JPS59231823A - 半導体装置の樹脂封止成形装置 - Google Patents
半導体装置の樹脂封止成形装置Info
- Publication number
- JPS59231823A JPS59231823A JP10693583A JP10693583A JPS59231823A JP S59231823 A JPS59231823 A JP S59231823A JP 10693583 A JP10693583 A JP 10693583A JP 10693583 A JP10693583 A JP 10693583A JP S59231823 A JPS59231823 A JP S59231823A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- ejector
- plate
- lower mold
- surface plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 34
- 239000011347 resin Substances 0.000 title claims abstract description 34
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 238000013459 approach Methods 0.000 claims abstract description 5
- 238000000465 moulding Methods 0.000 claims description 25
- 238000007789 sealing Methods 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000011230 binding agent Substances 0.000 claims 1
- 230000006835 compression Effects 0.000 abstract description 9
- 238000007906 compression Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract 1
- 238000001125 extrusion Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- XIWFQDBQMCDYJT-UHFFFAOYSA-M benzyl-dimethyl-tridecylazanium;chloride Chemical compound [Cl-].CCCCCCCCCCCCC[N+](C)(C)CC1=CC=CC=C1 XIWFQDBQMCDYJT-UHFFFAOYSA-M 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/4005—Ejector constructions; Ejector operating mechanisms
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10693583A JPS59231823A (ja) | 1983-06-13 | 1983-06-13 | 半導体装置の樹脂封止成形装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10693583A JPS59231823A (ja) | 1983-06-13 | 1983-06-13 | 半導体装置の樹脂封止成形装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59231823A true JPS59231823A (ja) | 1984-12-26 |
JPH0122732B2 JPH0122732B2 (enrdf_load_stackoverflow) | 1989-04-27 |
Family
ID=14446248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10693583A Granted JPS59231823A (ja) | 1983-06-13 | 1983-06-13 | 半導体装置の樹脂封止成形装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59231823A (enrdf_load_stackoverflow) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997034757A1 (de) * | 1996-03-19 | 1997-09-25 | Engel Maschinenbau Gesellschaft Mbh | Einrichtung zum antreiben eines verschiebbar gelagerten bauteils einer spritzgiessmaschine |
WO2002040246A1 (de) * | 2000-11-14 | 2002-05-23 | Netstal-Maschinen Ag | Verfahren und vorrichtung zum ausstossen von spritzgiessteilen |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS575338A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Molding die |
-
1983
- 1983-06-13 JP JP10693583A patent/JPS59231823A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS575338A (en) * | 1980-06-13 | 1982-01-12 | Hitachi Ltd | Molding die |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997034757A1 (de) * | 1996-03-19 | 1997-09-25 | Engel Maschinenbau Gesellschaft Mbh | Einrichtung zum antreiben eines verschiebbar gelagerten bauteils einer spritzgiessmaschine |
US5980235A (en) * | 1996-03-19 | 1999-11-09 | Engel Maschinenbau Gesellschaft M.B.H. | Means for driving a displaceably mounted component of an injection moulding machine |
WO2002040246A1 (de) * | 2000-11-14 | 2002-05-23 | Netstal-Maschinen Ag | Verfahren und vorrichtung zum ausstossen von spritzgiessteilen |
Also Published As
Publication number | Publication date |
---|---|
JPH0122732B2 (enrdf_load_stackoverflow) | 1989-04-27 |
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