JPS5931882A - 浴中表面処理方法及びその装置 - Google Patents
浴中表面処理方法及びその装置Info
- Publication number
- JPS5931882A JPS5931882A JP14059282A JP14059282A JPS5931882A JP S5931882 A JPS5931882 A JP S5931882A JP 14059282 A JP14059282 A JP 14059282A JP 14059282 A JP14059282 A JP 14059282A JP S5931882 A JPS5931882 A JP S5931882A
- Authority
- JP
- Japan
- Prior art keywords
- plating
- workpiece
- bath
- work
- plated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14059282A JPS5931882A (ja) | 1982-08-12 | 1982-08-12 | 浴中表面処理方法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14059282A JPS5931882A (ja) | 1982-08-12 | 1982-08-12 | 浴中表面処理方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5931882A true JPS5931882A (ja) | 1984-02-21 |
| JPH0158275B2 JPH0158275B2 (enExample) | 1989-12-11 |
Family
ID=15272269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14059282A Granted JPS5931882A (ja) | 1982-08-12 | 1982-08-12 | 浴中表面処理方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5931882A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62208080A (ja) * | 1986-03-10 | 1987-09-12 | Canon Inc | 定着装置 |
| JP2015057844A (ja) * | 2011-08-11 | 2015-03-26 | 東京エレクトロン株式会社 | 配線形成用治具 |
| US9175416B2 (en) | 2012-01-30 | 2015-11-03 | Ebara Corporation | Substrate holder and plating apparatus |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55161092A (en) * | 1979-06-01 | 1980-12-15 | Inoue Japax Res Inc | Electroplating method |
-
1982
- 1982-08-12 JP JP14059282A patent/JPS5931882A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55161092A (en) * | 1979-06-01 | 1980-12-15 | Inoue Japax Res Inc | Electroplating method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62208080A (ja) * | 1986-03-10 | 1987-09-12 | Canon Inc | 定着装置 |
| JP2015057844A (ja) * | 2011-08-11 | 2015-03-26 | 東京エレクトロン株式会社 | 配線形成用治具 |
| US9175416B2 (en) | 2012-01-30 | 2015-11-03 | Ebara Corporation | Substrate holder and plating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0158275B2 (enExample) | 1989-12-11 |
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