JPS5994568A - 非貴金属基板上への半導体チツプの溶接取付け法 - Google Patents

非貴金属基板上への半導体チツプの溶接取付け法

Info

Publication number
JPS5994568A
JPS5994568A JP58136924A JP13692483A JPS5994568A JP S5994568 A JPS5994568 A JP S5994568A JP 58136924 A JP58136924 A JP 58136924A JP 13692483 A JP13692483 A JP 13692483A JP S5994568 A JPS5994568 A JP S5994568A
Authority
JP
Japan
Prior art keywords
semiconductor chip
metal substrate
precious metal
welding
brazing material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58136924A
Other languages
English (en)
Japanese (ja)
Inventor
ルチア−ノ・ガンドルフイ
アントニオ・グラツソ
アントニオ・ペルニチアロ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATES Componenti Elettronici SpA, SGS ATES Componenti Elettronici SpA filed Critical ATES Componenti Elettronici SpA
Publication of JPS5994568A publication Critical patent/JPS5994568A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H10W72/30—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H10W72/01365—
    • H10W72/073—
    • H10W72/07311—
    • H10W72/07336—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP58136924A 1982-11-19 1983-07-28 非貴金属基板上への半導体チツプの溶接取付け法 Pending JPS5994568A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT24328A/82 1982-11-19
IT8224328A IT1210953B (it) 1982-11-19 1982-11-19 Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.

Publications (1)

Publication Number Publication Date
JPS5994568A true JPS5994568A (ja) 1984-05-31

Family

ID=11213116

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58136924A Pending JPS5994568A (ja) 1982-11-19 1983-07-28 非貴金属基板上への半導体チツプの溶接取付け法

Country Status (9)

Country Link
US (1) US4615478A (enExample)
JP (1) JPS5994568A (enExample)
CH (1) CH656021A5 (enExample)
DE (1) DE3326322A1 (enExample)
FR (1) FR2536585B1 (enExample)
GB (1) GB2130946B (enExample)
IT (1) IT1210953B (enExample)
NL (1) NL190035C (enExample)
SG (1) SG89288G (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905690A1 (de) * 1989-02-24 1990-08-30 Forschungszentrum Juelich Gmbh Verfahren zum flussmittelfreien beschichten, traenken und loeten
US6267782B1 (en) * 1997-11-20 2001-07-31 St. Jude Medical, Inc. Medical article with adhered antimicrobial metal

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4962345A (enExample) * 1972-10-18 1974-06-17
JPS5666374A (en) * 1979-10-31 1981-06-04 Matsushita Electric Ind Co Ltd Soldering method
JPS5742175U (enExample) * 1980-08-14 1982-03-08
JPS5747579A (en) * 1980-09-02 1982-03-18 Mitsubishi Electric Corp Solder dipping method

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB424370A (en) * 1934-01-04 1935-02-20 Carl Banscher Improvements relating to the soldering of aluminium or aluminium alloys
GB891398A (en) * 1957-09-20 1962-03-14 Western Electric Co Improvements in or relating to methods of tinning and soldering zinc-containing surfaces and to solder joints including such surfaces
US3132419A (en) * 1959-06-06 1964-05-12 Takikawa Teizo Method for soldering silicon or a silicon alloy to a diefferent metal
NL271535A (enExample) * 1960-11-21 1900-01-01
NL260810A (enExample) * 1961-02-03
US3217401A (en) * 1962-06-08 1965-11-16 Transitron Electronic Corp Method of attaching metallic heads to silicon layers of semiconductor devices
US3378361A (en) * 1965-01-29 1968-04-16 Dexco Corp Method of making a tool for removing material from workpieces and product thereof
US3555669A (en) * 1967-12-15 1971-01-19 Int Rectifier Corp Process for soldering silicon wafers to contacts
DE1803489A1 (de) * 1968-10-17 1970-05-27 Siemens Ag Verfahren zum Herstellen eines Halbleiterbauelementes
US3665590A (en) * 1970-01-19 1972-05-30 Ncr Co Semiconductor flip-chip soldering method
US3680196A (en) * 1970-05-08 1972-08-01 Us Navy Process for bonding chip devices to hybrid circuitry
US3744121A (en) * 1970-08-15 1973-07-10 Asahi Glass Co Ltd Process for soldering difficultly solderable metals, such as si, ge, al, ti, zr and ta
US3735911A (en) * 1971-04-30 1973-05-29 Ibm Integrated circuit chip repair tool
GB1389542A (en) * 1971-06-17 1975-04-03 Mullard Ltd Methods of securing a semiconductor body to a support
US3923609A (en) * 1973-12-19 1975-12-02 Ppg Industries Inc Method of joining silicon metal
DE2511210C3 (de) * 1975-03-14 1980-03-06 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und Vorrichtung zum Tauchlöten von Halbleiterbauelementen
US4278195A (en) * 1978-12-01 1981-07-14 Honeywell Inc. Method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel and apparatus using such _a bonding technique
DE2923440A1 (de) * 1979-06-09 1980-12-11 Itt Ind Gmbh Deutsche Verfahren zum befestigen und/oder elektrischen verbinden von halbleiterkoerpern und/oder von deren elektrisch leitenden metallteilen
DE2939666C2 (de) * 1979-09-29 1982-07-15 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur lunkerfreien Verlötung eines metallisierten Halbleiterplättchens mit einem Träger

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4962345A (enExample) * 1972-10-18 1974-06-17
JPS5666374A (en) * 1979-10-31 1981-06-04 Matsushita Electric Ind Co Ltd Soldering method
JPS5742175U (enExample) * 1980-08-14 1982-03-08
JPS5747579A (en) * 1980-09-02 1982-03-18 Mitsubishi Electric Corp Solder dipping method

Also Published As

Publication number Publication date
GB8320040D0 (en) 1983-08-24
FR2536585B1 (fr) 1988-09-23
US4615478A (en) 1986-10-07
IT1210953B (it) 1989-09-29
FR2536585A1 (fr) 1984-05-25
DE3326322A1 (de) 1984-05-24
IT8224328A0 (it) 1982-11-19
NL190035B (nl) 1993-05-03
DE3326322C2 (enExample) 1989-12-21
GB2130946A (en) 1984-06-13
SG89288G (en) 1989-11-17
CH656021A5 (it) 1986-05-30
NL190035C (nl) 1993-10-01
GB2130946B (en) 1986-03-12
NL8302820A (nl) 1984-06-18

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