板
JPH01104729U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1987-12-28 1989-07-14
US5669136A (en) * 1994-06-24 1997-09-23 International Business Machines Corporation Method of making high input/output density MLC flat pack

Also Published As

Publication number Publication date
JPH0470124B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-11-10

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term