JPS60110180A - 光素子用パツケ−ジ - Google Patents

光素子用パツケ−ジ

Info

Publication number
JPS60110180A
JPS60110180A JP58218964A JP21896483A JPS60110180A JP S60110180 A JPS60110180 A JP S60110180A JP 58218964 A JP58218964 A JP 58218964A JP 21896483 A JP21896483 A JP 21896483A JP S60110180 A JPS60110180 A JP S60110180A
Authority
JP
Japan
Prior art keywords
chip
bonding pad
optical device
sapphire substrate
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58218964A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0416953B2 (enrdf_load_stackoverflow
Inventor
Hideaki Nishizawa
秀明 西沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP58218964A priority Critical patent/JPS60110180A/ja
Priority to CA467175A priority patent/CA1267468C/en
Priority to EP88202641A priority patent/EP0313174B1/en
Priority to DE8484307870T priority patent/DE3481571D1/de
Priority to DE88202641T priority patent/DE3486214T2/de
Priority to EP84307870A priority patent/EP0145316B1/en
Priority to FI844473A priority patent/FI82999C/fi
Priority to US06/671,783 priority patent/US4663652A/en
Priority to AU35605/84A priority patent/AU573645B2/en
Priority to DK547384A priority patent/DK163761C/da
Priority to NO844596A priority patent/NO169684C/no
Priority to KR1019840007025A priority patent/KR890003383B1/ko
Publication of JPS60110180A publication Critical patent/JPS60110180A/ja
Priority to US06/905,231 priority patent/US4727649A/en
Priority to FI880867A priority patent/FI91574C/fi
Priority to AU13197/88A priority patent/AU592256B2/en
Priority to CA000603408A priority patent/CA1273091A/en
Priority to NO903991A priority patent/NO169685C/no
Priority to DK033291A priority patent/DK33291A/da
Publication of JPH0416953B2 publication Critical patent/JPH0416953B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/93—Interconnections
    • H10F77/933—Interconnections for devices having potential barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
JP58218964A 1983-11-21 1983-11-21 光素子用パツケ−ジ Granted JPS60110180A (ja)

Priority Applications (18)

Application Number Priority Date Filing Date Title
JP58218964A JPS60110180A (ja) 1983-11-21 1983-11-21 光素子用パツケ−ジ
CA467175A CA1267468C (en) 1983-11-21 1984-11-06 OPTICS MOUNTING
EP88202641A EP0313174B1 (en) 1983-11-21 1984-11-14 Method for producing optical devices and packages
DE8484307870T DE3481571D1 (de) 1983-11-21 1984-11-14 Optische vorrichtung und gehaeuse fuer optische vorrichtung.
DE88202641T DE3486214T2 (de) 1983-11-21 1984-11-14 Herstellungsverfahren von optischen Anordnungen und Halterungen.
EP84307870A EP0145316B1 (en) 1983-11-21 1984-11-14 Optical device and package for optical device
FI844473A FI82999C (fi) 1983-11-21 1984-11-14 Optisk anordning och foerfarande foer dess framstaellning.
US06/671,783 US4663652A (en) 1983-11-21 1984-11-15 Package for optical device
DK547384A DK163761C (da) 1983-11-21 1984-11-16 Optisk komponent og hus til en saadan komponent.
AU35605/84A AU573645B2 (en) 1983-11-21 1984-11-16 Package for opto-electrical device
NO844596A NO169684C (no) 1983-11-21 1984-11-19 Holder for optisk element samt innretning som omfatter holderen.
KR1019840007025A KR890003383B1 (ko) 1983-11-21 1984-11-19 광 소자용 패키지
US06/905,231 US4727649A (en) 1983-11-21 1986-09-09 Method for producing an optical device
FI880867A FI91574C (fi) 1983-11-21 1988-02-24 Kotelo optista laitetta varten sekä menetelmä optisen laitteen valmistamiseksi
AU13197/88A AU592256B2 (en) 1983-11-21 1988-03-16 Optical device and method
CA000603408A CA1273091A (en) 1983-11-21 1989-06-20 Method for producing an optical device
NO903991A NO169685C (no) 1983-11-21 1990-09-13 Fremgangsmaate for fremstilling av en optisk innretning
DK033291A DK33291A (da) 1983-11-21 1991-02-26 Fremgangsmaade til fremstilling af en optisk komponent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58218964A JPS60110180A (ja) 1983-11-21 1983-11-21 光素子用パツケ−ジ

