JPS5963738A - 誘電体分離基板の製造方法 - Google Patents
誘電体分離基板の製造方法Info
- Publication number
- JPS5963738A JPS5963738A JP17426382A JP17426382A JPS5963738A JP S5963738 A JPS5963738 A JP S5963738A JP 17426382 A JP17426382 A JP 17426382A JP 17426382 A JP17426382 A JP 17426382A JP S5963738 A JPS5963738 A JP S5963738A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- silicon
- sio2
- polycrystalline silicon
- single crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 33
- 238000002955 isolation Methods 0.000 title claims description 14
- 238000004519 manufacturing process Methods 0.000 title claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 56
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 34
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 14
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 27
- 239000000377 silicon dioxide Substances 0.000 abstract description 27
- 229910052581 Si3N4 Inorganic materials 0.000 abstract description 7
- 229910021426 porous silicon Inorganic materials 0.000 abstract description 4
- 238000005498 polishing Methods 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- 229910052681 coesite Inorganic materials 0.000 abstract 6
- 229910052906 cristobalite Inorganic materials 0.000 abstract 6
- 229910052682 stishovite Inorganic materials 0.000 abstract 6
- 229910052905 tridymite Inorganic materials 0.000 abstract 6
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 6
- 238000002048 anodisation reaction Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/76297—Dielectric isolation using EPIC techniques, i.e. epitaxial passivated integrated circuit
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Element Separation (AREA)
- Local Oxidation Of Silicon (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17426382A JPS5963738A (ja) | 1982-10-04 | 1982-10-04 | 誘電体分離基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17426382A JPS5963738A (ja) | 1982-10-04 | 1982-10-04 | 誘電体分離基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5963738A true JPS5963738A (ja) | 1984-04-11 |
JPS6244417B2 JPS6244417B2 (enrdf_load_stackoverflow) | 1987-09-21 |
Family
ID=15975575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17426382A Granted JPS5963738A (ja) | 1982-10-04 | 1982-10-04 | 誘電体分離基板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5963738A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5382551A (en) * | 1993-04-09 | 1995-01-17 | Micron Semiconductor, Inc. | Method for reducing the effects of semiconductor substrate deformities |
-
1982
- 1982-10-04 JP JP17426382A patent/JPS5963738A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5382551A (en) * | 1993-04-09 | 1995-01-17 | Micron Semiconductor, Inc. | Method for reducing the effects of semiconductor substrate deformities |
Also Published As
Publication number | Publication date |
---|---|
JPS6244417B2 (enrdf_load_stackoverflow) | 1987-09-21 |
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