CN1005177B - Molding apparatus for semiconductor resin-sealing - Google Patents
Molding apparatus for semiconductor resin-sealing Download PDFInfo
- Publication number
- CN1005177B CN1005177B CN86104184.4A CN86104184A CN1005177B CN 1005177 B CN1005177 B CN 1005177B CN 86104184 A CN86104184 A CN 86104184A CN 1005177 B CN1005177 B CN 1005177B
- Authority
- CN
- China
- Prior art keywords
- piston
- resin
- sliding stand
- stamper
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 title claims description 19
- 238000007789 sealing Methods 0.000 title abstract description 3
- 239000004065 semiconductor Substances 0.000 title description 10
- 239000011347 resin Substances 0.000 claims abstract description 36
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 230000005540 biological transmission Effects 0.000 claims description 21
- 239000012530 fluid Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 14
- 238000007723 die pressing method Methods 0.000 claims description 9
- 238000005538 encapsulation Methods 0.000 claims description 4
- 238000004382 potting Methods 0.000 claims description 2
- 238000003860 storage Methods 0.000 claims 3
- 238000007711 solidification Methods 0.000 claims 1
- 230000008023 solidification Effects 0.000 claims 1
- 238000003825 pressing Methods 0.000 abstract description 25
- 238000004519 manufacturing process Methods 0.000 description 7
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 6
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241000220317 Rosa Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 230000008093 supporting effect Effects 0.000 description 1
- 210000000707 wrist Anatomy 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
To improve the operating efficiency by providing lower mold movable, providing a plurality of transfer cylinders and a pot, and always engaging plungers with the pot, thereby eliminating the centering of the pot and the plungers at mold mounting time. A lead frame 29 is supplied to a lower mold of transfer molds heated at the prescribed temperature, and sealing resin tablets 30... are supplied to a pot 24. Then, the piston 13 of a clamping transfer cylinder 12 is lifted to clamp upper and lower molds, the piston 28 of a press transfer manifold 14 is then lifted, and the tablets 30 are charged and pressure molded by plungers 27. At this time, uniform pressures are individually applied to the plungers 27 by uniform pressing mechanism 13. Then, the ejector rod 28 of a returning transfer manifold 16 is moved down, and the piston 13 of the cylinder 12 is further moved down to eject the mold products.
Description
The present invention relates to be applied to the resin-encapsulated molding apparatus of process for fabrication of semiconductor device process, described technical process comprises the following steps: to form circuit and element on semiconductor wafer, with formed circuit of resin-encapsulated and element, and the die parts of resin-encapsulated cut into pieces.
In the manufacturing of semiconductor product, because the complexity of product and to the sensitiveness of dust, aspect automaticity, the technical process that has has earlier generally lagged behind subsequent technical steps.Along with the development of recent production, the demand of the high efficiency production line of setting up semiconductor product is also being increased.In order to adapt to the development that this demand has just promoted large-diameter semiconductor wafer inevitably.And the automaticity of the technical process that has earlier also is improved, and simultaneously later technical process estimates to have more advanced automaticity and the operating efficiency of Geng Gao.According to these situations, developed various to semi-conductive small pieces chip bonding or lead-in wire the improving one's methods of bonding, and, in manufacturing process, on efficient, be improved followed by the resin-encapsulated technology of bonding technology.Usually in packaging technology, use a kind of multiple groove transmission molding apparatus that is called as.
With reference now to Fig. 1 to Fig. 4,, narrates one of prior art molding apparatus example.
A pair of protection slab 4 is fixed on the plumb post 2, and sliding stand 6 is supported on the pillar 2 so that sliding stand 6 can reciprocating motion between protection slab 4, with near and leave protection slab.Top die 8 is fixed on the protection slab 4, and dip mold 10 is fixed on the sliding stand 6.Therefore, pressing mold 10 can move up and down with sliding stand, on the last protection slab 4 transmission fluid cylinder 12 is housed, and injects the termination attaching mutually of piston 16 with the bar alive 14 of fluid cylinder 12 of resin.
Top die 8 comprises the top base 18 that is fixed on the protection slab 4, is contained in cushion block 20 and pressing mold pedestal 22 on the pedestal 18, and by cavity part 24 that these parts limited.Ejection plate 26 and ejection bearing 28 are contained in the part 24 by layering, cavity plate 30 is installed on the pedestal 22, a plurality of stripper pins 32 are housed on push top bracket 28, these push rods pass pedestal 22 and cavity plate 30, axis direction along pillar 2 moves, as the feed chamber of potting resin source inlet, be positioned at the center of pressing mold 8.
