JPS5936955A - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS5936955A
JPS5936955A JP57147459A JP14745982A JPS5936955A JP S5936955 A JPS5936955 A JP S5936955A JP 57147459 A JP57147459 A JP 57147459A JP 14745982 A JP14745982 A JP 14745982A JP S5936955 A JPS5936955 A JP S5936955A
Authority
JP
Japan
Prior art keywords
resin
lead frame
dam bar
lead
bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57147459A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0371785B2 (enExample
Inventor
Yoshiharu Koizumi
祥治 小泉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP57147459A priority Critical patent/JPS5936955A/ja
Publication of JPS5936955A publication Critical patent/JPS5936955A/ja
Publication of JPH0371785B2 publication Critical patent/JPH0371785B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W74/016—
    • H10W70/421—
    • H10W74/121—
    • H10W72/07551—
    • H10W72/50—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57147459A 1982-08-25 1982-08-25 リ−ドフレ−ム Granted JPS5936955A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57147459A JPS5936955A (ja) 1982-08-25 1982-08-25 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57147459A JPS5936955A (ja) 1982-08-25 1982-08-25 リ−ドフレ−ム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP32203687A Division JPS63296256A (ja) 1987-12-18 1987-12-18 樹脂封止型半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5936955A true JPS5936955A (ja) 1984-02-29
JPH0371785B2 JPH0371785B2 (enExample) 1991-11-14

Family

ID=15430837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57147459A Granted JPS5936955A (ja) 1982-08-25 1982-08-25 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS5936955A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6117750U (ja) * 1984-07-04 1986-02-01 三菱電機株式会社 半導体装置用フレ−ム
JPS6181154U (enExample) * 1984-10-31 1986-05-29
JPS6265848U (enExample) * 1985-10-16 1987-04-23
JPS62147358U (enExample) * 1986-03-12 1987-09-17
JPS62160553U (enExample) * 1986-04-02 1987-10-13
JPS639151U (enExample) * 1986-07-02 1988-01-21
JPH02271652A (ja) * 1989-04-13 1990-11-06 Orient Watch Co Ltd 樹脂封止型半導体装置用リードフレームとその製造方法及び半導体装置の製造方法
US5070039A (en) * 1989-04-13 1991-12-03 Texas Instruments Incorporated Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
US5821610A (en) * 1995-01-18 1998-10-13 Nec Corporation Leadframe allowing easy removal of tie bars in a resin-sealed semiconductor device

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6117750U (ja) * 1984-07-04 1986-02-01 三菱電機株式会社 半導体装置用フレ−ム
JPS6181154U (enExample) * 1984-10-31 1986-05-29
JPS6265848U (enExample) * 1985-10-16 1987-04-23
JPS62147358U (enExample) * 1986-03-12 1987-09-17
JPS62160553U (enExample) * 1986-04-02 1987-10-13
JPS639151U (enExample) * 1986-07-02 1988-01-21
JPH02271652A (ja) * 1989-04-13 1990-11-06 Orient Watch Co Ltd 樹脂封止型半導体装置用リードフレームとその製造方法及び半導体装置の製造方法
US5070039A (en) * 1989-04-13 1991-12-03 Texas Instruments Incorporated Method of making an integrated circuit using a pre-served dam bar to reduce mold flash and to facilitate flash removal
US5075759A (en) * 1989-07-21 1991-12-24 Motorola, Inc. Surface mounting semiconductor device and method
US5821610A (en) * 1995-01-18 1998-10-13 Nec Corporation Leadframe allowing easy removal of tie bars in a resin-sealed semiconductor device

Also Published As

Publication number Publication date
JPH0371785B2 (enExample) 1991-11-14

Similar Documents

Publication Publication Date Title
US20070226996A1 (en) Hybrid integrated circuit device and method of manufacturing the same
JPS5936955A (ja) リ−ドフレ−ム
KR100244966B1 (ko) 공기 유입구가 형성된 절단 펀치를 포함하는 게이트 잔여물절단 장치
US4490902A (en) Lead frame for molded integrated circuit package
JPS60261163A (ja) リードフレームの製造方法
JPH11111745A (ja) 半導体装置の製造方法、プレス金型、ガイドレール
CN115084072B (zh) 半导体装置
JPS63296256A (ja) 樹脂封止型半導体装置の製造方法
JPS5895851A (ja) リ−ドフレ−ム
JP2826508B2 (ja) 半導体装置の製造装置
JP3352923B2 (ja) 樹脂封止用モールド金型
JPH1131775A (ja) 樹脂封止型半導体装置の製造方法およびこれに使用するリ ードフレーム
JP3566812B2 (ja) 半導体装置の製造方法
JPS6331128A (ja) 樹脂かす除去方法
JPS6150379B2 (enExample)
CN119230417A (zh) 制造半导体组件的方法
JPH04179260A (ja) リードフレーム
JP2002289757A (ja) 電子部品のリード切断方法
KR200141174Y1 (ko) 반도체 제조장비의 트림/포밍 다이
JPS63302545A (ja) 樹脂封止型半導体リ−ドフレ−ム
JP3339712B2 (ja) テープキャリアパッケージにおけるランナー枝の除去方法
KR200168394Y1 (ko) 반도체 패키지의 리드 프레임
JP2848923B2 (ja) 半導体装置のリードフレームの加工方法及びその装置
JPS63293022A (ja) モ−ルド方法およびその方法に用いるモ−ルド型
JPH02202045A (ja) リードフレームの製造方法