JPS60128647A - 可撓性フィルム導体リードおよびこれを用いた太陽電池装置ならびにその製造方法 - Google Patents

可撓性フィルム導体リードおよびこれを用いた太陽電池装置ならびにその製造方法

Info

Publication number
JPS60128647A
JPS60128647A JP58237235A JP23723583A JPS60128647A JP S60128647 A JPS60128647 A JP S60128647A JP 58237235 A JP58237235 A JP 58237235A JP 23723583 A JP23723583 A JP 23723583A JP S60128647 A JPS60128647 A JP S60128647A
Authority
JP
Japan
Prior art keywords
conductor lead
flexible film
solar cell
conductor
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58237235A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0471346B2 (enExample
Inventor
Tadao Kushima
九嶋　忠雄
Tasao Soga
太佐男 曽我
Takaya Suzuki
誉也 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58237235A priority Critical patent/JPS60128647A/ja
Publication of JPS60128647A publication Critical patent/JPS60128647A/ja
Publication of JPH0471346B2 publication Critical patent/JPH0471346B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
    • H10F19/90—Structures for connecting between photovoltaic cells, e.g. interconnections or insulating spacers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/37155—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
    • H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
    • H01L2224/37001—Core members of the connector
    • H01L2224/37099—Material
    • H01L2224/371—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/37138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/3716—Iron [Fe] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
    • H01L2224/848—Bonding techniques
    • H01L2224/8485—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Wire Bonding (AREA)
  • Photovoltaic Devices (AREA)
JP58237235A 1983-12-16 1983-12-16 可撓性フィルム導体リードおよびこれを用いた太陽電池装置ならびにその製造方法 Granted JPS60128647A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58237235A JPS60128647A (ja) 1983-12-16 1983-12-16 可撓性フィルム導体リードおよびこれを用いた太陽電池装置ならびにその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58237235A JPS60128647A (ja) 1983-12-16 1983-12-16 可撓性フィルム導体リードおよびこれを用いた太陽電池装置ならびにその製造方法

Publications (2)

Publication Number Publication Date
JPS60128647A true JPS60128647A (ja) 1985-07-09
JPH0471346B2 JPH0471346B2 (enExample) 1992-11-13

Family

ID=17012385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58237235A Granted JPS60128647A (ja) 1983-12-16 1983-12-16 可撓性フィルム導体リードおよびこれを用いた太陽電池装置ならびにその製造方法

Country Status (1)

Country Link
JP (1) JPS60128647A (enExample)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584940A (en) * 1993-09-28 1996-12-17 Fuji Electric Co., Ltd. Flexible photoelectric conversion module
JP2000022188A (ja) * 1998-07-03 2000-01-21 Npc:Kk タブリードのはんだ付け装置
JP2004273914A (ja) * 2003-03-11 2004-09-30 Mekku:Kk 太陽電池セル製造装置
JP2004336043A (ja) * 2003-05-02 2004-11-25 Orthodyne Electronics Corp リボンボンディング
EP1868250A3 (en) * 2006-06-13 2010-05-12 Miasole Photovoltaic module with integrated current collection and interconnection
JP2014519713A (ja) * 2011-06-14 2014-08-14 インスティトュート フィュル ゾラールエネルギーフォルシュング ゲーエムベーハー 複数の太陽電池を電気的に接続する方法および光発電モジュール
US10026859B2 (en) 2010-10-04 2018-07-17 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Small gauge wire solar cell interconnect
US10056521B2 (en) 2008-03-20 2018-08-21 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Wire network for interconnecting photovoltaic cells
JP2021521633A (ja) * 2018-04-06 2021-08-26 サンパワー コーポレイション 太陽電池ストリングのレーザー支援メタライゼーションプロセス

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832946A (enExample) * 1971-08-31 1973-05-04
JPS57208193A (en) * 1981-06-18 1982-12-21 Tokyo Shibaura Electric Co Method of soldering printed circuit board
JPS5841942A (ja) * 1981-09-04 1983-03-11 セント・ラレン・サベツト・ナ・ナウクノ−テクニチエスキテ・サユツイ 横糸置き換え装置
JPS58134481A (ja) * 1982-02-05 1983-08-10 Hitachi Ltd 電気部品の電極接続部材および接続方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4832946A (enExample) * 1971-08-31 1973-05-04
JPS57208193A (en) * 1981-06-18 1982-12-21 Tokyo Shibaura Electric Co Method of soldering printed circuit board
JPS5841942A (ja) * 1981-09-04 1983-03-11 セント・ラレン・サベツト・ナ・ナウクノ−テクニチエスキテ・サユツイ 横糸置き換え装置
JPS58134481A (ja) * 1982-02-05 1983-08-10 Hitachi Ltd 電気部品の電極接続部材および接続方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5584940A (en) * 1993-09-28 1996-12-17 Fuji Electric Co., Ltd. Flexible photoelectric conversion module
JP2000022188A (ja) * 1998-07-03 2000-01-21 Npc:Kk タブリードのはんだ付け装置
JP2004273914A (ja) * 2003-03-11 2004-09-30 Mekku:Kk 太陽電池セル製造装置
JP2004336043A (ja) * 2003-05-02 2004-11-25 Orthodyne Electronics Corp リボンボンディング
EP1868250A3 (en) * 2006-06-13 2010-05-12 Miasole Photovoltaic module with integrated current collection and interconnection
US10056521B2 (en) 2008-03-20 2018-08-21 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Wire network for interconnecting photovoltaic cells
US10026859B2 (en) 2010-10-04 2018-07-17 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Small gauge wire solar cell interconnect
JP2014519713A (ja) * 2011-06-14 2014-08-14 インスティトュート フィュル ゾラールエネルギーフォルシュング ゲーエムベーハー 複数の太陽電池を電気的に接続する方法および光発電モジュール
JP2021521633A (ja) * 2018-04-06 2021-08-26 サンパワー コーポレイション 太陽電池ストリングのレーザー支援メタライゼーションプロセス

Also Published As

Publication number Publication date
JPH0471346B2 (enExample) 1992-11-13

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