JPS5990940A - 半導体素子の製造方法 - Google Patents

半導体素子の製造方法

Info

Publication number
JPS5990940A
JPS5990940A JP57201545A JP20154582A JPS5990940A JP S5990940 A JPS5990940 A JP S5990940A JP 57201545 A JP57201545 A JP 57201545A JP 20154582 A JP20154582 A JP 20154582A JP S5990940 A JPS5990940 A JP S5990940A
Authority
JP
Japan
Prior art keywords
crystal body
crystal
adhesive tape
flaw
shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57201545A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6226183B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Hideaki Noguchi
英明 野口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP57201545A priority Critical patent/JPS5990940A/ja
Publication of JPS5990940A publication Critical patent/JPS5990940A/ja
Publication of JPS6226183B2 publication Critical patent/JPS6226183B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
  • Semiconductor Lasers (AREA)
JP57201545A 1982-11-17 1982-11-17 半導体素子の製造方法 Granted JPS5990940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57201545A JPS5990940A (ja) 1982-11-17 1982-11-17 半導体素子の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57201545A JPS5990940A (ja) 1982-11-17 1982-11-17 半導体素子の製造方法

Publications (2)

Publication Number Publication Date
JPS5990940A true JPS5990940A (ja) 1984-05-25
JPS6226183B2 JPS6226183B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-08

Family

ID=16442821

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57201545A Granted JPS5990940A (ja) 1982-11-17 1982-11-17 半導体素子の製造方法

Country Status (1)

Country Link
JP (1) JPS5990940A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116591A (ja) * 1984-07-02 1986-01-24 Rohm Co Ltd 半導体レ−ザのチツプ製造方法
US5393707A (en) * 1992-07-31 1995-02-28 Northern Telecom Limited Semiconductor - slice cleaving
WO2002056365A3 (de) * 2001-01-16 2002-12-05 Osram Opto Semiconductors Gmbh Verfahren zum vereinzeln von wafern in chips

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6116591A (ja) * 1984-07-02 1986-01-24 Rohm Co Ltd 半導体レ−ザのチツプ製造方法
US5393707A (en) * 1992-07-31 1995-02-28 Northern Telecom Limited Semiconductor - slice cleaving
WO2002056365A3 (de) * 2001-01-16 2002-12-05 Osram Opto Semiconductors Gmbh Verfahren zum vereinzeln von wafern in chips
US6833284B2 (en) 2001-01-16 2004-12-21 Osram Opto Semiconductors Gmbh Method for subdividing wafers into chips

Also Published As

Publication number Publication date
JPS6226183B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1987-06-08

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