JPS60134429A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60134429A
JPS60134429A JP58242029A JP24202983A JPS60134429A JP S60134429 A JPS60134429 A JP S60134429A JP 58242029 A JP58242029 A JP 58242029A JP 24202983 A JP24202983 A JP 24202983A JP S60134429 A JPS60134429 A JP S60134429A
Authority
JP
Japan
Prior art keywords
bonding
wire
junction
semiconductor device
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58242029A
Other languages
English (en)
Japanese (ja)
Other versions
JPH032345B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Tate
宏 舘
Ken Okuya
謙 奥谷
Masayuki Shirai
優之 白井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Ltd
Hitachi Microcomputer Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Microcomputer Engineering Ltd filed Critical Hitachi Ltd
Priority to JP58242029A priority Critical patent/JPS60134429A/ja
Publication of JPS60134429A publication Critical patent/JPS60134429A/ja
Publication of JPH032345B2 publication Critical patent/JPH032345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H01L2224/0605—Shape
    • H01L2224/06051—Bonding areas having different shapes
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    • H01L2224/061—Disposition
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    • H01L2224/0615—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry
    • H01L2224/06153—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry with a staggered arrangement, e.g. depopulated array
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    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L2224/06154—Mirror array, i.e. array having only a reflection symmetry, i.e. bilateral symmetry covering only portions of the surface to be connected
    • H01L2224/06155—Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49431—Connecting portions the connecting portions being staggered on the semiconductor or solid-state body
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
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    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
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    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/15165—Monolayer substrate
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58242029A 1983-12-23 1983-12-23 半導体装置 Granted JPS60134429A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58242029A JPS60134429A (ja) 1983-12-23 1983-12-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58242029A JPS60134429A (ja) 1983-12-23 1983-12-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS60134429A true JPS60134429A (ja) 1985-07-17
JPH032345B2 JPH032345B2 (enrdf_load_stackoverflow) 1991-01-14

Family

ID=17083206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58242029A Granted JPS60134429A (ja) 1983-12-23 1983-12-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS60134429A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631742A1 (fr) * 1988-05-23 1989-11-24 United Technologies Corp Module de circuit integre a soudure amelioree des pattes
JPH02275649A (ja) * 1989-04-17 1990-11-09 Nec Corp 半導体集積回路
JPH02277250A (ja) * 1989-04-18 1990-11-13 Nec Corp 半導体装置
JP2003060122A (ja) * 2001-08-21 2003-02-28 Texas Instr Japan Ltd 半導体チップ搭載用基板及びそれを用いた半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2631742A1 (fr) * 1988-05-23 1989-11-24 United Technologies Corp Module de circuit integre a soudure amelioree des pattes
JPH02275649A (ja) * 1989-04-17 1990-11-09 Nec Corp 半導体集積回路
JPH02277250A (ja) * 1989-04-18 1990-11-13 Nec Corp 半導体装置
JP2003060122A (ja) * 2001-08-21 2003-02-28 Texas Instr Japan Ltd 半導体チップ搭載用基板及びそれを用いた半導体装置

Also Published As

Publication number Publication date
JPH032345B2 (enrdf_load_stackoverflow) 1991-01-14

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