JPS5996122A - 熱硬化性エポキシ樹脂組成物 - Google Patents
熱硬化性エポキシ樹脂組成物Info
- Publication number
- JPS5996122A JPS5996122A JP20509082A JP20509082A JPS5996122A JP S5996122 A JPS5996122 A JP S5996122A JP 20509082 A JP20509082 A JP 20509082A JP 20509082 A JP20509082 A JP 20509082A JP S5996122 A JPS5996122 A JP S5996122A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- parts
- cured
- resin composition
- cured product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 63
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 62
- 239000000203 mixture Substances 0.000 title claims description 64
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 43
- 229920000642 polymer Polymers 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 12
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 8
- 239000002245 particle Substances 0.000 claims description 41
- 229920001296 polysiloxane Polymers 0.000 abstract description 28
- 239000004593 Epoxy Substances 0.000 abstract description 16
- 229920005989 resin Polymers 0.000 abstract description 12
- 239000011347 resin Substances 0.000 abstract description 12
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 abstract description 6
- 229930003836 cresol Natural products 0.000 abstract description 6
- 239000011342 resin composition Substances 0.000 abstract description 5
- 229920003986 novolac Polymers 0.000 abstract description 4
- 229920000180 alkyd Polymers 0.000 abstract description 3
- 239000012798 spherical particle Substances 0.000 abstract 3
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 abstract 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 abstract 1
- 239000000047 product Substances 0.000 description 38
- 239000000843 powder Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 12
- -1 methyl (α-phenylethyl) Chemical group 0.000 description 11
- 238000000465 moulding Methods 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 229920001971 elastomer Polymers 0.000 description 9
- 239000003925 fat Substances 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 238000001721 transfer moulding Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- 239000004205 dimethyl polysiloxane Substances 0.000 description 5
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 239000004634 thermosetting polymer Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 239000000806 elastomer Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical group [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 229910002026 crystalline silica Inorganic materials 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000012756 surface treatment agent Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- BNJMRELGMDUDDB-UHFFFAOYSA-N $l^{1}-sulfanylbenzene Chemical compound [S]C1=CC=CC=C1 BNJMRELGMDUDDB-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- UALAKBZSBJIXBP-UHFFFAOYSA-N 1-phenylethane-1,1,2,2-tetrol Chemical compound OC(O)C(O)(O)C1=CC=CC=C1 UALAKBZSBJIXBP-UHFFFAOYSA-N 0.000 description 1
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- MVEOHWRUBFWKJY-UHFFFAOYSA-N 7-hydroxynaphthalene-2-sulfonic acid Chemical compound C1=CC(S(O)(=O)=O)=CC2=CC(O)=CC=C21 MVEOHWRUBFWKJY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 235000010919 Copernicia prunifera Nutrition 0.000 description 1
- 244000180278 Copernicia prunifera Species 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000005909 Kieselgur Substances 0.000 description 1
- 125000000174 L-prolyl group Chemical group [H]N1C([H])([H])C([H])([H])C([H])([H])[C@@]1([H])C(*)=O 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- CSJKPFQJIDMSGF-UHFFFAOYSA-K aluminum;tribenzoate Chemical compound [Al+3].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 CSJKPFQJIDMSGF-UHFFFAOYSA-K 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910000410 antimony oxide Inorganic materials 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000003262 carboxylic acid ester group Chemical group [H]C([H])([*:2])OC(=O)C([H])([H])[*:1] 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006240 deamidation Effects 0.000 description 1
