JPS598054B2 - 多数の電気コンポネントを含む統合母体の製造方法 - Google Patents
多数の電気コンポネントを含む統合母体の製造方法Info
- Publication number
- JPS598054B2 JPS598054B2 JP49099064A JP9906474A JPS598054B2 JP S598054 B2 JPS598054 B2 JP S598054B2 JP 49099064 A JP49099064 A JP 49099064A JP 9906474 A JP9906474 A JP 9906474A JP S598054 B2 JPS598054 B2 JP S598054B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical
- inductor
- series
- circuit
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US43935074A | 1974-02-04 | 1974-02-04 | |
US439350 | 1974-02-04 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS50109465A JPS50109465A (pl) | 1975-08-28 |
JPS598054B2 true JPS598054B2 (ja) | 1984-02-22 |
Family
ID=23744360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP49099064A Expired JPS598054B2 (ja) | 1974-02-04 | 1974-08-30 | 多数の電気コンポネントを含む統合母体の製造方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS598054B2 (pl) |
CA (1) | CA1016268A (pl) |
DE (1) | DE2446582A1 (pl) |
FR (1) | FR2260256B1 (pl) |
GB (1) | GB1478354A (pl) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62125817U (pl) * | 1986-02-01 | 1987-08-10 | ||
JP6389998B1 (ja) * | 2017-11-28 | 2018-09-19 | 株式会社野田スクリーン | Lc共振素子および共振素子アレイ |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5467241U (pl) * | 1977-10-21 | 1979-05-12 | ||
GB2045540B (en) * | 1978-12-28 | 1983-08-03 | Tdk Electronics Co Ltd | Electrical inductive device |
JPS6031243Y2 (ja) * | 1980-08-15 | 1985-09-18 | ティーディーケイ株式会社 | 複合部品 |
JP3073035B2 (ja) * | 1991-02-21 | 2000-08-07 | 毅 池田 | Lcノイズフィルタ |
DE102008004470A1 (de) | 2007-12-05 | 2009-06-10 | Rohde & Schwarz Gmbh & Co. Kg | Elektrische Schaltungsanordnung mit konzentrierten Elementen in Mehrlagensubstraten |
-
1974
- 1974-07-26 GB GB3314674A patent/GB1478354A/en not_active Expired
- 1974-07-30 CA CA205,947A patent/CA1016268A/en not_active Expired
- 1974-08-30 JP JP49099064A patent/JPS598054B2/ja not_active Expired
- 1974-09-10 FR FR7430577A patent/FR2260256B1/fr not_active Expired
- 1974-09-30 DE DE19742446582 patent/DE2446582A1/de active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62125817U (pl) * | 1986-02-01 | 1987-08-10 | ||
JP6389998B1 (ja) * | 2017-11-28 | 2018-09-19 | 株式会社野田スクリーン | Lc共振素子および共振素子アレイ |
WO2019106705A1 (ja) * | 2017-11-28 | 2019-06-06 | 株式会社野田スクリーン | Lc共振素子および共振素子アレイ |
Also Published As
Publication number | Publication date |
---|---|
GB1478354A (en) | 1977-06-29 |
CA1016268A (en) | 1977-08-23 |
JPS50109465A (pl) | 1975-08-28 |
DE2446582A1 (de) | 1975-08-14 |
FR2260256B1 (pl) | 1980-04-04 |
FR2260256A1 (pl) | 1975-08-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4342143A (en) | Method of making multiple electrical components in integrated microminiature form | |
US4322698A (en) | Laminated electronic parts and process for making the same | |
US5602517A (en) | Laminate type LC composite device having coils with opposing directions and adjacent leads | |
JPS6379307A (ja) | 積層トランス | |
JPH06260364A (ja) | チップ部品 | |
US4367450A (en) | Electrical reactor construction | |
JP2976971B1 (ja) | 同相型インダクタ | |
JPS598054B2 (ja) | 多数の電気コンポネントを含む統合母体の製造方法 | |
JPH08138937A (ja) | 積層型コモンモードチョークコイル | |
JPS5923458B2 (ja) | 複合部品 | |
JP3093578U (ja) | 多層回路基板 | |
KR920017230A (ko) | 적층형 lc소자 | |
JPH02184008A (ja) | ヒューズ付積層コンデンサ | |
JPS6228891B2 (pl) | ||
JPH0757971A (ja) | 複合セラミックコンデンサ | |
JPS637016B2 (pl) | ||
JPH10190391A (ja) | 積層型lcフィルタ | |
JPH0878991A (ja) | チップ型lcフィルタ素子 | |
JP3139270B2 (ja) | Lc複合部品 | |
JPH09298115A (ja) | 積層型インダクタ | |
JPS5976455A (ja) | 混成集積回路 | |
JPH03263311A (ja) | 積層複合部品 | |
JPH04274305A (ja) | 積層コイル | |
JPH11176640A (ja) | 積層型電子部品 | |
JPH08316100A (ja) | 積層複合部品 |