JPS593371A - Testing method of semiconductor device - Google Patents
Testing method of semiconductor deviceInfo
- Publication number
- JPS593371A JPS593371A JP57113201A JP11320182A JPS593371A JP S593371 A JPS593371 A JP S593371A JP 57113201 A JP57113201 A JP 57113201A JP 11320182 A JP11320182 A JP 11320182A JP S593371 A JPS593371 A JP S593371A
- Authority
- JP
- Japan
- Prior art keywords
- test
- tests
- pieces
- tested
- objects
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
Abstract
Description
【発明の詳細な説明】
本発明は半導体集積回路等の試験方法および試験装置に
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method and apparatus for testing semiconductor integrated circuits and the like.
最近の半導体集積回路は大規模化がめざましく、これに
伴い試験装置は高機能化、複雑化、高価格化しておシ、
また試験項目数および試験時間は非常に増大してきてい
るので、試験コストはどんどん大きくなシつつある。Recently, semiconductor integrated circuits have become larger in scale, and test equipment has become more sophisticated, complex, and expensive.
Furthermore, as the number of test items and test time have increased significantly, test costs have been increasing rapidly.
一般に半導体集積回路等を試験・検査するには試験装置
が使用され、個々の品種に応じて、試験榮件、試験項目
あるいは試験の順序、流れを定義する試験プログラムが
準備される1、半導体集積回路等の被試験物は通常全数
、試験・検査をなされるが、その際試験プログラムが試
験装置に入力され、試験装置は試験プログラムに基すき
、被試験物を試験し良、不良の判定を行う。Generally, test equipment is used to test and inspect semiconductor integrated circuits, etc., and test programs that define test conditions, test items, test order, and flow are prepared according to each product type.1. Normally, all test objects such as circuits are tested and inspected. At that time, a test program is input into the test equipment, and the test equipment tests the test object based on the test program and determines whether it is good or bad. conduct.
しかしながら、前述したように試験装置は高価格化し一
方被試馳物の試験項目数は増大し2、試験時間が増大し
ているために、試験装置の処理量は低下し、試験コスト
の増大をまねいている。。However, as mentioned above, testing equipment has become more expensive, the number of test items for test samples has increased2, and testing time has increased, so the throughput of testing equipment has decreased, leading to an increase in testing costs. I'm teasing you. .
本発明はこのような問題点を解決する試験方法および試
験装置を提供するものである。The present invention provides a test method and a test device that solve these problems.
従来、半導体集積回路等の試験は第1図の流れ図に示す
ように良品については第1テストから第Nテストまで全
項目についてなされてきた1、ところが、半導体集積回
路婢の製造技術の進歩は著しく非當に高い歩留シを示す
ようになってきたこと、また、半導体集積回路等の製造
プロセスは基本的にバッチ処理であυ、同一ロット内の
半導体集積回路等は同様の特性を示すことによシ、第1
テストから第Nテストのいくつかのテストについては、
テスト結果がすべて良ということが、しばしばである。Conventionally, testing of semiconductor integrated circuits, etc. has been performed on all items from the 1st test to the Nth test for non-defective products, as shown in the flowchart in Figure 11. However, the manufacturing technology for semiconductor integrated circuits has progressed significantly. In addition, the manufacturing process for semiconductor integrated circuits, etc. is basically a batch process, and semiconductor integrated circuits, etc. in the same lot may exhibit similar characteristics. Yoshi, 1st
For some tests from test to Nth test,
Often all test results are positive.
本発明はこの点に注目し試験コストの低減を目的とした
ものである。The present invention focuses on this point and aims to reduce test costs.
テスト結果がすべて良であるテストについては試験を省
略することが可能であわ、テスト結果がすべて良である
と予想されるテストについては、前述の理由によシ、試
験を省略することが可能と判断される。For tests where all test results are good, it is possible to omit the test, and for tests where all test results are expected to be good, it is possible to omit the test for the reasons stated above. be judged.
以下、本発明について説明する。The present invention will be explained below.