Be fixed on the dip mold 10 on the sliding stand 6; have basically the structure identical with top die 8; it comprises pedestal 18; cushion block 20 and pressing mold pedestal 22; cavity part 24; ejection plate 26; ejection bearing 28; cavity plate 30 and stripper pin 32 are respect to one another between most stripper pins 32 of two pressing molds up and down, and molding push rod 36 is installed in down on the protection slab 4; so that pass sliding stand 6 and bottom base 18; and support ejection plate 26 down, following protection slab 4 is fixed on the transmission fluid cylinder 38, and the transmission fluid cylinder can make sliding stand 6 reciprocating along pillar 2 axis directions; the bar alive 40 of fluid cylinder 38 passes protection slab 4, and its termination is being supported sliding stand 6 regularly.
After the transmission pressing mold was heated to predetermined temperature, on the framed cavity plate 32 that is placed on dip mold 10 that then goes between, the bar alive 40 of transmission fluid cylinder 38 rose then, to compress pressing mold 8 and 10(as shown in Figure 2).During this time, resin 42 is little bulk usually and sends in the feed chamber 34.
Subsequently, in order to carry out pressing mold, the bar alive 14 of transmission fluid cylinder 12 descends, so that piston 16 extruding fritter shape resin 42(as shown in Figure 3).Therefore, resin, is injected in the packed part 50 through runner 46 and cast gates 48 from annular groove 44, and the bar alives 14 of fluid cylinder 12 moves up then, and pressing mold compresses the bar alive 40 of fluid cylinder 38 and moves down, so the die parts of gained just is pushed and ejects (as shown in Figure 4).Fig. 5 is the top view of this die parts.And Fig. 6 is the molding cutaway view along Fig. 5 VI-VI line.
In above-mentioned molding apparatus, transmission fluid cylinder 12 and pressing mold 8 are independent of each other, therefore when installation pressing mold 8,, then to spend long time and a twist of the wrist for the center in the feed chamber 34 of the centrally aligned pressing mold 8 of the piston 16 that makes bar alive 14 terminations that are positioned at fluid cylinder 12.If misalignment, feed chamber 34 and piston 16 can be worn bad very soon.Because pressing mold 8 and piston 16 have nothing to do mutually, so they need be heated separately same predetermined temperature, exist the difference of temperature between these parts, can cause the increase of substandard products quantity.
In addition, feed chamber 34 and piston 16 need a space, and to add resin 42, therefore, in each pressing mold work week, piston 16 must shift out outside the feed chamber 34, and like this, piston 16 will have long stroke.Thereby the wearing and tearing of feed chamber 34 and piston 16 have been quickened.
Owing to have only single piston 16, this makes annular groove 44 and treat that the distance between the part of resin-encapsulated grows (as shown in Figure 5), and therefore, this scheme not only need prolong runner 46, also needs a large amount of resins and has prolonged injection process.In addition, because the spacing between annular groove 44 and each encapsulation position does not wait, further increased the possibility of substandard products again.
It is irrelevant with main resin source to add to the framed resin of lead-in wire.Like this, to treat that the resin that has fed could begin to carry out after being dissolved next work week.Thereby will prolong the pressing mold time.
The purpose of this invention is to provide a kind of compression mold device in order to the operating efficiency that improves the semiconductive resin encapsulation, this equipment can enough resins encapsulated semiconductor device apace, and can not cause the wearing and tearing or the damage of sealed in unit.
The invention provides a kind of semiconductive resin encapsulating die press equipment, it comprises: a pair of bearing that separates by preset distance; A sliding stand that is between the bearing; For sliding stand reciprocating motion between bearing, make sliding stand can near or leave the telecontrol equipment of bearing; First stamper component, it is fixed on the bearing and has first die pressing surface; Second stamper component, it is fixed on the sliding stand and has second die pressing surface; First and second die pressing surfaces, they have groove separately, and when two die pressing surfaces were bonded together, these grooves just were used for being defined for the specific die cavity of resin-encapsulated; A plurality of feeds chamber, they are produced in second stamper component, and link to each other with die cavity; A plurality of pistons, they lay respectively in the feed chamber, and pressure apparatus, and it is used for side by side piston being pushed to second die pressing surface after putting resin on the piston in the feed chamber and two die pressing surfaces are bonded together, and injects die cavity to force resin.
In equipment of the present invention, having only second stamper component is movably, and piston always is in the feed chamber at its corresponding place, and these feed chambeies are in the inner formation of second stamper component.Like this, just saved to be generally and aimed at required time and skill.And, avoided because the feed chamber that misalignment caused and the too much wearing and tearing of piston.
