JPS5984464A - 半導体集積回路装置の製造方法 - Google Patents
半導体集積回路装置の製造方法Info
- Publication number
- JPS5984464A JPS5984464A JP57195442A JP19544282A JPS5984464A JP S5984464 A JPS5984464 A JP S5984464A JP 57195442 A JP57195442 A JP 57195442A JP 19544282 A JP19544282 A JP 19544282A JP S5984464 A JPS5984464 A JP S5984464A
- Authority
- JP
- Japan
- Prior art keywords
- film
- base
- collector
- forming
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
- H10D84/0116—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs the components including integrated injection logic [I2L]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
Landscapes
- Bipolar Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57195442A JPS5984464A (ja) | 1982-11-06 | 1982-11-06 | 半導体集積回路装置の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57195442A JPS5984464A (ja) | 1982-11-06 | 1982-11-06 | 半導体集積回路装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5984464A true JPS5984464A (ja) | 1984-05-16 |
JPS6248388B2 JPS6248388B2 (enrdf_load_stackoverflow) | 1987-10-13 |
Family
ID=16341128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57195442A Granted JPS5984464A (ja) | 1982-11-06 | 1982-11-06 | 半導体集積回路装置の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5984464A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0430590U (enrdf_load_stackoverflow) * | 1990-07-03 | 1992-03-11 |
-
1982
- 1982-11-06 JP JP57195442A patent/JPS5984464A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4774634A (en) * | 1986-01-21 | 1988-09-27 | Key Tronic Corporation | Printed circuit board assembly |
Also Published As
Publication number | Publication date |
---|---|
JPS6248388B2 (enrdf_load_stackoverflow) | 1987-10-13 |
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