- 238000006114 decarboxylation reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- ZFTFAPZRGNKQPU-UHFFFAOYSA-N dicarbonic acid Chemical compound OC(=O)OC(O)=O ZFTFAPZRGNKQPU-UHFFFAOYSA-N 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical compound C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- GIWKOZXJDKMGQC-UHFFFAOYSA-L lead(2+);naphthalene-2-carboxylate Chemical compound [Pb+2].C1=CC=CC2=CC(C(=O)[O-])=CC=C21.C1=CC=CC2=CC(C(=O)[O-])=CC=C21 GIWKOZXJDKMGQC-UHFFFAOYSA-L 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- VTRUBDSFZJNXHI-UHFFFAOYSA-N oxoantimony Chemical compound [Sb]=O VTRUBDSFZJNXHI-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229940014800 succinic anhydride Drugs 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20509082A JPS5996122A (ja) | 1982-11-22 | 1982-11-22 | 熱硬化性エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20509082A JPS5996122A (ja) | 1982-11-22 | 1982-11-22 | 熱硬化性エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5996122A true JPS5996122A (ja) | 1984-06-02 |
| JPS6312489B2 JPS6312489B2 (enrdf_load_stackoverflow) | 1988-03-19 |
Family
ID=16501258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20509082A Granted JPS5996122A (ja) | 1982-11-22 | 1982-11-22 | 熱硬化性エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5996122A (enrdf_load_stackoverflow) |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166712A (ja) * | 1984-09-11 | 1986-04-05 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS6172077A (ja) * | 1984-09-14 | 1986-04-14 | Shin Etsu Chem Co Ltd | 接着促進剤 |
| JPS62270617A (ja) * | 1986-05-20 | 1987-11-25 | Mitsui Toatsu Chem Inc | 半導体封止用樹脂組成物 |
| JPS63251419A (ja) * | 1987-04-08 | 1988-10-18 | Toray Ind Inc | 半導体封止用樹脂組成物 |
| JPH02189357A (ja) * | 1989-01-19 | 1990-07-25 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPH02218736A (ja) * | 1989-02-20 | 1990-08-31 | Toray Ind Inc | エポキシ系樹脂組成物 |
| US5082891A (en) * | 1988-02-29 | 1992-01-21 | Dow Corning Toray Silicone Co., Ltd. | Curable resin composition containing dispersed particles of a cured silicone rubber |
| EP0685508A1 (en) | 1994-05-27 | 1995-12-06 | Dow Corning Toray Silicone Company, Limited | Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition |
| WO1996011988A1 (fr) * | 1994-10-14 | 1996-04-25 | Dow Corning Toray Silicone Co., Ltd. | Composition pour resine de revetement en poudre |
| JPH08239478A (ja) * | 1995-01-24 | 1996-09-17 | Wacker Chemie Gmbh | オルガノシロキサン樹脂粉末、該オルガノシロキサン樹脂粉末の製造法およびオルガノポリシロキサン組成物の製造法 |
| US6239245B1 (en) | 1999-03-02 | 2001-05-29 | Dow Corning Toray Silicone Company, Ltd. | Resin additive, curable resin composition, and cured resin |
| US6465550B1 (en) | 2000-08-08 | 2002-10-15 | Dow Corning Corporation | Silicone composition and electrically conductive, cured silicone product |
| EP2075280A1 (en) | 2007-12-26 | 2009-07-01 | Shin-Etsu Chemical Co., Ltd. | White heat-curable silicone resin composition, optoelectric part case, and molding method |
| US8012381B2 (en) | 2008-06-09 | 2011-09-06 | Shin-Etsu Chemical Co., Ltd. | White heat-curable silicone resin composition and optoelectronic part case |
| US8093345B2 (en) | 2006-07-27 | 2012-01-10 | Dow Corning Corporation | Method of preparing a silicone resin |
| JP2012500878A (ja) * | 2008-08-28 | 2012-01-12 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 温度安定性接着剤層の形成下での構成部材（Ｂａｕｔｅｉｌｅｎ）の接着法 |
| US8173053B2 (en) | 2008-06-09 | 2012-05-08 | Shin-Etsu Chemical Co., Ltd. | White heat-curable silicone resin composition and optoelectronic part case |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7426283B2 (ja) | 2020-04-28 | 2024-02-01 | 信越化学工業株式会社 | ポリエーテル／ポリシロキサン架橋ゴム球状粒子及びこれを製造する方法、並びにポリエーテル／ポリシロキサン架橋複合粒子及びこれを製造する方法 |
| JP7706959B2 (ja) | 2021-07-01 | 2025-07-14 | 信越化学工業株式会社 | シリコーンゴム球状粒子用液状組成物、シリコーンゴム球状粒子およびその製造方法、およびシリコーン複合粒子およびその製造方法 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825739A (enrdf_load_stackoverflow) * | 1971-08-09 | 1973-04-04 | ||
| JPS5454168A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
| JPS553412A (en) * | 1978-06-21 | 1980-01-11 | Hitachi Ltd | Epoxy resin composition |