Because piston is among second stamper component, these parts can be heated together, like this, can reduce the temperature difference between the piston and second stamper component.In addition, piston always is among the feed chamber, and the stroke of piston is shortened like this.Therefore, wearing and tearing between feed chamber and the piston have been reduced.
According to the present invention, adopt two or more piston, the runner that is connected between annular groove and the die cavity is shortened, so just improved the resin output speed, also shortened injection length.In addition, because it is equal substantially to make length to runner, the possibility that therefore goes out substandard products just reduces greatly.
Fig. 1 is the vertical cross section of prior art resin-encapsulated process stempressing equipment;
Fig. 2, Fig. 3 and Fig. 4 are the vertical section diagrammatic sketch of key diagram 1 equipment work process;
Fig. 5 is the plane graph of the die parts that made by Fig. 1 equipment;
Fig. 6 is the profile along Fig. 5 VI-VI line;
Fig. 7 is the vertical cross section according to the resin-encapsulated molding apparatus of the embodiment of the invention;
Fig. 8 and Fig. 9 are the vertical section diagrammatic sketch of key diagram 7 equipment works;
Figure 10 is the plane graph of the die parts that made by Fig. 7 equipment;
Figure 11 is the profile along Figure 10 XI-XI line.
Fig. 7 is the vertical cross section according to the resin-encapsulated molding apparatus of the embodiment of the invention, pair of plates bearing 64 is fixed on the two ends of a plurality of columns 62, sliding stand 66 is by column 62 supportings, with between bearing 64 along vertical reciprocating motion of column, top die (mold pressing) 68 is installed on the lower surface of upper bracket 64, and dip mold 70 is installed on the upper surface of sliding stand 66, and transmission fluid cylinder 72 is fixed on the lower surface of undersetting 64, and the bar alive 74 of fluid cylinder 72 passes the hole at undersetting center.The termination of bar 74 alive is fixed on the lower surface of sliding stand 66.When the action of fluid cylinder 72, the bar 74 of make living stretches out or withdraw, and 66 of sliding stands are close or leave bearing 64 and move.
Top die 68 comprises the substrate 80 that is fixed on upper bracket 64 downsides, be fixed on the cushion block 82 of substrate 80 lower surfaces, with the stamper seat 84 that is fixed on cushion block 82 lower ends, substrate 80 and stamper seat 84, and cushion block 82 is determined cavity 94, cavity plate 86 fixedly is stacked on the lower surface of stamper seat 84, and its groove surface is downward.Ejection plate 92 and push top bracket 90 are installed in the space 94, are fixed with a plurality of stripper pins 88 on the push top bracket 90, and these stripper pins pass stamper seat 84 and cavity plate 86, stretch into respectively in the groove on the cavity plate 86.Like this, when plate 92 descended, stripper pin 88 will come out the die parts ejection in plate 86 grooves.
The pressure apparatus parts are contained in the neutral gear place between transmission tube 104 and 100.Pressure apparatus comprises the pressure equaliser that is installed in the bar 130 a plurality of alive on withdraw pipe 104 lower surfaces and pipe 100 upper surfaces and is supported by the bar 130 of living.There are a plurality of piston rods 126 to be installed on the parts 128, so that extend in vertical direction.Piston rod 126 passes pipe 104, the hole in lifting plate 116 and the pattern drawing bracket 118.In the hole that the round cylinder plug groove feed chamber 122 of a plurality of vertical extensions is installed on cavity plate 112 and the stamper seat 110, piston 124 is contained in the plug groove 122 in the mode of sealing respectively, and they are fixed on the upper end of its corresponding piston bar 126.Feed chamber 122 suitably is communicated with die cavity, this die cavity is to harden when cavity plate 85 and 112 liang when lumping together, determine by the groove of two cavity plate 86 and 112, therefore, on the piston 124 in resin mass 140 is put feed chamber 122 into, and piston 130 is activated, so that install 128 when rising, piston 124 rises in its corresponding feed chamber 122, at this moment, be sliding contact between piston and the feed chamber internal perisporium, the resin mass 140 of Jia Ruing is admitted to the pressing mold die cavity thus.Form the oil pressure passage 132 that makes oil pressure act on bar 130 alive by transmission tube 104 and 100, oil pressure passage 132 links to each other with oil outer potential source (not shown).Oil pressure acts on bar alive 130 bottoms, so that install 128 upwards, and acts on bar alive 130 tops, makes that then device 128 is downward.When up or down actuating force acted on the thrust balancing device 128 by the bar 130 of living, device 128 was sent to power on the piston rod 126 equably, like this, makes that the pressure of 124 pairs of resin mass 140 of piston is uniform.Device 128 can be realized its pressure balanced effect with spring.
