FR2408200A1 - Procede de fabrication de circuits resistifs a pellicule epaisse - Google Patents
Procede de fabrication de circuits resistifs a pellicule epaisseInfo
- Publication number
- FR2408200A1 FR2408200A1 FR7831177A FR7831177A FR2408200A1 FR 2408200 A1 FR2408200 A1 FR 2408200A1 FR 7831177 A FR7831177 A FR 7831177A FR 7831177 A FR7831177 A FR 7831177A FR 2408200 A1 FR2408200 A1 FR 2408200A1
- Authority
- FR
- France
- Prior art keywords
- metal oxide
- thick film
- film resistive
- metal
- resistive circuits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 238000000034 method Methods 0.000 title 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 4
- 150000004706 metal oxides Chemical class 0.000 abstract 4
- 239000000463 material Substances 0.000 abstract 1
- 230000001590 oxidative effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/281—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thick film techniques
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49082—Resistor making
- Y10T29/49099—Coating resistive material on a base
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A.FABRICATION D'UN CIRCUIT RESISTIF A PELLICULE EPAISSE. B.AVANT DE DEPOSER LA MATIERE RESISTIVE SUR LE SUPPORT PORTANT UN MOTIF OU RESEAU CONDUCTEUR FORME D'UN OXYDE DE METAL, ON CHAUFFE L'ENSEMBLE EN ATMOSPHERE REDUCTRICE AFIN DE CONVERTIR L'OXYDE DE METAL EN METAL ET ON CHAUFFE L'ENSEMBLE DANS UNE ATMOSPHERE OXYDANTE AFIN DE RECONVERTIR LE METAL EN UN OXYDE DE METAL D'UNE DENSITE INFERIEURE A CELLE DE L'OXYDE DE METAL D'ORIGINE. C.L'INVENTION S'APPLIQUE A LA FABRICATION DE CIRCUITS COMPORTANT DES PARTIES RESISTANTES.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/848,509 US4140817A (en) | 1977-11-04 | 1977-11-04 | Thick film resistor circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2408200A1 true FR2408200A1 (fr) | 1979-06-01 |
Family
ID=25303475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7831177A Pending FR2408200A1 (fr) | 1977-11-04 | 1978-11-03 | Procede de fabrication de circuits resistifs a pellicule epaisse |
Country Status (9)
Country | Link |
---|---|
US (1) | US4140817A (fr) |
JP (1) | JPS5475064A (fr) |
BE (1) | BE871760A (fr) |
DE (1) | DE2847851A1 (fr) |
FR (1) | FR2408200A1 (fr) |
GB (1) | GB2007918A (fr) |
IT (1) | IT1100905B (fr) |
NL (1) | NL7810842A (fr) |
SE (1) | SE7811095L (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2491715A1 (fr) * | 1980-10-06 | 1982-04-09 | Cts Corp | Circuits a conducteur de cuivre en film epais et leur procede de fabrication |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4409261A (en) * | 1980-02-07 | 1983-10-11 | Cts Corporation | Process for air firing oxidizable conductors |
US4316920A (en) * | 1980-07-03 | 1982-02-23 | Bell Telephone Laboratories, Incorporated | Thick film resistor circuits |
US4322316A (en) * | 1980-08-22 | 1982-03-30 | Ferro Corporation | Thick film conductor employing copper oxide |
US4317750A (en) * | 1980-08-22 | 1982-03-02 | Ferro Corporation | Thick film conductor employing nickel oxide |
US4503090A (en) * | 1983-02-23 | 1985-03-05 | At&T Bell Laboratories | Thick film resistor circuits |
US4511601A (en) * | 1983-05-13 | 1985-04-16 | North American Philips Corporation | Copper metallization for dielectric materials |
US4503418A (en) * | 1983-11-07 | 1985-03-05 | Northern Telecom Limited | Thick film resistor |
JPS61194794A (ja) * | 1985-02-22 | 1986-08-29 | 三菱電機株式会社 | 混成集積回路基板の製造方法 |
DE3537161C2 (de) * | 1985-10-18 | 1995-08-03 | Bosch Gmbh Robert | Verfahren zur Herstellung festhaftender, lötfähiger und strukturierbarer Metallschichten auf Aluminiumoxid-haltiger Keramik |
US4728534A (en) * | 1986-08-04 | 1988-03-01 | Motorola, Inc. | Thick film conductor structure |
DE3884756T2 (de) * | 1987-05-20 | 1994-05-05 | Matsushita Electric Ind Co Ltd | Verfahren zur herstellung eines dünnen films von basismetall und dessen verwendung. |
US4975301A (en) * | 1987-08-07 | 1990-12-04 | The O. Hommel Company | Glass coating |
JPH01151205A (ja) * | 1987-12-08 | 1989-06-14 | Matsushita Electric Ind Co Ltd | 抵抗器の製造方法 |
JP2887318B2 (ja) * | 1988-08-29 | 1999-04-26 | 松下電器産業株式会社 | 金属薄膜抵抗体の製造方法 |
JPH0795483B2 (ja) * | 1989-05-18 | 1995-10-11 | 株式会社東芝 | 厚膜抵抗素子の製造方法 |