| JPS5614556A (en) * | 1979-07-13 | 1981-02-12 | Hitachi Ltd | Curing method of thermosetting resin composition |
| JPS5756954A (en) * | 1980-09-22 | 1982-04-05 | Hitachi Ltd | Resin-sealed electronic parts |
| JPS5821417A (ja) * | 1981-07-29 | 1983-02-08 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
| JPS6228971A (ja) * | 1985-07-31 | 1987-02-06 | Nec Corp | 磁気ヘツド |
-
1982
- 1982-11-22 JP JP20509082A patent/JPS5996122A/ja active Granted
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4825739A (enrdf_load_stackoverflow) * | 1971-08-09 | 1973-04-04 | ||
| JPS5454168A (en) * | 1977-10-07 | 1979-04-28 | Hitachi Ltd | Epoxy resin composition |
| JPS553412A (en) * | 1978-06-21 | 1980-01-11 | Hitachi Ltd | Epoxy resin composition |
| JPS5614556A (en) * | 1979-07-13 | 1981-02-12 | Hitachi Ltd | Curing method of thermosetting resin composition |
| JPS5756954A (en) * | 1980-09-22 | 1982-04-05 | Hitachi Ltd | Resin-sealed electronic parts |
| JPS5821417A (ja) * | 1981-07-29 | 1983-02-08 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
| JPS6228971A (ja) * | 1985-07-31 | 1987-02-06 | Nec Corp | 磁気ヘツド |
Cited By (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6166712A (ja) * | 1984-09-11 | 1986-04-05 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS6172077A (ja) * | 1984-09-14 | 1986-04-14 | Shin Etsu Chem Co Ltd | 接着促進剤 |
| JPS62270617A (ja) * | 1986-05-20 | 1987-11-25 | Mitsui Toatsu Chem Inc | 半導体封止用樹脂組成物 |
| JPS63251419A (ja) * | 1987-04-08 | 1988-10-18 | Toray Ind Inc | 半導体封止用樹脂組成物 |
| US5082891A (en) * | 1988-02-29 | 1992-01-21 | Dow Corning Toray Silicone Co., Ltd. | Curable resin composition containing dispersed particles of a cured silicone rubber |
| JPH02189357A (ja) * | 1989-01-19 | 1990-07-25 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂成形材料 |
| JPH02218736A (ja) * | 1989-02-20 | 1990-08-31 | Toray Ind Inc | エポキシ系樹脂組成物 |
| US5691401A (en) * | 1994-05-27 | 1997-11-25 | Dow Corning Toray Silicone Co., Ltd. | Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition |
| EP0685508A1 (en) | 1994-05-27 | 1995-12-06 | Dow Corning Toray Silicone Company, Limited | Curable resin compositions containing silica-coated microparticles of a cured organosiloxane composition |
| WO1996011988A1 (fr) * | 1994-10-14 | 1996-04-25 | Dow Corning Toray Silicone Co., Ltd. | Composition pour resine de revetement en poudre |
| US6090890A (en) * | 1994-10-14 | 2000-07-18 | Dow Corning Toray Silicone Co., Ltd. | Resin composition for powder paints |
| JPH08239478A (ja) * | 1995-01-24 | 1996-09-17 | Wacker Chemie Gmbh | オルガノシロキサン樹脂粉末、該オルガノシロキサン樹脂粉末の製造法およびオルガノポリシロキサン組成物の製造法 |
| US6239245B1 (en) | 1999-03-02 | 2001-05-29 | Dow Corning Toray Silicone Company, Ltd. | Resin additive, curable resin composition, and cured resin |
| US6465550B1 (en) | 2000-08-08 | 2002-10-15 | Dow Corning Corporation | Silicone composition and electrically conductive, cured silicone product |
| US8093345B2 (en) | 2006-07-27 | 2012-01-10 | Dow Corning Corporation | Method of preparing a silicone resin |
| US8013056B2 (en) | 2007-12-26 | 2011-09-06 | Shin-Etsu Chemical Co., Ltd. | White heat-curable silicone resin composition, optoelectronic part case, and molding method |
| EP2075280A1 (en) | 2007-12-26 | 2009-07-01 | Shin-Etsu Chemical Co., Ltd. | White heat-curable silicone resin composition, optoelectric part case, and molding method |
| US8012381B2 (en) | 2008-06-09 | 2011-09-06 | Shin-Etsu Chemical Co., Ltd. | White heat-curable silicone resin composition and optoelectronic part case |
| US8173053B2 (en) | 2008-06-09 | 2012-05-08 | Shin-Etsu Chemical Co., Ltd. | White heat-curable silicone resin composition and optoelectronic part case |
| JP2012500878A (ja) * | 2008-08-28 | 2012-01-12 | ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツング | 温度安定性接着剤層の形成下での構成部材（Ｂａｕｔｅｉｌｅｎ）の接着法 |
| US8709201B2 (en) | 2008-08-28 | 2014-04-29 | Robert Bosch Gmbh | Method for gluing components, forming a temperature-resistant adhesive layer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6312489B2 (enrdf_load_stackoverflow) | 1988-03-19 |
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