In the molding apparatus of making in this way, its cavity plate 86 and 112, stamper seat 84 and 110, and the piston 124 in plate 112 and mold pressing seat 110 can be heated to same predetermined temperature at first simultaneously.Then, to go between and framed 142 be placed on the lower impressions plate 112, and resin mass 140 is placed on the piston 124 in the feed chamber 122, subsequently, the bar alive 74 that is used to compress the transmission fluid cylinder 72 of pressing mold rises, and makes plate 86 and 112 be bonded together, and pressurized compresses (as shown in Figure 8), to do like this, will be earlier ejection plate 92 upwards be risen, withdraw from the groove of stripper pin 88 slave plates 86 to allow.Then, oil pressure is acted on the bar alive 130 of transmission tube 100, thus, make pressure equaliser 128 rise by oil pressure passage 132.Therefore, piston 124 rises in feed chamber 122, enters the die cavity that the groove on cavity plate 86 and 112 is determined to force resin mass 140.
When resin in die cavity after the pressing mold, the bar alive of transmission fluid cylinder 72 is received (as shown in Figure 9) 74 times.Like this, cavity plate 112 is separated with 86, and relied on the weight of ejection plate 92, die parts 146 ejection from cavity plate 86 is come out or the like.When whole sliding stand 66 moves down when putting in place, ejection rod 134 corresponding connecting rod 136 of conflicting makes and moves on the ejection plate 116 relative stamper seats 110 that like this, stripper pin 120 comes out ejection in the groove of die parts 146 slave plates 112.
Figure 10 is in this way carrying out the plane graph of the resultant die parts of resin-encapsulated, and Figure 11 is the cutaway view of Figure 10 along XI-XI line.With respect to a plurality of feeds chamber 122, a plurality of annular grooves 148 are housed, resin is added in the die cavity of laying semiconductor chip through runner 150 and cast gate 152 by annular groove 148, resin-encapsulated part 154 forms in the pairing part of die cavity, and packaged part 154 is cut the semiconductor chip that just can obtain a plurality of resin-encapsulated.
Because this equipment has two or more feed chamber 122, this just can have two or more annular groove 148, and also can shorten runner 150, length also can be unified, and also can make annular groove 148 identical to the distance between the packed part 154, like this, prepared die parts is identical in quality, thus, will improve the resin output speed, also shorten the time of injecting.
This its inside has the feed chamber and has the die module of pressure apparatus of band piston can be retrofitted on the fixing support, gets sliding stand with generation.
The said equipment manufactured according to the present invention need be for not making the feed chamber time-consuming with the piston aligning when pressing mold is installed, like this, and also wearing and tearing with regard to having avoided causing owing to misalignment.Because pressing mold and piston always connect together, they can be heated together, and this makes the temperature difference reduce to present 170 ± 3 ℃ by 170 ± 10 ℃ of former prepared.Like this, the substandard products that caused by the temperature difference will reduce.
Because the stroke of piston in the feed chamber shorten (becoming 30mm by common 150mm) greatly, this has 1/5 of standard earlier with regard to making the wearing and tearing in piston and feed chamber reduce to.
As shown in figure 10, are identical (shorten to 12mm, and in the past generally be 220 to 400mm) to each by the distance of resin-encapsulated part 154 with annular groove 148, the resin use amount reduces about 10%.Thus, big major clean-up operation substandard products.
In addition, the resin injection length also shortened to 10 seconds from 30 seconds, and sent to when going between framed and resin, had reduced mechanically operated number of times, because resin can melt in the process that pressing mold compresses, so can improve service speed.
The pressing mold process time will shorten to 60 seconds by 180 seconds, thereby improve operating efficiency.And the reasonability of later process will be to promoting the manufacturing production of semiconductor device, to obtain bigger actual benefit greatly.
