IT1210953B - Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile. - Google Patents

Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.

Info

Publication number
IT1210953B
IT1210953B IT8224328A IT2432882A IT1210953B IT 1210953 B IT1210953 B IT 1210953B IT 8224328 A IT8224328 A IT 8224328A IT 2432882 A IT2432882 A IT 2432882A IT 1210953 B IT1210953 B IT 1210953B
Authority
IT
Italy
Prior art keywords
noble metal
metal supports
semiconductor plates
welding semiconductor
welding
Prior art date
Application number
IT8224328A
Other languages
English (en)
Other versions
IT8224328A0 (it
Inventor
Luciano Gandolfi
Antonio Grasso
Antonio Perniciaro
Original Assignee
Ates Componenti Elettron
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ates Componenti Elettron filed Critical Ates Componenti Elettron
Publication of IT8224328A0 publication Critical patent/IT8224328A0/it
Priority to IT8224328A priority Critical patent/IT1210953B/it
Priority to US06/503,256 priority patent/US4615478A/en
Priority to FR8310873A priority patent/FR2536585B1/fr
Priority to DE19833326322 priority patent/DE3326322A1/de
Priority to GB08320040A priority patent/GB2130946B/en
Priority to JP58136924A priority patent/JPS5994568A/ja
Priority to NLAANVRAGE8302820,A priority patent/NL190035C/xx
Priority to CH5786/83A priority patent/CH656021A5/it
Priority to SG892/88A priority patent/SG89288G/en
Application granted granted Critical
Publication of IT1210953B publication Critical patent/IT1210953B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/83009—Pre-treatment of the layer connector or the bonding area
    • H01L2224/83048—Thermal treatments, e.g. annealing, controlled pre-heating or pre-cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01059—Praseodymium [Pr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
IT8224328A 1982-11-19 1982-11-19 Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile. IT1210953B (it)

Priority Applications (9)

Application Number Priority Date Filing Date Title
IT8224328A IT1210953B (it) 1982-11-19 1982-11-19 Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
US06/503,256 US4615478A (en) 1982-11-19 1983-06-10 Method for the soldering of semiconductor chips on supports of not-noble metal
FR8310873A FR2536585B1 (fr) 1982-11-19 1983-06-30 Procede pour le soudage de plaquettes de semi-conducteur sur supports de metal non noble
DE19833326322 DE3326322A1 (de) 1982-11-19 1983-07-21 Verfahren zum schweissen von halbleiterchips auf traeger aus nicht-edelmetallen
GB08320040A GB2130946B (en) 1982-11-19 1983-07-26 Improvements in or relating to methods of welding or soldering semiconductor chips or wires thereof on supports or to contacts of non-noble metal
JP58136924A JPS5994568A (ja) 1982-11-19 1983-07-28 非貴金属基板上への半導体チツプの溶接取付け法
NLAANVRAGE8302820,A NL190035C (nl) 1982-11-19 1983-08-11 Werkwijze voor het vastlassen van halfgeleiderchips op een ondergrond van niet-edelmetaal.
CH5786/83A CH656021A5 (it) 1982-11-19 1983-10-25 Procedimento per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.
SG892/88A SG89288G (en) 1982-11-19 1988-12-27 Improvements in or relating to methods of soldering semiconductor chips on supports of non-noble metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8224328A IT1210953B (it) 1982-11-19 1982-11-19 Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.

Publications (2)

Publication Number Publication Date
IT8224328A0 IT8224328A0 (it) 1982-11-19
IT1210953B true IT1210953B (it) 1989-09-29

Family

ID=11213116

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8224328A IT1210953B (it) 1982-11-19 1982-11-19 Metodo per la saldatura di piastrine di semiconduttore su supporti di metallo non nobile.

