JPS5988839A - 半導体装置用リードの位置認識方法 - Google Patents

半導体装置用リードの位置認識方法

Info

Publication number
JPS5988839A
JPS5988839A JP57197595A JP19759582A JPS5988839A JP S5988839 A JPS5988839 A JP S5988839A JP 57197595 A JP57197595 A JP 57197595A JP 19759582 A JP19759582 A JP 19759582A JP S5988839 A JPS5988839 A JP S5988839A
Authority
JP
Japan
Prior art keywords
leads
recognition
field
view
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57197595A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0220144B2 (cg-RX-API-DMAC10.html
Inventor
Nobuhiro Takasugi
高杉　信博
Ryuichi Kyomasu
隆一 京増
Yoshikazu Suzumura
鈴村　芳和
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP57197595A priority Critical patent/JPS5988839A/ja
Publication of JPS5988839A publication Critical patent/JPS5988839A/ja
Publication of JPH0220144B2 publication Critical patent/JPH0220144B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W99/00—
    • H10W72/0711—

Landscapes

  • Wire Bonding (AREA)
JP57197595A 1982-11-12 1982-11-12 半導体装置用リードの位置認識方法 Granted JPS5988839A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57197595A JPS5988839A (ja) 1982-11-12 1982-11-12 半導体装置用リードの位置認識方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197595A JPS5988839A (ja) 1982-11-12 1982-11-12 半導体装置用リードの位置認識方法

Publications (2)

Publication Number Publication Date
JPS5988839A true JPS5988839A (ja) 1984-05-22
JPH0220144B2 JPH0220144B2 (cg-RX-API-DMAC10.html) 1990-05-08

Family

ID=16377094

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57197595A Granted JPS5988839A (ja) 1982-11-12 1982-11-12 半導体装置用リードの位置認識方法

Country Status (1)

Country Link
JP (1) JPS5988839A (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10921365B2 (en) * 2019-04-11 2021-02-16 Arista Networks, Inc. High-potential testing of conductive lands of a printed circuit board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5270008A (en) * 1991-10-09 1993-12-14 Avl Medical Instruments Ag Analyzing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10921365B2 (en) * 2019-04-11 2021-02-16 Arista Networks, Inc. High-potential testing of conductive lands of a printed circuit board

Also Published As

Publication number Publication date
JPH0220144B2 (cg-RX-API-DMAC10.html) 1990-05-08

Similar Documents

Publication Publication Date Title
JP3137687B2 (ja) ターゲットボンディング点自動教育方法
JPS5988839A (ja) 半導体装置用リードの位置認識方法
JPH0758725B2 (ja) 半導体ウェハ
JP2022100240A (ja) マイクロ集積回路の大規模テスト
JP2534912B2 (ja) ワイヤボンディング装置
JPH0547820A (ja) ワイヤボンデイング方法
KR100231274B1 (ko) 패턴 인식 장치 및 이를 이용한 그라운드 본딩 위치 인식 방법
JPS5867033A (ja) ワイヤボンデイング方法
JPS58200548A (ja) リ−ド認識装置
JP3300264B2 (ja) 半導体チップ認識方法
JPH0691124B2 (ja) Ｉｃパッケージ
JP2609591B2 (ja) 集積回路装置の製造方法
JPH0131693B2 (cg-RX-API-DMAC10.html)
JPS6126116A (ja) 位置合せ装置
JPH04144266A (ja) 混成集積回路の製造方法
JPH0685016A (ja) 半導体チップ検査装置
JPH0793413B2 (ja) 半導体装置の製造方法
JP3000728B2 (ja) バランス配線方式
JPS5927095B2 (ja) フルオ−トワイヤボンディングのパタ−ン検出方法
JPS60161627A (ja) 認識方法
JPH0438135B2 (cg-RX-API-DMAC10.html)
JPS60189230A (ja) ワイヤボンデイング装置
JPH02148746A (ja) ワイヤボンディング装置
JP2685137B2 (ja) ワイヤボンダ
JPS62117336A (ja) ワイアボンデイング方式