JPS60120544A - 半導体装置用リ−ドフレ−ム - Google Patents

半導体装置用リ−ドフレ−ム

Info

Publication number
JPS60120544A
JPS60120544A JP58228894A JP22889483A JPS60120544A JP S60120544 A JPS60120544 A JP S60120544A JP 58228894 A JP58228894 A JP 58228894A JP 22889483 A JP22889483 A JP 22889483A JP S60120544 A JPS60120544 A JP S60120544A
Authority
JP
Japan
Prior art keywords
lead frame
alloy foil
alloy
foil
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58228894A
Other languages
English (en)
Japanese (ja)
Other versions
JPS643062B2 (cs
Inventor
Nobuo Ogasa
小笠　伸夫
Kazuo Kanehiro
金廣　一雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58228894A priority Critical patent/JPS60120544A/ja
Publication of JPS60120544A publication Critical patent/JPS60120544A/ja
Publication of JPS643062B2 publication Critical patent/JPS643062B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP58228894A 1983-12-02 1983-12-02 半導体装置用リ−ドフレ−ム Granted JPS60120544A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58228894A JPS60120544A (ja) 1983-12-02 1983-12-02 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58228894A JPS60120544A (ja) 1983-12-02 1983-12-02 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS60120544A true JPS60120544A (ja) 1985-06-28
JPS643062B2 JPS643062B2 (cs) 1989-01-19

Family

ID=16883518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58228894A Granted JPS60120544A (ja) 1983-12-02 1983-12-02 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS60120544A (cs)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121265A (en) * 1981-01-20 1982-07-28 Daido Steel Co Ltd Pressure welding method of strip for lead frame
JPS57136355A (en) * 1982-01-14 1982-08-23 Toshiba Corp Lead frame for semiconductor device
JPS5946053A (ja) * 1982-09-08 1984-03-15 Hitachi Cable Ltd アルミニウム被覆リ−ドフレ−ムの製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57121265A (en) * 1981-01-20 1982-07-28 Daido Steel Co Ltd Pressure welding method of strip for lead frame
JPS57136355A (en) * 1982-01-14 1982-08-23 Toshiba Corp Lead frame for semiconductor device
JPS5946053A (ja) * 1982-09-08 1984-03-15 Hitachi Cable Ltd アルミニウム被覆リ−ドフレ−ムの製造方法

Also Published As

Publication number Publication date
JPS643062B2 (cs) 1989-01-19

Similar Documents

Publication Publication Date Title
JPH07503103A (ja) パッケージ
US5650661A (en) Protective coating combination for lead frames
JPH09232493A (ja) リードフレーム
JPS60120544A (ja) 半導体装置用リ−ドフレ−ム
JPH1022434A (ja) 集積回路用リードフレーム及びその製造方法
JPH05109958A (ja) リードフレーム
JPH10251860A (ja) 金／ニッケル／ニッケル３層めっき銅合金電子部品およびその製造方法
JP3444981B2 (ja) リードフレーム及びリードフレーム用素材
JP3757539B2 (ja) 半導体装置用ステム
US4482611A (en) Electronic parts
JPS61279696A (ja) 耐食性のすぐれたタ−ンシ−トの製造方法
JPS60161649A (ja) リ−ドフレ−ム
JPS59165315A (ja) リ−ドスイツチ
JPS6353287A (ja) Ａｇ被覆導体
JPH01223754A (ja) ワイヤボンディング用リードフレームの製造方法
JPS6239231A (ja) 装飾品用複合素材及びその製造方法
JPS63304654A (ja) リ−ドフレ−ム
JPS60125658A (ja) 眼鏡フレ−ム用複合素材
JPS6135419A (ja) 眼鏡フレ−ム用複合素材
JPS61233533A (ja) 装飾品用複合素材
JPS62141747A (ja) 半導体リ−ドフレ−ム
JPS61272955A (ja) 電子機器用Ａｌ系条材
JPS63255377A (ja) 透明導電膜パタ−ン上の金属電極層
JPS6135418A (ja) 眼鏡フレ−ム用複合素材
JPH02109357A (ja) プラスチックモールド用クラッド板の製造方法