Country Status (9)

Country Link
US (1) US4615478A (it)
JP (1) JPS5994568A (it)
CH (1) CH656021A5 (it)
DE (1) DE3326322A1 (it)
FR (1) FR2536585B1 (it)
GB (1) GB2130946B (it)
IT (1) IT1210953B (it)
NL (1) NL190035C (it)
SG (1) SG89288G (it)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3905690A1 (de) * 1989-02-24 1990-08-30 Forschungszentrum Juelich Gmbh Verfahren zum flussmittelfreien beschichten, traenken und loeten
US6267782B1 (en) * 1997-11-20 2001-07-31 St. Jude Medical, Inc. Medical article with adhered antimicrobial metal

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB424370A (en) * 1934-01-04 1935-02-20 Carl Banscher Improvements relating to the soldering of aluminium or aluminium alloys
GB891398A (en) * 1957-09-20 1962-03-14 Western Electric Co Improvements in or relating to methods of tinning and soldering zinc-containing surfaces and to solder joints including such surfaces
US3132419A (en) * 1959-06-06 1964-05-12 Takikawa Teizo Method for soldering silicon or a silicon alloy to a diefferent metal
NL271535A (it) * 1960-11-21 1900-01-01
NL260810A (it) * 1961-02-03
US3217401A (en) * 1962-06-08 1965-11-16 Transitron Electronic Corp Method of attaching metallic heads to silicon layers of semiconductor devices
US3378361A (en) * 1965-01-29 1968-04-16 Dexco Corp Method of making a tool for removing material from workpieces and product thereof
US3555669A (en) * 1967-12-15 1971-01-19 Int Rectifier Corp Process for soldering silicon wafers to contacts
DE1803489A1 (de) * 1968-10-17 1970-05-27 Siemens Ag Verfahren zum Herstellen eines Halbleiterbauelementes
US3665590A (en) * 1970-01-19 1972-05-30 Ncr Co Semiconductor flip-chip soldering method
US3680196A (en) * 1970-05-08 1972-08-01 Us Navy Process for bonding chip devices to hybrid circuitry
US3744121A (en) * 1970-08-15 1973-07-10 Asahi Glass Co Ltd Process for soldering difficultly solderable metals, such as si, ge, al, ti, zr and ta
US3735911A (en) * 1971-04-30 1973-05-29 Ibm Integrated circuit chip repair tool
GB1389542A (en) * 1971-06-17 1975-04-03 Mullard Ltd Methods of securing a semiconductor body to a support
JPS4962345A (it) * 1972-10-18 1974-06-17
US3923609A (en) * 1973-12-19 1975-12-02 Ppg Industries Inc Method of joining silicon metal
DE2511210C3 (de) * 1975-03-14 1980-03-06 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren und Vorrichtung zum Tauchlöten von Halbleiterbauelementen
US4278195A (en) * 1978-12-01 1981-07-14 Honeywell Inc. Method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel and apparatus using such _a bonding technique
DE2923440A1 (de) * 1979-06-09 1980-12-11 Itt Ind Gmbh Deutsche Verfahren zum befestigen und/oder elektrischen verbinden von halbleiterkoerpern und/oder von deren elektrisch leitenden metallteilen
DE2939666C2 (de) * 1979-09-29 1982-07-15 Robert Bosch Gmbh, 7000 Stuttgart Verfahren zur lunkerfreien Verlötung eines metallisierten Halbleiterplättchens mit einem Träger
JPS5666374A (en) * 1979-10-31 1981-06-04 Matsushita Electric Ind Co Ltd Soldering method
JPS6133262Y2 (it) * 1980-08-14 1986-09-29
JPS5747579A (en) * 1980-09-02 1982-03-18 Mitsubishi Electric Corp Solder dipping method

Also Published As

Publication number Publication date
FR2536585B1 (fr) 1988-09-23
GB2130946B (en) 1986-03-12
NL190035C (nl) 1993-10-01
FR2536585A1 (fr) 1984-05-25
GB8320040D0 (en) 1983-08-24
US4615478A (en) 1986-10-07
DE3326322A1 (de) 1984-05-24
IT8224328A0 (it) 1982-11-19
NL190035B (nl) 1993-05-03
NL8302820A (nl) 1984-06-18
GB2130946A (en) 1984-06-13
JPS5994568A (ja) 1984-05-31
CH656021A5 (it) 1986-05-30
SG89288G (en) 1989-11-17
DE3326322C2 (it) 1989-12-21

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TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19971129