FR2391538A1 - Resistance en couche mince et procede de fabrication - Google Patents

Resistance en couche mince et procede de fabrication

Info

Publication number
FR2391538A1
FR2391538A1 FR7814041A FR7814041A FR2391538A1 FR 2391538 A1 FR2391538 A1 FR 2391538A1 FR 7814041 A FR7814041 A FR 7814041A FR 7814041 A FR7814041 A FR 7814041A FR 2391538 A1 FR2391538 A1 FR 2391538A1
Authority
FR
France
Prior art keywords
manufacturing process
thin layer
thin film
resistor
layer strength
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7814041A
Other languages
English (en)
Other versions
FR2391538B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Asahi Kasei Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5546577A external-priority patent/JPS53141496A/ja
Priority claimed from JP5595977A external-priority patent/JPS53141459A/ja
Priority claimed from JP7212277A external-priority patent/JPS547571A/ja
Priority claimed from JP7284077A external-priority patent/JPS547572A/ja
Application filed by Asahi Chemical Industry Co Ltd, Asahi Kasei Kogyo KK filed Critical Asahi Chemical Industry Co Ltd
Publication of FR2391538A1 publication Critical patent/FR2391538A1/fr
Application granted granted Critical
Publication of FR2391538B1 publication Critical patent/FR2391538B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)

Abstract

L'invention concerne une résistance en couche mince. Selon l'invention, elle comprend un substrat diélectrique 1 et une couche d'un matériau de résistance en couche mince déposée sur une surface du substrat, la couche de matériau de résistance 2 ayant un motif de résistance formé en irradiant sélectivement une énergie 10 à sec sur le matériau continu de la résistance en couche mince déposé à la surface du substrat 1 afin de disperser le matériau de la résistance aux parties irradiées. L'invention s'applique notamment aux circuits intégrés.
FR7814041A 1977-05-16 1978-05-11 Resistance en couche mince et procede de fabrication Granted FR2391538A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP5546577A JPS53141496A (en) 1977-05-16 1977-05-16 Method of manufacturing thin film resistance body
JP5595977A JPS53141459A (en) 1977-05-17 1977-05-17 Printed circuit board with thin film resistor
JP7212277A JPS547571A (en) 1977-06-20 1977-06-20 Method of making hybrid circuit
JP7284077A JPS547572A (en) 1977-06-21 1977-06-21 Base element for hybrid circuit and method of using same as hybrid circuit

Publications (2)

Publication Number Publication Date
FR2391538A1 true FR2391538A1 (fr) 1978-12-15
FR2391538B1 FR2391538B1 (fr) 1981-07-03

Family

ID=27463208

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7814041A Granted FR2391538A1 (fr) 1977-05-16 1978-05-11 Resistance en couche mince et procede de fabrication

Country Status (3)

Country Link
DE (1) DE2821196C2 (fr)
FR (1) FR2391538A1 (fr)
GB (1) GB1597806A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0007598A1 (fr) * 1978-08-02 1980-02-06 Siemens Aktiengesellschaft Procédé pour la fabrication d'un circuit électrique en couche sur feuille en matière plastique

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2006538B (en) * 1977-10-24 1982-03-17 Asahi Chemical Ind Thin-film microcircuit board and method for making the same
DE3003136A1 (de) * 1980-01-29 1981-07-30 Siemens AG, 1000 Berlin und 8000 München Verfahren zum herstellen von thermisch stabilen, metallischen schichten
GB2181009B (en) * 1985-09-23 1989-11-29 Fluke Mfg Co John Apparatus and method for providing improved resistive ratio stability of a resistive divider network
US6388230B1 (en) * 1999-10-13 2002-05-14 Morton International, Inc. Laser imaging of thin layer electronic circuitry material

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1319765A (en) * 1969-10-15 1973-06-06 Atomic Energy Authority Uk Resistive elements
US3845443A (en) * 1972-06-14 1974-10-29 Bailey Meter Co Thin film resistance thermometer

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1109226B (de) * 1958-12-17 1961-06-22 Siemens Ag Verfahren zur Herstellung gedruckter Schaltungen und/oder gedruckter Schaltungselemente
US3614423A (en) * 1970-09-21 1971-10-19 Stanford Research Inst Charged particle pattern imaging and exposure system
FR2201542B1 (fr) * 1972-10-02 1977-09-09 Bendix Corp
US3947801A (en) * 1975-01-23 1976-03-30 Rca Corporation Laser-trimmed resistor

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1319765A (en) * 1969-10-15 1973-06-06 Atomic Energy Authority Uk Resistive elements
US3845443A (en) * 1972-06-14 1974-10-29 Bailey Meter Co Thin film resistance thermometer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0007598A1 (fr) * 1978-08-02 1980-02-06 Siemens Aktiengesellschaft Procédé pour la fabrication d'un circuit électrique en couche sur feuille en matière plastique

Also Published As

Publication number Publication date
DE2821196A1 (de) 1978-12-14
DE2821196C2 (de) 1983-02-17
GB1597806A (en) 1981-09-09
FR2391538B1 (fr) 1981-07-03

Similar Documents

Publication Publication Date Title
FR2408200A1 (fr) Procede de fabrication de circuits resistifs a pellicule epaisse
IT8019855A0 (it) Procedimento per depositare in continuo, sulla superficie di un substrato portato ad alta temperatura, uno strato di una materia solida, e installazione per la realizzazione di questo procedimento.
GB1307535A (en) Photographically produced printing screen and the application thereof to the manufacture of electrically heatable glass sheets
EP0402604A3 (fr) Dispositif pour le revêtement par pulvérisation électrostatique de poudre
FR2391538A1 (fr) Resistance en couche mince et procede de fabrication
EP0300567A3 (en) Method of applying thin layers of oxidic superconductive material
FR2372457A1 (fr) Procede de rognage d'une couche photoresistante
UST988007I4 (en) Laser deposition of metal upon transparent materials
JPS53129637A (en) Mask for photoetching
BE875392A (fr) Element thermoisolant en forme de plaque a couche isolante en matiere alveolaire et procede de fabrication de cet element
JPS56113127A (en) Screen for photographing
NL7504118A (nl) Werkwijze voor het aanbrengen van naast elkaar liggende, dicht aan elkaar aansluitende, ver- schillende lagen op een transparante onderlaag.
JPS56138848A (en) Photoelectric surface mask
JPS5264285A (en) Production of compositemetal layer of integrated circuit device
JPS6442576A (en) Composite sputtering target
JPS6465253A (en) Surface coated molded material and its production
JPS55152195A (en) Method for partial plating of nonconductive member
JPS5769783A (en) Formation of multilayer thin film pattern
JP2683553B2 (ja) パターン形成法
JPS57123518A (en) Manufacture of thin-film magnetic head
JPS56115534A (en) Formation of pattern
JPS6443917A (en) Forming device for superconductive thin film
JPS5446138A (en) Production of multilayer printed plate
KR940010871A (ko) 플렉시블 필름 인쇄회로 기판 및 제조방법
JPS5618429A (en) Minute electrode formation

Legal Events

Date Code Title Description
ST Notification of lapse