JPS593935A - 半導体ウエハ−を光照射で加熱する方法 - Google Patents
半導体ウエハ−を光照射で加熱する方法Info
- Publication number
- JPS593935A JPS593935A JP57111500A JP11150082A JPS593935A JP S593935 A JPS593935 A JP S593935A JP 57111500 A JP57111500 A JP 57111500A JP 11150082 A JP11150082 A JP 11150082A JP S593935 A JPS593935 A JP S593935A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- temperature
- semiconductor wafer
- auxiliary heating
- heating source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10P34/422—
Landscapes
- Recrystallisation Techniques (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57111500A JPS593935A (ja) | 1982-06-30 | 1982-06-30 | 半導体ウエハ−を光照射で加熱する方法 |
| US06/445,492 US4468259A (en) | 1981-12-04 | 1982-11-30 | Uniform wafer heating by controlling light source and circumferential heating of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57111500A JPS593935A (ja) | 1982-06-30 | 1982-06-30 | 半導体ウエハ−を光照射で加熱する方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS593935A true JPS593935A (ja) | 1984-01-10 |
| JPS6331096B2 JPS6331096B2 (OSRAM) | 1988-06-22 |
Family
ID=14562866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57111500A Granted JPS593935A (ja) | 1981-12-04 | 1982-06-30 | 半導体ウエハ−を光照射で加熱する方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS593935A (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60167335U (ja) * | 1984-04-14 | 1985-11-06 | 大日本スクリ−ン製造株式会社 | 熱処理装置 |
| JPH02291118A (ja) * | 1988-12-30 | 1990-11-30 | Ag Processing Technol Inc | ウェハーの表面及び周囲加熱のための放射熱源を利用したウェハー均一加熱方法及びその装置 |
| US5310339A (en) * | 1990-09-26 | 1994-05-10 | Tokyo Electron Limited | Heat treatment apparatus having a wafer boat |
| US11610803B2 (en) | 2020-10-20 | 2023-03-21 | Changxin Memory Technologies, Inc. | Mounting fixture of bearing ring for wafer |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58175826A (ja) * | 1981-12-04 | 1983-10-15 | Ushio Inc | 半導体を光照射で加熱する方法 |
-
1982
- 1982-06-30 JP JP57111500A patent/JPS593935A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58175826A (ja) * | 1981-12-04 | 1983-10-15 | Ushio Inc | 半導体を光照射で加熱する方法 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60167335U (ja) * | 1984-04-14 | 1985-11-06 | 大日本スクリ−ン製造株式会社 | 熱処理装置 |
| JPH02291118A (ja) * | 1988-12-30 | 1990-11-30 | Ag Processing Technol Inc | ウェハーの表面及び周囲加熱のための放射熱源を利用したウェハー均一加熱方法及びその装置 |
| US5310339A (en) * | 1990-09-26 | 1994-05-10 | Tokyo Electron Limited | Heat treatment apparatus having a wafer boat |
| US11610803B2 (en) | 2020-10-20 | 2023-03-21 | Changxin Memory Technologies, Inc. | Mounting fixture of bearing ring for wafer |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6331096B2 (OSRAM) | 1988-06-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5523262A (en) | Rapid thermal annealing using thermally conductive overcoat | |
| JPS58223320A (ja) | 不純物拡散方法 | |
| JPS59169125A (ja) | 半導体ウエハ−の加熱方法 | |
| US4468259A (en) | Uniform wafer heating by controlling light source and circumferential heating of wafer | |
| US4469529A (en) | Method for heating semiconductor wafer by means of application of radiated light with supplemental circumferential heating | |
| US4504730A (en) | Method for heating semiconductor wafer by means of application of radiated light | |
| US4535227A (en) | Method for heating semiconductor wafer by means of application of radiated light | |
| JPS6244848B2 (OSRAM) | ||
| JPS593935A (ja) | 半導体ウエハ−を光照射で加熱する方法 | |
| JPS59211221A (ja) | イオン注入した半導体の熱処理方法 | |
| JPH1197448A (ja) | 熱処理装置とこれを用いた半導体結晶の熱処理法 | |
| JPS5917253A (ja) | 半導体ウエハの熱処理方法 | |
| JPS6072227A (ja) | 半導体ウエフア中へド−パントを高温ドライブイン拡散する方法 | |
| JPS593921A (ja) | 半導体ウエハ−を光照射で加熱する方法 | |
| JPH025295B2 (OSRAM) | ||
| JPS593934A (ja) | 半導体ウエハ−を光照射で加熱する方法 | |
| JPS58194332A (ja) | 半導体を光照射で加熱する方法 | |
| JPS60732A (ja) | アニ−ル方法 | |
| JPS6088431A (ja) | 光照射加熱方法 | |
| JPS60145629A (ja) | 熱処理法 | |
| JPS59121832A (ja) | 半導体ウエハ−を光照射で加熱する方法 | |
| JPH0240480Y2 (OSRAM) | ||
| JPS593933A (ja) | 半導体ウエハ−を光照射で加熱する方法 | |
| JPS6088432A (ja) | ウエハ−のアニ−ル方法 | |
| JPS59121821A (ja) | 加熱器組立体 |