JPS60103649A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS60103649A
JPS60103649A JP58210798A JP21079883A JPS60103649A JP S60103649 A JPS60103649 A JP S60103649A JP 58210798 A JP58210798 A JP 58210798A JP 21079883 A JP21079883 A JP 21079883A JP S60103649 A JPS60103649 A JP S60103649A
Authority
JP
Japan
Prior art keywords
resin
case
heat sink
substrate
heat dissipating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58210798A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6361779B2 (enrdf_load_stackoverflow
Inventor
Hitoshi Matsuzaki
均 松崎
Eiji Harada
原田　英次
Toshiyuki Ozeki
大関　俊行
Takayuki Wakui
和久井　陽行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58210798A priority Critical patent/JPS60103649A/ja
Publication of JPS60103649A publication Critical patent/JPS60103649A/ja
Publication of JPS6361779B2 publication Critical patent/JPS6361779B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1301—Thyristor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP58210798A 1983-11-11 1983-11-11 半導体装置 Granted JPS60103649A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58210798A JPS60103649A (ja) 1983-11-11 1983-11-11 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58210798A JPS60103649A (ja) 1983-11-11 1983-11-11 半導体装置

Publications (2)

Publication Number Publication Date
JPS60103649A true JPS60103649A (ja) 1985-06-07
JPS6361779B2 JPS6361779B2 (enrdf_load_stackoverflow) 1988-11-30

Family

ID=16595304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58210798A Granted JPS60103649A (ja) 1983-11-11 1983-11-11 半導体装置

Country Status (1)

Country Link
JP (1) JPS60103649A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987478A (en) * 1990-02-20 1991-01-22 Unisys Corporation Micro individual integrated circuit package
EP0645812A1 (en) * 1993-09-21 1995-03-29 Fuji Electric Co., Ltd. Resin-sealed semiconductor device
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4987478A (en) * 1990-02-20 1991-01-22 Unisys Corporation Micro individual integrated circuit package
US5408128A (en) * 1993-09-15 1995-04-18 International Rectifier Corporation High power semiconductor device module with low thermal resistance and simplified manufacturing
EP0645812A1 (en) * 1993-09-21 1995-03-29 Fuji Electric Co., Ltd. Resin-sealed semiconductor device
US5539253A (en) * 1993-09-21 1996-07-23 Fuji Electric Co., Ltd. Resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPS6361779B2 (enrdf_load_stackoverflow) 1988-11-30

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