本発明の一実施例を第2図に示す。1は中央処理装置(
以下CPUと略す)で、試験装置の制御を行う、2は測
定部、3は被試験物、4は記憶部でこの中には試験プロ
グラムの格納部5、第1テストから第Nテストまでのそ
れぞれのテスト結果の格納部61+ 62+ 63+・
・・、6N、第1テストから第Nテストまでのそれぞれ
のテストの基準歩留シ格納部71,7□、73.・・・
、7N1全テストについて試験する被試験物の個数格納
部8を含む。動作を説明すれば以下のようになる。10
ツトの被試験物p個を試験するにあたシ、あらかじめ第
1図に示すような被試験物の試験プログラムが試験プロ
グラム格納部5に格納され被試験物p個中、全テストに
ついて試験する被試験物の個数qが格納部8に格納され
、q個のテスト結果に応じて、テストの省略可否の判断
基準となる基準歩留シが各テストについて格納部7□+
72+ 78+・・・17Nに格納され、テスト結果
格納部61+ 62+ 63+・・・16Nが初期化さ
れる。試験が開始されると、CPU1は試験プログラム
格納部5の内容を順次読み出し、その内容に準する測定
部2を起動し、被試験物3を試験し、各テストのテスト
結果を格納部61+ 62+ 63+・・・16Nに格
納する。CPUIは格納部8の内容つまシqを読み出し
、試験個数とqの大小比較を行い、試験個数がqを越え
ていなければ、試験プログラムの内容に基すき、全テス
トについて試験し、各テストのテスト結果つまシ各テス
トの歩留シを格納部J+ 62+ 63+・・・16N
に格納することを繰シ返す。An embodiment of the present invention is shown in FIG. 1 is the central processing unit (
The CPU (hereinafter abbreviated as "CPU") controls the test equipment. 2 is a measuring section, 3 is a test object, and 4 is a storage section, which includes a storage section 5 for test programs, and a test program storage section 5 for storing test programs from the first test to the Nth test. Storage section for each test result 61+ 62+ 63+・
. . , 6N, reference yield storage units 71, 7□, 73 . ...
, 7N1 includes a number storage unit 8 of test objects to be tested for all tests. The operation is explained as follows. 10
Before testing p test objects, a test program for the test objects as shown in FIG. The number q of test objects is stored in the storage unit 8, and the standard yield, which is the criterion for determining whether or not to omit the test, is stored in the storage unit 7□+ for each test according to the q test results.
72+ 78+ . . . 17N, and the test result storage units 61+ 62+ 63+ . . . 16N are initialized. When the test is started, the CPU 1 sequentially reads the contents of the test program storage section 5, starts the measurement section 2 according to the contents, tests the test object 3, and stores the test results of each test in the storage section 61+62+. 63+...Stored in 16N. The CPU reads the contents of the storage section 8, q, and compares the number of tests with the size of q. If the number of tests does not exceed q, it tests all the tests based on the contents of the test program, and calculates the results of each test. Test result summary The yield of each test is stored in J+ 62+ 63+...16N
Repeatedly storing.
次いで、試験個数がqを越えるとCPUIは各テストの
前にテスト結果と基準歩留シとを読み出し、大小比較を
しテスト結果が基準歩留9以上であるならばテストを省
略し、つまυこのテストは良と判定し、次のテストへ進
む。例えば第1テストの前にテスト結果格納部61の内
容、つまpq個についての第1テストの歩留シと、第1
テストの基準歩留シ格納部71の内容とを読み出し、大
小比較をしテスト結果が基準歩留9以上であるならば、
第1テストを省略し第2テストへと進む。またテスト結
果が基準歩留りを下まわるならば、そのテストを試験す
るということを第Nテストまで行う。Next, when the number of test pieces exceeds q, the CPUI reads out the test result and the standard yield sheet before each test, compares the size, and if the test result is the standard yield of 9 or more, the test is omitted, and υ This test is determined to be good and we proceed to the next test. For example, before the first test, the contents of the test result storage unit 61, the yield ratio of the first test for pq pieces, and the first
Read the standard yield of the test and the contents of the storage unit 71, compare the sizes, and if the test result is the standard yield of 9 or more,
Skip the first test and proceed to the second test. Furthermore, if the test result is lower than the standard yield, that test is repeated up to the Nth test.
ここで基準歩留シ格納部711732,7f+・・・1
7Nには任意の値を設定可能であるが、テスト結果がす
べて良であることを条件とする場合歩留υ100%に相
当する数値を格納しておけばよい。Here, the standard yield storage section 711732, 7f+...1
Although any value can be set for 7N, if the condition is that all test results are good, a numerical value corresponding to a yield υ100% may be stored.
