JPS60100673A - マスク蒸着による配線パタ−ンの形成方法 - Google Patents
マスク蒸着による配線パタ−ンの形成方法Info
- Publication number
- JPS60100673A JPS60100673A JP20695383A JP20695383A JPS60100673A JP S60100673 A JPS60100673 A JP S60100673A JP 20695383 A JP20695383 A JP 20695383A JP 20695383 A JP20695383 A JP 20695383A JP S60100673 A JPS60100673 A JP S60100673A
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- vapor deposition
- substrate
- pattern
- mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 12
- 230000015572 biosynthetic process Effects 0.000 title abstract 2
- 239000011888 foil Substances 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims abstract description 10
- 239000000696 magnetic material Substances 0.000 claims abstract description 6
- 230000008020 evaporation Effects 0.000 claims abstract 2
- 238000001704 evaporation Methods 0.000 claims abstract 2
- 229910052751 metal Inorganic materials 0.000 claims description 24
- 239000002184 metal Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 8
- 230000007261 regionalization Effects 0.000 claims 1
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 6
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 abstract description 2
- 229910001220 stainless steel Inorganic materials 0.000 abstract description 2
- 239000010935 stainless steel Substances 0.000 abstract description 2
- 238000005323 electroforming Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 241000282414 Homo sapiens Species 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/042—Coating on selected surface areas, e.g. using masks using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
- B05C21/005—Masking devices
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
- H05K3/143—Masks therefor
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20695383A JPS60100673A (ja) | 1983-11-02 | 1983-11-02 | マスク蒸着による配線パタ−ンの形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20695383A JPS60100673A (ja) | 1983-11-02 | 1983-11-02 | マスク蒸着による配線パタ−ンの形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60100673A true JPS60100673A (ja) | 1985-06-04 |
| JPS6338421B2 JPS6338421B2 (enrdf_load_stackoverflow) | 1988-07-29 |
Family
ID=16531750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20695383A Granted JPS60100673A (ja) | 1983-11-02 | 1983-11-02 | マスク蒸着による配線パタ−ンの形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60100673A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63206465A (ja) * | 1987-02-20 | 1988-08-25 | Fujitsu Ltd | 導体パタ−ンの製造方法 |
| FR2648156A1 (fr) * | 1989-06-07 | 1990-12-14 | Ppg Industries Inc | Appareil et methode pour deposer par pulverisation cathodique un revetement sur un substrat |
| JPH1050478A (ja) * | 1996-04-19 | 1998-02-20 | Toray Ind Inc | 有機電界発光素子およびその製造方法 |
| JP2003060219A (ja) * | 2001-06-04 | 2003-02-28 | Fuji Electric Corp Res & Dev Ltd | 薄膜太陽電池とその製造方法 |
| JP2008047585A (ja) * | 2006-08-11 | 2008-02-28 | Brother Ind Ltd | 配線基板の製造方法およびマスク |
-
1983
- 1983-11-02 JP JP20695383A patent/JPS60100673A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63206465A (ja) * | 1987-02-20 | 1988-08-25 | Fujitsu Ltd | 導体パタ−ンの製造方法 |
| FR2648156A1 (fr) * | 1989-06-07 | 1990-12-14 | Ppg Industries Inc | Appareil et methode pour deposer par pulverisation cathodique un revetement sur un substrat |
| JPH1050478A (ja) * | 1996-04-19 | 1998-02-20 | Toray Ind Inc | 有機電界発光素子およびその製造方法 |
| JP2003060219A (ja) * | 2001-06-04 | 2003-02-28 | Fuji Electric Corp Res & Dev Ltd | 薄膜太陽電池とその製造方法 |
| JP2008047585A (ja) * | 2006-08-11 | 2008-02-28 | Brother Ind Ltd | 配線基板の製造方法およびマスク |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6338421B2 (enrdf_load_stackoverflow) | 1988-07-29 |
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