JPS5936992A - 金属ベ−スプリント基板 - Google Patents

金属ベ−スプリント基板

Info

Publication number
JPS5936992A
JPS5936992A JP57148027A JP14802782A JPS5936992A JP S5936992 A JPS5936992 A JP S5936992A JP 57148027 A JP57148027 A JP 57148027A JP 14802782 A JP14802782 A JP 14802782A JP S5936992 A JPS5936992 A JP S5936992A
Authority
JP
Japan
Prior art keywords
insulating layer
printed circuit
metal
circuit board
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57148027A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0355993B2 (cg-RX-API-DMAC7.html
Inventor
尾島　信行
中村　恒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP57148027A priority Critical patent/JPS5936992A/ja
Publication of JPS5936992A publication Critical patent/JPS5936992A/ja
Publication of JPH0355993B2 publication Critical patent/JPH0355993B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP57148027A 1982-08-25 1982-08-25 金属ベ−スプリント基板 Granted JPS5936992A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57148027A JPS5936992A (ja) 1982-08-25 1982-08-25 金属ベ−スプリント基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57148027A JPS5936992A (ja) 1982-08-25 1982-08-25 金属ベ−スプリント基板

Publications (2)

Publication Number Publication Date
JPS5936992A true JPS5936992A (ja) 1984-02-29
JPH0355993B2 JPH0355993B2 (cg-RX-API-DMAC7.html) 1991-08-27

Family

ID=15443469

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57148027A Granted JPS5936992A (ja) 1982-08-25 1982-08-25 金属ベ−スプリント基板

Country Status (1)

Country Link
JP (1) JPS5936992A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127345A (ja) * 1984-11-26 1986-06-14 日立化成工業株式会社 珪素鋼板ベ−ス銅張積層板の製造法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53138056A (en) * 1977-02-22 1978-12-02 Hitachi Chemical Co Ltd Method of coating resin layer on printed circuit board metal material substrate having through hole
JPS56115600A (en) * 1980-02-18 1981-09-10 Hitachi Ltd Method of manufacturing metal coreefilled printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53138056A (en) * 1977-02-22 1978-12-02 Hitachi Chemical Co Ltd Method of coating resin layer on printed circuit board metal material substrate having through hole
JPS56115600A (en) * 1980-02-18 1981-09-10 Hitachi Ltd Method of manufacturing metal coreefilled printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61127345A (ja) * 1984-11-26 1986-06-14 日立化成工業株式会社 珪素鋼板ベ−ス銅張積層板の製造法

Also Published As

Publication number Publication date
JPH0355993B2 (cg-RX-API-DMAC7.html) 1991-08-27

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