以上説明したように、本発明によれば10ット総数p個
中、q個についてのみ全テストを実施し、fiシ(p−
q)個についてはいくつかのテストは省略されるわけで
、10ツトの試験時間は大幅に短縮され、高価な試験装
置の処理量を大幅に向上させることができる。As explained above, according to the present invention, all tests are performed on only q out of the total number p of 10 bits, and fi series (p-
q) Since some tests are omitted, the test time of 10 tests can be significantly shortened, and the throughput of expensive test equipment can be greatly improved.
第1図は試験プログラムの流れ図、第2図は本発明の一
実施例を示すプ四ツク図である。
なお図において、1・・・・・・中央処理装置、2・・
・・・・測定部、3・・・・・・被試験物、4・・・・
・・記憶部、5・・・・・・試験プログラムの格納部、
61+61+ 681・・・16N・・・・・・テスト
結果の格納部、71+ 72+ 73+・・・、7N・
・・・・・基準歩留シ格納部、8・・・・・・個数格納
部、である。
第1図
第2図FIG. 1 is a flow chart of a test program, and FIG. 2 is a four-step diagram showing an embodiment of the present invention. In the figure, 1... central processing unit, 2...
... Measuring section, 3 ... Test object, 4 ...
... Storage section, 5... Test program storage section,
61+61+ 681...16N...Test result storage section, 71+ 72+ 73+..., 7N...
. . . Standard yield storage unit, 8 . . . Quantity storage unit. Figure 1 Figure 2
Claims (1)
ツト中あらかじめ任意に設定された数量については全テ
スト項目を試験し残シの数量については、前記全テスト
項目を試験した数量についての各テストのテスト結果が
あらかじめ任意に設定された各テストの基準歩留り以上
であるテスト項目を試験しないことを特徴とする半導体
装置の試験方法。In a test method for testing semiconductor integrated circuits, 10
During the test, all test items are tested for the quantity arbitrarily set in advance, and for the remaining quantity, the test results of each test for the quantity tested for all test items are the standards for each test arbitrarily set in advance. A semiconductor device testing method characterized by not testing test items whose yield is higher than the yield.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57113201A JPS593371A (en) | 1982-06-30 | 1982-06-30 | Testing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP57113201A JPS593371A (en) | 1982-06-30 | 1982-06-30 | Testing method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS593371A true JPS593371A (en) | 1984-01-10 |
JPH0429988B2 JPH0429988B2 (en) | 1992-05-20 |
Family
ID=14606111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP57113201A Granted JPS593371A (en) | 1982-06-30 | 1982-06-30 | Testing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS593371A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59228729A (en) * | 1983-06-09 | 1984-12-22 | Toshiba Corp | Method and device for measuring semiconductor |
JPH01197674A (en) * | 1988-02-03 | 1989-08-09 | Mitsubishi Electric Corp | Article inspecting method |
JPH0252446A (en) * | 1988-08-17 | 1990-02-22 | Nec Kyushu Ltd | Testing apparatus for integrated circuit |
JPH0737959A (en) * | 1993-07-22 | 1995-02-07 | Nec Corp | Inspection of wafer |
WO1998033213A1 (en) * | 1997-01-29 | 1998-07-30 | Hitachi, Ltd. | Method for manufacturing semiconductor device |
JP2000515662A (en) * | 1996-08-07 | 2000-11-21 | マイクロン、テクノロジー、インコーポレーテッド | System for optimizing test and repair times of defective integrated circuits |
-
1982
- 1982-06-30 JP JP57113201A patent/JPS593371A/en active Granted
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59228729A (en) * | 1983-06-09 | 1984-12-22 | Toshiba Corp | Method and device for measuring semiconductor |
JPS6321344B2 (en) * | 1983-06-09 | 1988-05-06 | Tokyo Shibaura Electric Co | |
JPH01197674A (en) * | 1988-02-03 | 1989-08-09 | Mitsubishi Electric Corp | Article inspecting method |
JPH0252446A (en) * | 1988-08-17 | 1990-02-22 | Nec Kyushu Ltd | Testing apparatus for integrated circuit |
JPH0737959A (en) * | 1993-07-22 | 1995-02-07 | Nec Corp | Inspection of wafer |
JP2000515662A (en) * | 1996-08-07 | 2000-11-21 | マイクロン、テクノロジー、インコーポレーテッド | System for optimizing test and repair times of defective integrated circuits |
WO1998033213A1 (en) * | 1997-01-29 | 1998-07-30 | Hitachi, Ltd. | Method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0429988B2 (en) | 1992-05-20 |
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