JPS553412A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS553412A
JPS553412A JP7420278A JP7420278A JPS553412A JP S553412 A JPS553412 A JP S553412A JP 7420278 A JP7420278 A JP 7420278A JP 7420278 A JP7420278 A JP 7420278A JP S553412 A JPS553412 A JP S553412A
Authority
JP
Japan
Prior art keywords
epoxy resin
parts
silicone rubber
resin composition
carbon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7420278A
Other languages
Japanese (ja)
Inventor
Yasuo Hiyoshi
Tetsuo Tajima
Ataru Yokono
Tokio Isogai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP7420278A priority Critical patent/JPS553412A/en
Publication of JPS553412A publication Critical patent/JPS553412A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: The title composition having improved crack resistance without degrading properties of an epoxy resin, comprising a silicone rubber stably dispersed in the resin with a carbon fuctional silane as a dispersing agent.
CONSTITUTION: A composition comprising (A) 100 parts by wt. of an epoxy resin containing a curing agent, (B) 1W60 parts by wt. of a curable silicone rubber consisting of an organopolysiloxane, an organohydrogenpolysiloxane, and a catalytic amount of platinum, and (C) 0.1W20 parts by wt. of a carbon functional silane, obtained by reacting an aminoalkylalkoxysilane with an epoxy group-containing aldoxysilane at a molar ratio of the active hydrogen in the amino group to the epoxy group of 1: 0.5W2.0, as a dispersion stabilizer for the silicone rubber.
COPYRIGHT: (C)1980,JPO&Japio
JP7420278A 1978-06-21 1978-06-21 Epoxy resin composition Pending JPS553412A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7420278A JPS553412A (en) 1978-06-21 1978-06-21 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7420278A JPS553412A (en) 1978-06-21 1978-06-21 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS553412A true JPS553412A (en) 1980-01-11

Family

ID=13540356

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7420278A Pending JPS553412A (en) 1978-06-21 1978-06-21 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS553412A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5558055A (en) * 1978-10-24 1980-04-30 Suisanchiyou Chiyoukan Treating of euphausiacea
JPS573821A (en) * 1980-06-11 1982-01-09 Hitachi Ltd Epoxy resin composition
JPS58219218A (en) * 1982-06-15 1983-12-20 Toray Silicone Co Ltd Thermosetting epoxy resin composition
JPS5996122A (en) * 1982-11-22 1984-06-02 Toray Silicone Co Ltd Thermosetting epoxy resin composition
JPS61111320A (en) * 1985-09-05 1986-05-29 Sunstar Giken Kk Epoxy resin composition
JPS62270617A (en) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc Resin composition for semiconductor sealing
JPH01113453A (en) * 1987-10-27 1989-05-02 Matsushita Electric Works Ltd Epoxy resin composition
JPH01299816A (en) * 1988-05-26 1989-12-04 Matsushita Electric Works Ltd Epoxy resin composition
EP0818511A2 (en) * 1996-07-08 1998-01-14 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part
JP2018035293A (en) * 2016-09-01 2018-03-08 京セラ株式会社 Resin composition for insulation and coil product

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175752A (en) * 1974-12-23 1976-06-30 Dow Corning Ehokishijushi jukihorishirokisansoseibutsu
JPS5222051A (en) * 1975-08-13 1977-02-19 Shin Etsu Chem Co Ltd Autohesive silicone rubber composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5175752A (en) * 1974-12-23 1976-06-30 Dow Corning Ehokishijushi jukihorishirokisansoseibutsu
JPS5222051A (en) * 1975-08-13 1977-02-19 Shin Etsu Chem Co Ltd Autohesive silicone rubber composition

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6113773B2 (en) * 1978-10-24 1986-04-15 Suisancho Chokan
JPS5558055A (en) * 1978-10-24 1980-04-30 Suisanchiyou Chiyoukan Treating of euphausiacea
JPS573821A (en) * 1980-06-11 1982-01-09 Hitachi Ltd Epoxy resin composition
JPS621609B2 (en) * 1980-06-11 1987-01-14 Hitachi Ltd
JPS58219218A (en) * 1982-06-15 1983-12-20 Toray Silicone Co Ltd Thermosetting epoxy resin composition
JPS6228971B2 (en) * 1982-06-15 1987-06-23 Toray Silicone Co
JPS6312489B2 (en) * 1982-11-22 1988-03-19 Toray Silicone Co
JPS5996122A (en) * 1982-11-22 1984-06-02 Toray Silicone Co Ltd Thermosetting epoxy resin composition
JPS61111320A (en) * 1985-09-05 1986-05-29 Sunstar Giken Kk Epoxy resin composition
JPS6310165B2 (en) * 1985-09-05 1988-03-04 Sunstar Giken Kk
JPS62270617A (en) * 1986-05-20 1987-11-25 Mitsui Toatsu Chem Inc Resin composition for semiconductor sealing
JPH0531883B2 (en) * 1986-05-20 1993-05-13 Mitsui Toatsu Chemicals
JPH01113453A (en) * 1987-10-27 1989-05-02 Matsushita Electric Works Ltd Epoxy resin composition
JPH01299816A (en) * 1988-05-26 1989-12-04 Matsushita Electric Works Ltd Epoxy resin composition
EP0818511A2 (en) * 1996-07-08 1998-01-14 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part
EP0818511A3 (en) * 1996-07-08 1998-04-22 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part
US5872194A (en) * 1996-07-08 1999-02-16 Dow Corning Toray Silicone Co., Ltd. Curable liquid-form composition, cured product of the same, and electronic part
JP2018035293A (en) * 2016-09-01 2018-03-08 京セラ株式会社 Resin composition for insulation and coil product

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