JPS5986233A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS5986233A
JPS5986233A JP57197202A JP19720282A JPS5986233A JP S5986233 A JPS5986233 A JP S5986233A JP 57197202 A JP57197202 A JP 57197202A JP 19720282 A JP19720282 A JP 19720282A JP S5986233 A JPS5986233 A JP S5986233A
Authority
JP
Japan
Prior art keywords
bonding
wire
capillary
height
loop
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57197202A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129059B2 (enExample
Inventor
Hitoshi Fujimoto
藤本 仁士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57197202A priority Critical patent/JPS5986233A/ja
Publication of JPS5986233A publication Critical patent/JPS5986233A/ja
Publication of JPH0129059B2 publication Critical patent/JPH0129059B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/01551
    • H10W72/07141
    • H10W72/075
    • H10W72/07511
    • H10W72/07521
    • H10W72/536
    • H10W72/5363
    • H10W72/552
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
JP57197202A 1982-11-08 1982-11-08 ワイヤボンデイング装置 Granted JPS5986233A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57197202A JPS5986233A (ja) 1982-11-08 1982-11-08 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57197202A JPS5986233A (ja) 1982-11-08 1982-11-08 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS5986233A true JPS5986233A (ja) 1984-05-18
JPH0129059B2 JPH0129059B2 (enExample) 1989-06-07

Family

ID=16370509

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57197202A Granted JPS5986233A (ja) 1982-11-08 1982-11-08 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5986233A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109804A (ja) * 1991-10-17 1993-04-30 Kaijo Corp ワイヤボンデイング方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501648A (enExample) * 1973-05-07 1975-01-09
JPS571238A (en) * 1980-06-03 1982-01-06 Fujitsu Ltd Bonding of wire

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS501648A (enExample) * 1973-05-07 1975-01-09
JPS571238A (en) * 1980-06-03 1982-01-06 Fujitsu Ltd Bonding of wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05109804A (ja) * 1991-10-17 1993-04-30 Kaijo Corp ワイヤボンデイング方法

Also Published As

Publication number Publication date
JPH0129059B2 (enExample) 1989-06-07

Similar Documents

Publication Publication Date Title
US6995469B2 (en) Semiconductor apparatus and fabricating method for the same
JP2003197669A (ja) ボンディング方法及びボンディング装置
JP2011077193A (ja) 半導体装置の製造方法
EP0361283B1 (en) Resin-sealed type semiconductor device and method for manufacturing the same
JPS5986233A (ja) ワイヤボンデイング装置
JPH04294552A (ja) ワイヤーボンディング方法
JPS5910229A (ja) 半導体装置およびその製造方法
JP3232824B2 (ja) 熱圧着用ツール、バンプ形成方法およびリード接合方法
US3664567A (en) Arm assembly for bonding apparatus
JP2633386B2 (ja) 半導体装置の製造方法および半導体装置の製造装置
KR970007598B1 (ko) 와이어 본딩방법
JPH0563011A (ja) ダイボンダー・ヘツドの構造
JPH07130749A (ja) 電子部品のリード接合装置並びに接合方法
JP2928590B2 (ja) ワイヤボンディング方法
JPS62150854A (ja) 電極形成方法および装置
JPH0522384B2 (enExample)
JPH04324942A (ja) ワイヤボンディング方法
JPS63296248A (ja) ボ−ルバンプ形成方法及びその装置
JPH07235562A (ja) ウエッジボンディング装置
JPS5826663B2 (ja) ワイヤボンディング方法
JPS6135545A (ja) 半導体装置の製造方法
JPH0565052B2 (enExample)
KR19980027876A (ko) 와이어 본딩 장치의 본더 헤드
JPH0458694B2 (enExample)
JPH02161737A (ja) ワイヤボンディング方法