Claims (16)
1, a kind of semiconductive resin encapsulation molding apparatus, it comprises:
First and second bearing (64) separated by a distance;
Be supported on the sliding stand (66) between bearing movingly;
The device (72,74) that sliding stand (66) is moved around;
First stamper component (68), it is installed on first bearing (64), and the first surface that forms first groove part in it is arranged;
Second stamper component (70), it is installed on the sliding stand (66), and the second surface that forms second groove part in it is arranged, this second surface is in the face of first surface, first and second groove parts limit die cavity, and when the second surface of the first surface of first stamper component and second stamper component lumped together, resin-encapsulated was in this die cavity, it is characterized in that
At least two feed chambeies (122), they are installed on second stamper component (70), and a resin storage area is arranged, this resin storage area when the second surface of the first surface of first stamper component and second stamper component lumps together can with die cavity UNICOM;
Piston element (124,126), they are placed in the resin storage area in each feed chamber (122) movingly, are used to force potting resin;
Pressure balance component (128) is placed in second moulded parts, is used for equably pressure being passed to each piston element (124,126);
At least two first bars alive (130), they are installed on second stamper component (70), and are positioned at pressure balance component (128) top, are used to reduce pressure balance component, and described first bar alive utilizes a common hydraulic system to drive;
At least two bars alive (130), they are installed on second stamper component (70), and are positioned at pressure balance component (128) below, use the adherence pressure equalizing feature, and described second bar alive utilizes a common hydraulic system to drive.
2, according to the molding apparatus of claim 1, it is characterized in that it also comprises the first and second stripper pin groups that assign in first and second stamper components, so that can do near or leave the motion of bearing, but also comprise first and second lifting plates that are installed in respectively on the first and second stripper pin groups, like this, adopt first and second lifting plates respectively towards the method for first and second die pressing surfaces motion, the molding that resin solidification makes is removed from recess.
3,2 molding apparatus as requested, it is characterized in that: described pressure apparatus comprises a plurality of fluid cylinders that are installed on the described sliding stand, and each fluid cylinder has a bar connecting rod alive, described pressure apparatus comprises that also a plurality of one heads are installed in piston upper piston connecting rod separately, by these piston rods, piston moves towards second die pressing surface.
4, according to the molding apparatus of claim 3, it is characterized in that described pressure apparatus comprises the pressure equaliser that bar connecting rod alive and piston rod with fluid cylinder link together, this device power that the bar connecting rod extrudes that is used for will living equably is sent to piston rod.
5, according to the molding apparatus of claim 4, it is characterized in that also comprising that one penetrates described sliding stand and is installed in stripper pin on the other bearing, this stripper pin second lifting plate that is used for conflicting, to make sliding stand when motion at telecontrol equipment, sliding stand moves on certain orientation, make first and second die pressing surfaces be separated from each other out, make second group of stripper pin eject molding.
6, according to the molding apparatus of claim 1, it is characterized in that described telecontrol equipment comprises a transmission fluid cylinder that is installed on the other bearing, a hole and its end that this transmission fluid cylinder passes bearing are installed on the sliding stand.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60132937A JPS61292329A (en) | 1985-06-20 | 1985-06-20 | Forming device for resin-sealing semiconductor |
| JP132937/85 | 1985-06-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN86104184A CN86104184A (en) | 1987-01-07 |
| CN1005177B true CN1005177B (en) | 1989-09-13 |
Family
ID=15092985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN86104184.4A Expired CN1005177B (en) | 1985-06-20 | 1986-06-19 | Molding apparatus for semiconductor resin-sealing |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS61292329A (en) |
| KR (1) | KR900001657B1 (en) |
| CN (1) | CN1005177B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5480296A (en) * | 1992-02-15 | 1996-01-02 | Goldstar Electron Co., Ltd. | Transfer molding apparatus for encapsulating an electrical element in resin |
| CN106217929B (en) * | 2016-06-24 | 2017-12-12 | 佛山市海天调味食品股份有限公司 | Squeezer, Squeeze Production Line and production line for condiments |
| KR102217989B1 (en) * | 2016-12-27 | 2021-02-22 | 삼성전자주식회사 | The Remote Controller Battery separation structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS604226A (en) * | 1983-06-21 | 1985-01-10 | Mitsubishi Electric Corp | Device for resin molding of semiconductor device |
-
1985
- 1985-06-20 JP JP60132937A patent/JPS61292329A/en active Granted
-
1986
- 1986-06-13 KR KR1019860004703A patent/KR900001657B1/en not_active IP Right Cessation
- 1986-06-19 CN CN86104184.4A patent/CN1005177B/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CN86104184A (en) | 1987-01-07 |
| JPH0533531B2 (en) | 1993-05-19 |
| KR880001028A (en) | 1988-03-31 |
| JPS61292329A (en) | 1986-12-23 |
| KR900001657B1 (en) | 1990-03-17 |
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| C06 | Publication | ||
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C13 | Decision | ||
| GR02 | Examined patent application | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
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