JPS5940555A - 電子部品の製造方法 - Google Patents

電子部品の製造方法

Info

Publication number
JPS5940555A
JPS5940555A JP57149334A JP14933482A JPS5940555A JP S5940555 A JPS5940555 A JP S5940555A JP 57149334 A JP57149334 A JP 57149334A JP 14933482 A JP14933482 A JP 14933482A JP S5940555 A JPS5940555 A JP S5940555A
Authority
JP
Japan
Prior art keywords
glass tube
lead
large diameter
small diameter
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57149334A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129070B2 (enExample
Inventor
Hajime Terakado
寺門　肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57149334A priority Critical patent/JPS5940555A/ja
Publication of JPS5940555A publication Critical patent/JPS5940555A/ja
Publication of JPH0129070B2 publication Critical patent/JPH0129070B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
JP57149334A 1982-08-30 1982-08-30 電子部品の製造方法 Granted JPS5940555A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57149334A JPS5940555A (ja) 1982-08-30 1982-08-30 電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57149334A JPS5940555A (ja) 1982-08-30 1982-08-30 電子部品の製造方法

Publications (2)

Publication Number Publication Date
JPS5940555A true JPS5940555A (ja) 1984-03-06
JPH0129070B2 JPH0129070B2 (enExample) 1989-06-07

Family

ID=15472831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57149334A Granted JPS5940555A (ja) 1982-08-30 1982-08-30 電子部品の製造方法

Country Status (1)

Country Link
JP (1) JPS5940555A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201945U (enExample) * 1986-06-12 1987-12-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62201945U (enExample) * 1986-06-12 1987-12-23

Also Published As

Publication number Publication date
JPH0129070B2 (enExample) 1989-06-07

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