JPS5930538Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS5930538Y2
JPS5930538Y2 JP757079U JP757079U JPS5930538Y2 JP S5930538 Y2 JPS5930538 Y2 JP S5930538Y2 JP 757079 U JP757079 U JP 757079U JP 757079 U JP757079 U JP 757079U JP S5930538 Y2 JPS5930538 Y2 JP S5930538Y2
Authority
JP
Japan
Prior art keywords
metallized
lead
wire
grounded
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP757079U
Other languages
English (en)
Japanese (ja)
Other versions
JPS55108745U (enrdf_load_stackoverflow
Inventor
勝彦 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP757079U priority Critical patent/JPS5930538Y2/ja
Publication of JPS55108745U publication Critical patent/JPS55108745U/ja
Application granted granted Critical
Publication of JPS5930538Y2 publication Critical patent/JPS5930538Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Wire Bonding (AREA)
JP757079U 1979-01-23 1979-01-23 半導体装置 Expired JPS5930538Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP757079U JPS5930538Y2 (ja) 1979-01-23 1979-01-23 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP757079U JPS5930538Y2 (ja) 1979-01-23 1979-01-23 半導体装置

Publications (2)

Publication Number Publication Date
JPS55108745U JPS55108745U (enrdf_load_stackoverflow) 1980-07-30
JPS5930538Y2 true JPS5930538Y2 (ja) 1984-08-31

Family

ID=28815473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP757079U Expired JPS5930538Y2 (ja) 1979-01-23 1979-01-23 半導体装置

Country Status (1)

Country Link
JP (1) JPS5930538Y2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60154646A (ja) * 1984-01-25 1985-08-14 Hitachi Micro Comput Eng Ltd 半導体装置
KR940006585B1 (ko) * 1985-02-28 1994-07-22 소니 가부시키가이샤 반도체 회로장치

Also Published As

Publication number Publication date
JPS55108745U (enrdf_load_stackoverflow) 1980-07-30

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