JPS5988861A - 金属リ−ドと電極との接合方法 - Google Patents

金属リ−ドと電極との接合方法

Info

Publication number
JPS5988861A
JPS5988861A JP57199204A JP19920482A JPS5988861A JP S5988861 A JPS5988861 A JP S5988861A JP 57199204 A JP57199204 A JP 57199204A JP 19920482 A JP19920482 A JP 19920482A JP S5988861 A JPS5988861 A JP S5988861A
Authority
JP
Japan
Prior art keywords
metal
metallic
width
lead
protrusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57199204A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234143B2 (enExample
Inventor
Kenzo Hatada
畑田　賢造
Isamu Kitahiro
北広　勇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57199204A priority Critical patent/JPS5988861A/ja
Publication of JPS5988861A publication Critical patent/JPS5988861A/ja
Publication of JPS6234143B2 publication Critical patent/JPS6234143B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials

Landscapes

  • Wire Bonding (AREA)
JP57199204A 1982-11-12 1982-11-12 金属リ−ドと電極との接合方法 Granted JPS5988861A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57199204A JPS5988861A (ja) 1982-11-12 1982-11-12 金属リ−ドと電極との接合方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57199204A JPS5988861A (ja) 1982-11-12 1982-11-12 金属リ−ドと電極との接合方法

Publications (2)

Publication Number Publication Date
JPS5988861A true JPS5988861A (ja) 1984-05-22
JPS6234143B2 JPS6234143B2 (enExample) 1987-07-24

Family

ID=16403867

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57199204A Granted JPS5988861A (ja) 1982-11-12 1982-11-12 金属リ−ドと電極との接合方法

Country Status (1)

Country Link
JP (1) JPS5988861A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
EP0821407A3 (en) * 1996-02-23 1998-03-04 Matsushita Electric Industrial Co., Ltd. Semiconductor devices having protruding contacts and method for making the same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US5090119A (en) * 1987-12-08 1992-02-25 Matsushita Electric Industrial Co., Ltd. Method of forming an electrical contact bump
EP0821407A3 (en) * 1996-02-23 1998-03-04 Matsushita Electric Industrial Co., Ltd. Semiconductor devices having protruding contacts and method for making the same
US5952718A (en) * 1996-02-23 1999-09-14 Matsushita Electric Industrial Co., Ltd. Semiconductor devices having protruding contacts
US6107120A (en) * 1996-02-23 2000-08-22 Matsushita Electric Indsutrial Co., Ltd. Method of making semiconductor devices having protruding contacts

Also Published As

Publication number Publication date
JPS6234143B2 (enExample) 1987-07-24

Similar Documents

Publication Publication Date Title
US6368896B2 (en) Method of wafer level chip scale packaging
EP0513521B1 (en) Method of forming a planarized thin film surface covered wire bonded semiconductor package
US4494688A (en) Method of connecting metal leads with electrodes of semiconductor device and metal lead therefore
US6911355B2 (en) Semiconductor package having flex circuit with external contacts
JPH10270624A (ja) チップサイズパッケージ及びその製造方法
JP2002543604A (ja) カプセル化電子部品の製造方法
TW200522231A (en) Method of manufacturing a semiconductor device
US20020192875A1 (en) Method for fabricating a circuit device
JPS59139636A (ja) ボンデイング方法
JP2002343904A (ja) 半導体装置
JPS5988861A (ja) 金属リ−ドと電極との接合方法
JPH0214779B2 (enExample)
TWI320955B (en) Method of making exposed pad ball grid array package
JPH09148378A (ja) Ｉｃカード用ｉｃモジュールとその製造方法および当該ｉｃモジュールを使用したｉｃカード
JPS59139635A (ja) ボンデイング方法
JP4148593B2 (ja) 半導体装置の製造方法
JP3267422B2 (ja) バンプ転写体および半導体集積回路装置の製造方法
JP2001077266A (ja) 樹脂封止型半導体装置の製造方法
JPS6118157A (ja) 半導体装置
KR100422271B1 (ko) 마이크로 비지에이 방식 반도체 패키지의 빔 리드
JPH11251512A (ja) 半導体チップの積層方法およびこれを用いた半導体装置
JPS5940539A (ja) 半導体装置およびその製造方法
JPH11163253A (ja) 半導体チップの実装構造、半導体装置および半導体装置の製造方法
JPS6290939A (ja) 半導体装置
JP2675077B2 (ja) 半導体装置用リードフレーム