JPS60114577A - 化学処理装置 - Google Patents

化学処理装置

Info

Publication number
JPS60114577A
JPS60114577A JP58222532A JP22253283A JPS60114577A JP S60114577 A JPS60114577 A JP S60114577A JP 58222532 A JP58222532 A JP 58222532A JP 22253283 A JP22253283 A JP 22253283A JP S60114577 A JPS60114577 A JP S60114577A
Authority
JP
Japan
Prior art keywords
electrode
vacuum container
load
plasma
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58222532A
Other languages
English (en)
Japanese (ja)
Other versions
JPH058271B2 (enrdf_load_stackoverflow
Inventor
Yoichi Onishi
陽一 大西
Hirozo Shima
島　博三
Junichi Nozaki
野崎　順一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58222532A priority Critical patent/JPS60114577A/ja
Publication of JPS60114577A publication Critical patent/JPS60114577A/ja
Publication of JPH058271B2 publication Critical patent/JPH058271B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096—Flat-bed apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
JP58222532A 1983-11-26 1983-11-26 化学処理装置 Granted JPS60114577A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58222532A JPS60114577A (ja) 1983-11-26 1983-11-26 化学処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58222532A JPS60114577A (ja) 1983-11-26 1983-11-26 化学処理装置

Publications (2)

Publication Number Publication Date
JPS60114577A true JPS60114577A (ja) 1985-06-21
JPH058271B2 JPH058271B2 (enrdf_load_stackoverflow) 1993-02-01

Family

ID=16783904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58222532A Granted JPS60114577A (ja) 1983-11-26 1983-11-26 化学処理装置

Country Status (1)

Country Link
JP (1) JPS60114577A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01104778A (ja) * 1987-10-16 1989-04-21 Matsushita Electric Ind Co Ltd プラズマｃｖｄ装置
JPH01136970A (ja) * 1987-11-20 1989-05-30 Matsushita Electric Ind Co Ltd プラズマｃｖｄ装置のクリーニング方法
JP2012004108A (ja) * 2010-05-18 2012-01-05 Semiconductor Energy Lab Co Ltd プラズマ処理装置
JP2012099715A (ja) * 2010-11-04 2012-05-24 Tokyo Electron Ltd プラズマ処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5688316A (en) * 1979-12-21 1981-07-17 Fuji Electric Co Ltd Apparatus for forming thin layer
JPS5832410A (ja) * 1981-08-06 1983-02-25 ザ・パ−キン−エルマ−・コ−ポレイシヨン ガス状減圧環境下で構造物を処理する方法及び装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5688316A (en) * 1979-12-21 1981-07-17 Fuji Electric Co Ltd Apparatus for forming thin layer
JPS5832410A (ja) * 1981-08-06 1983-02-25 ザ・パ−キン−エルマ−・コ−ポレイシヨン ガス状減圧環境下で構造物を処理する方法及び装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01104778A (ja) * 1987-10-16 1989-04-21 Matsushita Electric Ind Co Ltd プラズマｃｖｄ装置
JPH01136970A (ja) * 1987-11-20 1989-05-30 Matsushita Electric Ind Co Ltd プラズマｃｖｄ装置のクリーニング方法
JP2012004108A (ja) * 2010-05-18 2012-01-05 Semiconductor Energy Lab Co Ltd プラズマ処理装置
JP2012099715A (ja) * 2010-11-04 2012-05-24 Tokyo Electron Ltd プラズマ処理装置
US9196461B2 (en) 2010-11-04 2015-11-24 Tokyo Electron Limited Plasma processing apparatus

Also Published As

Publication number Publication date
JPH058271B2 (enrdf_load_stackoverflow) 1993-02-01

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