JPS5954250A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5954250A
JPS5954250A JP57163221A JP16322182A JPS5954250A JP S5954250 A JPS5954250 A JP S5954250A JP 57163221 A JP57163221 A JP 57163221A JP 16322182 A JP16322182 A JP 16322182A JP S5954250 A JPS5954250 A JP S5954250A
Authority
JP
Japan
Prior art keywords
lead
pellet
mounting part
specified
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57163221A
Other languages
English (en)
Japanese (ja)
Other versions
JPS638618B2 (enExample
Inventor
Iwami Abiki
吾孫木　岩身
Toyohiko Nakamura
豊彦 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Rectifier Corp Japan Ltd
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Corp Japan Ltd
Infineon Technologies Americas Corp
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Corp Japan Ltd, Infineon Technologies Americas Corp, International Rectifier Corp USA filed Critical International Rectifier Corp Japan Ltd
Priority to JP57163221A priority Critical patent/JPS5954250A/ja
Publication of JPS5954250A publication Critical patent/JPS5954250A/ja
Publication of JPS638618B2 publication Critical patent/JPS638618B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/461—
    • H10W70/427—
    • H10W72/5449—
    • H10W72/60—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
JP57163221A 1982-09-21 1982-09-21 半導体装置 Granted JPS5954250A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57163221A JPS5954250A (ja) 1982-09-21 1982-09-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57163221A JPS5954250A (ja) 1982-09-21 1982-09-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS5954250A true JPS5954250A (ja) 1984-03-29
JPS638618B2 JPS638618B2 (enExample) 1988-02-23

Family

ID=15769610

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57163221A Granted JPS5954250A (ja) 1982-09-21 1982-09-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS5954250A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4675718A (en) * 1985-06-17 1987-06-23 Yazaki Corporation Diode-containing connector
EP0785575A3 (en) * 1996-01-17 1998-09-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor module
WO2005086218A1 (ja) * 2004-03-02 2005-09-15 Fuji Electric Holdings Co., Ltd. 半導体モジュールの製造方法
US7670879B2 (en) 2002-08-30 2010-03-02 Fuji Electric Holdings Co., Ltd. Manufacturing method of semiconductor module including solid-liquid diffusion joining steps

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838070A (enExample) * 1971-09-16 1973-06-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4838070A (enExample) * 1971-09-16 1973-06-05

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4675718A (en) * 1985-06-17 1987-06-23 Yazaki Corporation Diode-containing connector
EP0785575A3 (en) * 1996-01-17 1998-09-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor device and semiconductor module
US7670879B2 (en) 2002-08-30 2010-03-02 Fuji Electric Holdings Co., Ltd. Manufacturing method of semiconductor module including solid-liquid diffusion joining steps
WO2005086218A1 (ja) * 2004-03-02 2005-09-15 Fuji Electric Holdings Co., Ltd. 半導体モジュールの製造方法
JPWO2005086218A1 (ja) * 2004-03-02 2008-01-24 富士電機ホールディングス株式会社 半導体モジュールの製造方法
JP4508189B2 (ja) * 2004-03-02 2010-07-21 富士電機ホールディングス株式会社 半導体モジュールの製造方法

Also Published As

Publication number Publication date
JPS638618B2 (enExample) 1988-02-23

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