JPS60110117A - アラインメントマ−クを備えた薄板状物体およびこの物体を使用するアラインメント装置 - Google Patents

アラインメントマ−クを備えた薄板状物体およびこの物体を使用するアラインメント装置

Info

Publication number
JPS60110117A
JPS60110117A JP58217111A JP21711183A JPS60110117A JP S60110117 A JPS60110117 A JP S60110117A JP 58217111 A JP58217111 A JP 58217111A JP 21711183 A JP21711183 A JP 21711183A JP S60110117 A JPS60110117 A JP S60110117A
Authority
JP
Japan
Prior art keywords
reticle
wafer
alignment
alignment mark
marks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58217111A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0429214B2 (en, 2012
Inventor
Akiyoshi Suzuki
章義 鈴木
Hiroshi Sato
宏 佐藤
Ichiro Ishiyama
一郎 石山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP58217111A priority Critical patent/JPS60110117A/ja
Priority to US06/553,814 priority patent/US4620785A/en
Priority to GB08331675A priority patent/GB2133536B/en
Priority to DE3348224A priority patent/DE3348224C2/de
Priority to DE19833343206 priority patent/DE3343206A1/de
Priority to FR838319126A priority patent/FR2541471B1/fr
Publication of JPS60110117A publication Critical patent/JPS60110117A/ja
Publication of JPH0429214B2 publication Critical patent/JPH0429214B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP58217111A 1982-12-01 1983-11-19 アラインメントマ−クを備えた薄板状物体およびこの物体を使用するアラインメント装置 Granted JPS60110117A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP58217111A JPS60110117A (ja) 1983-11-19 1983-11-19 アラインメントマ−クを備えた薄板状物体およびこの物体を使用するアラインメント装置
US06/553,814 US4620785A (en) 1982-12-01 1983-11-21 Sheet-like member having alignment marks and an alignment apparatus for the same
GB08331675A GB2133536B (en) 1982-12-01 1983-11-28 Sensing alignment
DE3348224A DE3348224C2 (en, 2012) 1982-12-01 1983-11-29
DE19833343206 DE3343206A1 (de) 1982-12-01 1983-11-29 Mit ausrichtungsmarken versehenes blattfoermiges element sowie ausrichtungsvorrichtung fuer dasselbe
FR838319126A FR2541471B1 (fr) 1982-12-01 1983-11-30 Element en forme de feuille a aligner sur un autre element presentant une zone dessinee, et appareil et reticule pour l'alignement de ces elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58217111A JPS60110117A (ja) 1983-11-19 1983-11-19 アラインメントマ−クを備えた薄板状物体およびこの物体を使用するアラインメント装置

Publications (2)

Publication Number Publication Date
JPS60110117A true JPS60110117A (ja) 1985-06-15
JPH0429214B2 JPH0429214B2 (en, 2012) 1992-05-18

Family

ID=16699018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58217111A Granted JPS60110117A (ja) 1982-12-01 1983-11-19 アラインメントマ−クを備えた薄板状物体およびこの物体を使用するアラインメント装置

Country Status (1)

Country Link
JP (1) JPS60110117A (en, 2012)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166026A (ja) * 1984-12-19 1986-07-26 Fujitsu Ltd 位置合わせ方法
JPS63291431A (ja) * 1987-05-25 1988-11-29 Matsushita Electronics Corp 半導体装置
US12128737B2 (en) 2018-11-19 2024-10-29 Kautex Textron Gmbh & Co. Kg Headliner trim and method for producing a headliner trim

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61166026A (ja) * 1984-12-19 1986-07-26 Fujitsu Ltd 位置合わせ方法
JPS63291431A (ja) * 1987-05-25 1988-11-29 Matsushita Electronics Corp 半導体装置
US12128737B2 (en) 2018-11-19 2024-10-29 Kautex Textron Gmbh & Co. Kg Headliner trim and method for producing a headliner trim

Also Published As

Publication number Publication date
JPH0429214B2 (en, 2012) 1992-05-18

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