JPS5961054A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5961054A
JPS5961054A JP57169515A JP16951582A JPS5961054A JP S5961054 A JPS5961054 A JP S5961054A JP 57169515 A JP57169515 A JP 57169515A JP 16951582 A JP16951582 A JP 16951582A JP S5961054 A JPS5961054 A JP S5961054A
Authority
JP
Japan
Prior art keywords
layer
alumina
lead
semiconductor device
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57169515A
Other languages
English (en)
Japanese (ja)
Other versions
JPS638621B2 (enExample
Inventor
Masahiro Sugimoto
杉本　正浩
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP57169515A priority Critical patent/JPS5961054A/ja
Publication of JPS5961054A publication Critical patent/JPS5961054A/ja
Publication of JPS638621B2 publication Critical patent/JPS638621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57169515A 1982-09-30 1982-09-30 半導体装置 Granted JPS5961054A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57169515A JPS5961054A (ja) 1982-09-30 1982-09-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57169515A JPS5961054A (ja) 1982-09-30 1982-09-30 半導体装置

Publications (2)

Publication Number Publication Date
JPS5961054A true JPS5961054A (ja) 1984-04-07
JPS638621B2 JPS638621B2 (enExample) 1988-02-23

Family

ID=15887933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57169515A Granted JPS5961054A (ja) 1982-09-30 1982-09-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS5961054A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054652A (en) * 1997-04-18 2000-04-25 Fujitsu Limited Thin-film multi-layer substrate and electronic device
US8096039B2 (en) 2003-08-11 2012-01-17 Cobra Golf Incorporated Golf club head with alignment system
US8308583B2 (en) 2003-08-11 2012-11-13 Cobra Golf Incorporated Golf club head with alignment system

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6054652A (en) * 1997-04-18 2000-04-25 Fujitsu Limited Thin-film multi-layer substrate and electronic device
US8096039B2 (en) 2003-08-11 2012-01-17 Cobra Golf Incorporated Golf club head with alignment system
US8308583B2 (en) 2003-08-11 2012-11-13 Cobra Golf Incorporated Golf club head with alignment system

Also Published As

Publication number Publication date
JPS638621B2 (enExample) 1988-02-23

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