Publications (2)

Publication Number Publication Date
JPS60110180A true JPS60110180A (ja) 1985-06-15
JPH0416953B2 JPH0416953B2 (enrdf_load_stackoverflow) 1992-03-25

Family

ID=16728106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58218964A Granted JPS60110180A (ja) 1983-11-21 1983-11-21 光素子用パツケ−ジ

Country Status (2)

Country Link
JP (1) JPS60110180A (enrdf_load_stackoverflow)
KR (1) KR890003383B1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9491812B2 (en) 2005-12-16 2016-11-08 Nichia Corporation Light emitting device
WO2025057556A1 (ja) * 2023-09-13 2025-03-20 ウシオ電機株式会社 光源モジュール、光源モジュールの製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100424611B1 (ko) * 2001-04-20 2004-03-27 울트라테라 코포레이션 저형상 감광성 반도체 패키지

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9491812B2 (en) 2005-12-16 2016-11-08 Nichia Corporation Light emitting device
US9491813B2 (en) 2005-12-16 2016-11-08 Nichia Corporation Light emitting device
US9752734B2 (en) 2005-12-16 2017-09-05 Nichia Corporation Light emitting device
US10180213B2 (en) 2005-12-16 2019-01-15 Nichia Corporation Light emitting device
US10598317B2 (en) 2005-12-16 2020-03-24 Nichia Corporation Light emitting device
US10801676B2 (en) 2005-12-16 2020-10-13 Nichia Corporation Light emitting device
US11187385B2 (en) 2005-12-16 2021-11-30 Nichia Corporation Light emitting device
US11421829B2 (en) 2005-12-16 2022-08-23 Nichia Corporation Light emitting device
US11692677B2 (en) 2005-12-16 2023-07-04 Nichia Corporation Light emitting device
WO2025057556A1 (ja) * 2023-09-13 2025-03-20 ウシオ電機株式会社 光源モジュール、光源モジュールの製造方法

Also Published As

Publication number Publication date
KR850004362A (ko) 1985-07-11
JPH0416953B2 (enrdf_load_stackoverflow) 1992-03-25
KR890003383B1 (ko) 1989-09-19

Similar Documents

Publication Publication Date Title
EP0313174B1 (en) Method for producing optical devices and packages
CA2092165C (en) Chip carrier for optical device
JPH0799214A (ja) 光電変換素子の実装装置及びその製造方法
US5107329A (en) Pin-grid array semiconductor device
US7350988B2 (en) Optical module and method of manufacturing the same
US7364372B2 (en) Method of manufacturing optical module
US5027995A (en) Process for bonding semiconductor chips to substrates
JPS63211778A (ja) 光素子用パツケ−ジ
JPS60110180A (ja) 光素子用パツケ−ジ
JPS6367792A (ja) 光電子部品の実装構造
JP3127584B2 (ja) 樹脂製中空パッケージを用いた半導体装置
JPH11346006A (ja) 半導体装置
KR890003417B1 (ko) 광소자
JPS60153184A (ja) 受光素子
JPS6362266A (ja) 固体撮像装置の製造方法
JP2817425B2 (ja) 半導体装置の実装方法
JPS6313337A (ja) 半導体素子の実装方法
JPH03109760A (ja) 半導体装置
JP2000150756A (ja) 樹脂封止型半導体装置及びリードフレーム
JP2005159136A (ja) Ｃｏｂ実装用の枠体、パッケージ実装用の枠体、及び半導体装置
JPH0451056B2 (enrdf_load_stackoverflow)
JP2526534B2 (ja) 半導体装置の実装方法
JP2748759B2 (ja) フィルムキャリアテープの製造方法
JPS6043660B2 (ja) 半導体装置
KR900010673Y1 (ko) 고체 촬영소자의 패키지 구조