US5336444A (en) * | 1992-05-29 | 1994-08-09 | International Business Machines Corporation | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same |
US5680092A (en) * | 1993-11-11 | 1997-10-21 | Matsushita Electric Industrial Co., Ltd. | Chip resistor and method for producing the same |
US6660680B1 (en) | 1997-02-24 | 2003-12-09 | Superior Micropowders, Llc | Electrocatalyst powders, methods for producing powders and devices fabricated from same |
US6338809B1 (en) * | 1997-02-24 | 2002-01-15 | Superior Micropowders Llc | Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
JP2001513697A (ja) * | 1997-02-24 | 2001-09-04 | スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー | エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置 |
DE19750123C2 (de) * | 1997-11-13 | 2000-09-07 | Heraeus Electro Nite Int | Verfahren zur Herstellung einer Sensoranordnung für die Temperaturmessung |
US6967183B2 (en) | 1998-08-27 | 2005-11-22 | Cabot Corporation | Electrocatalyst powders, methods for producing powders and devices fabricated from same |
US7066976B2 (en) * | 1998-02-24 | 2006-06-27 | Cabot Corporation | Method for the production of electrocatalyst powders |
US6753108B1 (en) * | 1998-02-24 | 2004-06-22 | Superior Micropowders, Llc | Energy devices and methods for the fabrication of energy devices |
US20050097987A1 (en) * | 1998-02-24 | 2005-05-12 | Cabot Corporation | Coated copper-containing powders, methods and apparatus for producing such powders, and copper-containing devices fabricated from same |
CA2412426C (fr) * | 2000-06-08 | 2007-09-04 | Superior Micropowders, Llc | Poudres electrocatalytiques, procedes permettant de les produire et dispositifs produits a partir desdites poudres |
US6458669B1 (en) | 2000-08-30 | 2002-10-01 | Agere Systems Guardian Corp. | Method of manufacturing an integrated circuit |
US9113583B2 (en) | 2012-07-31 | 2015-08-18 | General Electric Company | Electronic circuit board, assembly and a related method thereof |
JP5766336B1 (ja) | 2014-06-16 | 2015-08-19 | 株式会社マテリアル・コンセプト | 銅ペーストの焼成方法 |
FR3044834A1 (fr) * | 2015-12-02 | 2017-06-09 | Pierre Guitton | Dispositif de generation d'ions |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3481777A (en) * | 1967-02-17 | 1969-12-02 | Ibm | Electroless coating method for making printed circuits |
US3645783A (en) * | 1970-06-03 | 1972-02-29 | Infrared Ind Inc | Thin film planar resistor |
FR2332600A1 (fr) * | 1975-11-24 | 1977-06-17 | Trw Inc | Resistance electrique a terminaison en couche mince et son procede de realisation |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3998980A (en) * | 1972-05-05 | 1976-12-21 | Hewlett-Packard Company | Fabrication of thick film resistors |
-
1977
- 1977-11-04 US US05/848,509 patent/US4140817A/en not_active Expired - Lifetime
-
1978
- 1978-10-25 SE SE7811095A patent/SE7811095L/xx unknown
- 1978-10-31 NL NL7810842A patent/NL7810842A/xx not_active Application Discontinuation
- 1978-11-02 JP JP13467078A patent/JPS5475064A/ja active Pending
- 1978-11-03 IT IT29432/78A patent/IT1100905B/it active
- 1978-11-03 GB GB7843123A patent/GB2007918A/en not_active Withdrawn
- 1978-11-03 DE DE19782847851 patent/DE2847851A1/de active Pending
- 1978-11-03 BE BE191533A patent/BE871760A/fr unknown
- 1978-11-03 FR FR7831177A patent/FR2408200A1/fr active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3481777A (en) * | 1967-02-17 | 1969-12-02 | Ibm | Electroless coating method for making printed circuits |
US3645783A (en) * | 1970-06-03 | 1972-02-29 | Infrared Ind Inc | Thin film planar resistor |
FR2332600A1 (fr) * | 1975-11-24 | 1977-06-17 | Trw Inc | Resistance electrique a terminaison en couche mince et son procede de realisation |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2491715A1 (fr) * | 1980-10-06 | 1982-04-09 | Cts Corp | Circuits a conducteur de cuivre en film epais et leur procede de fabrication |
Also Published As
Publication number | Publication date |
---|---|
SE7811095L (sv) | 1979-05-05 |
US4140817A (en) | 1979-02-20 |
DE2847851A1 (de) | 1979-05-10 |
NL7810842A (nl) | 1979-05-08 |
JPS5475064A (en) | 1979-06-15 |
IT1100905B (it) | 1985-09-28 |
BE871760A (fr) | 1979-03-01 |
IT7829432A0 (it) | 1978-11-03 |
GB2007918A (en) | 1979-05-23 |
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