JPS4838070A - - Google Patents
Info
- Publication number
- JPS4838070A JPS4838070A JP46071181A JP7118171A JPS4838070A JP S4838070 A JPS4838070 A JP S4838070A JP 46071181 A JP46071181 A JP 46071181A JP 7118171 A JP7118171 A JP 7118171A JP S4838070 A JPS4838070 A JP S4838070A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10166—Transistor
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46071181A JPS5224832B2 (enExample) | 1971-09-16 | 1971-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP46071181A JPS5224832B2 (enExample) | 1971-09-16 | 1971-09-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4838070A true JPS4838070A (enExample) | 1973-06-05 |
| JPS5224832B2 JPS5224832B2 (enExample) | 1977-07-04 |
Family
ID=13453213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP46071181A Expired JPS5224832B2 (enExample) | 1971-09-16 | 1971-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5224832B2 (enExample) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50149565A (enExample) * | 1974-05-22 | 1975-11-29 | ||
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS5954250A (ja) * | 1982-09-21 | 1984-03-29 | Internatl Rectifier Corp Japan Ltd | 半導体装置 |
| US5209418A (en) * | 1985-04-24 | 1993-05-11 | Alexander Machinery, Inc. | Web unwinding apparatus and method |
| US6005287A (en) * | 1995-11-24 | 1999-12-21 | Nec Corporation | Semiconductor device, and lead frame used therefor |
| DE112014007018B4 (de) * | 2014-10-03 | 2021-04-29 | Mitsubishi Electric Corp. | Leiterrahmen und Verfahren für eine Fertigung einer Halbleitervorrichtung |
-
1971
- 1971-09-16 JP JP46071181A patent/JPS5224832B2/ja not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50149565A (enExample) * | 1974-05-22 | 1975-11-29 | ||
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS5954250A (ja) * | 1982-09-21 | 1984-03-29 | Internatl Rectifier Corp Japan Ltd | 半導体装置 |
| US5209418A (en) * | 1985-04-24 | 1993-05-11 | Alexander Machinery, Inc. | Web unwinding apparatus and method |
| US6005287A (en) * | 1995-11-24 | 1999-12-21 | Nec Corporation | Semiconductor device, and lead frame used therefor |
| DE112014007018B4 (de) * | 2014-10-03 | 2021-04-29 | Mitsubishi Electric Corp. | Leiterrahmen und Verfahren für eine Fertigung einer Halbleitervorrichtung |
| US11387173B2 (en) | 2014-10-03 | 2022-07-12 | Mitsubishi Electric Corporation | Method for manufacturing semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5224832B2 (enExample) | 1977-07-04 |