CN1005177B - 用于半导体树脂封装的模压设备 - Google Patents

用于半导体树脂封装的模压设备 Download PDF

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Publication number
CN1005177B
CN1005177B CN86104184.4A CN86104184A CN1005177B CN 1005177 B CN1005177 B CN 1005177B CN 86104184 A CN86104184 A CN 86104184A CN 1005177 B CN1005177 B CN 1005177B
Authority
CN
China
Prior art keywords
die
piston
resin
slide table
ejector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CN86104184.4A
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English (en)
Chinese (zh)
Other versions
CN86104184A (zh
Inventor
高浜久延
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of CN86104184A publication Critical patent/CN86104184A/zh
Publication of CN1005177B publication Critical patent/CN1005177B/zh
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN86104184.4A 1985-06-20 1986-06-19 用于半导体树脂封装的模压设备 Expired CN1005177B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP132937/85 1985-06-20
JP60132937A JPS61292329A (ja) 1985-06-20 1985-06-20 半導体樹脂封止用成形装置

Publications (2)

Publication Number Publication Date
CN86104184A CN86104184A (zh) 1987-01-07
CN1005177B true CN1005177B (zh) 1989-09-13

Family

ID=15092985

Family Applications (1)

Application Number Title Priority Date Filing Date
CN86104184.4A Expired CN1005177B (zh) 1985-06-20 1986-06-19 用于半导体树脂封装的模压设备

Country Status (3)

Country Link
JP (1) JPS61292329A (enrdf_load_stackoverflow)
KR (1) KR900001657B1 (enrdf_load_stackoverflow)
CN (1) CN1005177B (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5480296A (en) * 1992-02-15 1996-01-02 Goldstar Electron Co., Ltd. Transfer molding apparatus for encapsulating an electrical element in resin
CN106217929B (zh) * 2016-06-24 2017-12-12 佛山市海天调味食品股份有限公司 压榨机、压榨生产线和调味品生产线
KR102217989B1 (ko) * 2016-12-27 2021-02-22 삼성전자주식회사 배터리 케이스 및 이를 포함하는 원격조정장치

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604226A (ja) * 1983-06-21 1985-01-10 Mitsubishi Electric Corp 半導体装置の樹脂封止成形装置

Also Published As

Publication number Publication date
KR900001657B1 (ko) 1990-03-17
CN86104184A (zh) 1987-01-07
JPH0533531B2 (enrdf_load_stackoverflow) 1993-05-19
KR880001028A (ko) 1988-03-31
JPS61292329A (ja) 1986-12-23

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GR02 Examined patent application
C14 Grant of patent or utility model
GR01 Patent grant
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CX01 Expiry of patent term