JPH0533531B2 - - Google Patents

Info

Publication number
JPH0533531B2
JPH0533531B2 JP60132937A JP13293785A JPH0533531B2 JP H0533531 B2 JPH0533531 B2 JP H0533531B2 JP 60132937 A JP60132937 A JP 60132937A JP 13293785 A JP13293785 A JP 13293785A JP H0533531 B2 JPH0533531 B2 JP H0533531B2
Authority
JP
Japan
Prior art keywords
ejector
plate
hollow part
mold
transfer manifold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60132937A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61292329A (ja
Inventor
Hisanobu Takahama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP60132937A priority Critical patent/JPS61292329A/ja
Priority to KR1019860004703A priority patent/KR900001657B1/ko
Priority to CN86104184.4A priority patent/CN1005177B/zh
Publication of JPS61292329A publication Critical patent/JPS61292329A/ja
Publication of JPH0533531B2 publication Critical patent/JPH0533531B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP60132937A 1985-06-20 1985-06-20 半導体樹脂封止用成形装置 Granted JPS61292329A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP60132937A JPS61292329A (ja) 1985-06-20 1985-06-20 半導体樹脂封止用成形装置
KR1019860004703A KR900001657B1 (ko) 1985-06-20 1986-06-13 반도체 수지밀봉용 성형장치
CN86104184.4A CN1005177B (zh) 1985-06-20 1986-06-19 用于半导体树脂封装的模压设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60132937A JPS61292329A (ja) 1985-06-20 1985-06-20 半導体樹脂封止用成形装置

Publications (2)

Publication Number Publication Date
JPS61292329A JPS61292329A (ja) 1986-12-23
JPH0533531B2 true JPH0533531B2 (enrdf_load_stackoverflow) 1993-05-19

Family

ID=15092985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60132937A Granted JPS61292329A (ja) 1985-06-20 1985-06-20 半導体樹脂封止用成形装置

Country Status (3)

Country Link
JP (1) JPS61292329A (enrdf_load_stackoverflow)
KR (1) KR900001657B1 (enrdf_load_stackoverflow)
CN (1) CN1005177B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5480296A (en) * 1992-02-15 1996-01-02 Goldstar Electron Co., Ltd. Transfer molding apparatus for encapsulating an electrical element in resin
CN106217929B (zh) * 2016-06-24 2017-12-12 佛山市海天调味食品股份有限公司 压榨机、压榨生产线和调味品生产线
KR102217989B1 (ko) * 2016-12-27 2021-02-22 삼성전자주식회사 배터리 케이스 및 이를 포함하는 원격조정장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604226A (ja) * 1983-06-21 1985-01-10 Mitsubishi Electric Corp 半導体装置の樹脂封止成形装置

Also Published As

Publication number Publication date
KR880001028A (ko) 1988-03-31
KR900001657B1 (ko) 1990-03-17
CN86104184A (zh) 1987-01-07
JPS61292329A (ja) 1986-12-23
CN1005177B (zh) 1989-09-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term