JPS60136328A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60136328A
JPS60136328A JP24381783A JP24381783A JPS60136328A JP S60136328 A JPS60136328 A JP S60136328A JP 24381783 A JP24381783 A JP 24381783A JP 24381783 A JP24381783 A JP 24381783A JP S60136328 A JPS60136328 A JP S60136328A
Authority
JP
Japan
Prior art keywords
shape
grooves
groove
depression
polysilicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24381783A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0562464B2 (enrdf_load_stackoverflow
Inventor
Motonori Kawaji
河路　幹規
Toshihiko Takakura
俊彦 高倉
Akihisa Uchida
明久 内田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24381783A priority Critical patent/JPS60136328A/ja
Publication of JPS60136328A publication Critical patent/JPS60136328A/ja
Publication of JPH0562464B2 publication Critical patent/JPH0562464B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Element Separation (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP24381783A 1983-12-26 1983-12-26 半導体装置 Granted JPS60136328A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24381783A JPS60136328A (ja) 1983-12-26 1983-12-26 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24381783A JPS60136328A (ja) 1983-12-26 1983-12-26 半導体装置

Publications (2)

Publication Number Publication Date
JPS60136328A true JPS60136328A (ja) 1985-07-19
JPH0562464B2 JPH0562464B2 (enrdf_load_stackoverflow) 1993-09-08

Family

ID=17109365

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24381783A Granted JPS60136328A (ja) 1983-12-26 1983-12-26 半導体装置

Country Status (1)

Country Link
JP (1) JPS60136328A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187944A (ja) * 1987-11-23 1989-07-27 Texas Instr Inc <Ti> 半導体材料に隔離構造を形成する方法
US5094973A (en) * 1987-11-23 1992-03-10 Texas Instrument Incorporated Trench pillar for wafer processing
US5448102A (en) * 1993-06-24 1995-09-05 Harris Corporation Trench isolation stress relief

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384692A (en) * 1976-12-29 1978-07-26 Fujitsu Ltd Semiconductor device
JPS5643171U (enrdf_load_stackoverflow) * 1979-09-10 1981-04-20
JPS58168256A (ja) * 1982-03-30 1983-10-04 Fujitsu Ltd 半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5384692A (en) * 1976-12-29 1978-07-26 Fujitsu Ltd Semiconductor device
JPS5643171U (enrdf_load_stackoverflow) * 1979-09-10 1981-04-20
JPS58168256A (ja) * 1982-03-30 1983-10-04 Fujitsu Ltd 半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187944A (ja) * 1987-11-23 1989-07-27 Texas Instr Inc <Ti> 半導体材料に隔離構造を形成する方法
US5094973A (en) * 1987-11-23 1992-03-10 Texas Instrument Incorporated Trench pillar for wafer processing
US5448102A (en) * 1993-06-24 1995-09-05 Harris Corporation Trench isolation stress relief
US5683075A (en) * 1993-06-24 1997-11-04 Harris Corporation Trench isolation stress relief

Also Published As

Publication number Publication date
JPH0562464B2 (enrdf_load_stackoverflow) 1993-09-08

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