CN219820472U - Injection mold with adjustable packaging thickness - Google Patents
Injection mold with adjustable packaging thickness Download PDFInfo
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- CN219820472U CN219820472U CN202320633381.1U CN202320633381U CN219820472U CN 219820472 U CN219820472 U CN 219820472U CN 202320633381 U CN202320633381 U CN 202320633381U CN 219820472 U CN219820472 U CN 219820472U
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- cavity
- mold
- injection
- upper die
- thickness
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- 238000002347 injection Methods 0.000 title claims abstract description 78
- 239000007924 injection Substances 0.000 title claims abstract description 78
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 49
- 238000003825 pressing Methods 0.000 claims abstract description 28
- 238000001746 injection moulding Methods 0.000 claims abstract description 5
- 239000005022 packaging material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model relates to an injection mold with adjustable packaging thickness, which comprises: a lower die, on which a lower die cavity for accommodating the lead frame is formed and an injection molding opening arranged beside the lower die cavity; the upper die is provided with an upper die cavity corresponding to the lower die cavity and used for accommodating a product on the lead frame, the upper die is also provided with an injection cavity which is arranged opposite to the injection port and can be communicated with the lower die cavity, the upper die is also provided with an opening which is communicated with the upper die cavity, the opening is matched with the top size of the upper die cavity, and the top of the upper die is provided with a limit column; and the base is arranged above the limit column of the upper die and is provided with a pressing plate matched with the opening, the pressing plate can be pressed into the upper die cavity from the opening of the upper die, and the thickness of the pressing plate is matched with the packaging thickness required by the lead frame. The products with different packaging thicknesses can be replaced only by replacing the base, and the die is not required to be replaced, so that the cost of purchasing the die can be effectively reduced.
Description
Technical Field
The utility model relates to the technical field of semiconductor packaging, in particular to an injection mold with adjustable packaging thickness.
Background
The existing semiconductor products have different packaging thicknesses due to different use purposes of end customers, the existing injection mold adopts upper and lower molds to mold and form a plastic packaging cavity, the products to be packaged are placed in the plastic packaging cavity, and plastic packaging materials are injected into the plastic packaging cavity to realize the packaging of the products. The corresponding injection mold is formulated for products with different packaging thicknesses, so that the investment cost is high, the temperature and the temperature rise are required during the conversion of the injection mold in the production process, generally about 6 hours are required, the time is long, and the production efficiency is seriously influenced.
Disclosure of Invention
The utility model aims to overcome the defects of the prior art, provide an injection mold with adjustable packaging thickness, and solve the problems that the existing injection mold is high in cost because corresponding molds are required to be formulated for products with different packaging thicknesses, and the production efficiency is influenced because the mold conversion time is long in the production process.
The technical scheme for achieving the purpose is as follows:
the utility model provides an injection mold with adjustable packaging thickness, which is used for packaging products on lead frames, and comprises the following components:
a lower die, on which a lower die cavity for accommodating the lead frame is formed, and an injection molding opening arranged beside the lower die cavity;
the upper die is arranged opposite to the lower die, an upper die cavity which corresponds to the lower die cavity and is used for accommodating a product on the lead frame is arranged on the upper die, an injection cavity which is arranged opposite to the injection port is also arranged on the upper die, the injection cavity can be communicated with the lower die cavity, an opening which is communicated with the upper die cavity is also arranged on the upper die, the opening is matched with the top size of the upper die cavity, and a limit column is arranged at the top of the upper die; and
the base above the limit post of the upper die is provided with a pressing plate matched with the opening, the pressing plate can be pressed into the upper die cavity from the opening of the upper die, and the thickness of the pressing plate is matched with the packaging thickness required by the lead frame.
The injection mold adopts the structure that the upper mold is provided with the opening communicated with the upper mold cavity, the pressing plate is pressed in the opening, and the packaging operation of products with different packaging thicknesses is adapted through the pressing plates with different thicknesses, namely, the products with different packaging thicknesses only need to be replaced by the base, the mold is not required to be replaced, the cost generated by purchasing the mold can be effectively reduced, the base is only required to be replaced for conversion between the products with different packaging thicknesses, the process of cooling and heating the mold is not required, the replacement time is only required to be 5 minutes, and the problem that the production efficiency is influenced due to long time of the traditional mold replacement is solved.
The injection mold with adjustable packaging thickness is further improved by further comprising a supporting spring which is connected between the upper mold and the base in a supporting way.
The injection mold with the adjustable packaging thickness is further improved in that a limiting column is arranged at the top of the upper mold corresponding to the base, and the limiting column can be contacted with the base to limit the base.
The injection mold with the adjustable packaging thickness is further improved in that a movable adjustable piston is arranged at the injection port, and the plastic packaging material at the injection port can be pressed into the injection cavity by moving and adjusting the piston.
A further improvement of the injection mold with adjustable package thickness according to the utility model is that the thickness of the upper mold cavity is greater than the thickest package thickness required for the leadframe.
The utility model further improves the injection mold with adjustable packaging thickness, wherein the lower mold is provided with two lower mold cavities which are positioned at two sides of the injection port;
the upper die is also provided with two upper die cavities which are positioned at two sides of the injection molding cavity.
The utility model further improves the injection mold with adjustable packaging thickness, which is characterized in that the base comprises a top plate with the size matched with that of the upper mold and a vertical slat connected with the top plate;
the vertical slat is connected with the pressing plate.
A further improvement of the injection mold with adjustable packaging thickness is that the cross section of the upper mold cavity is square.
The injection mold with adjustable packaging thickness is further improved in that the cross section of the upper mold cavity is trapezoidal.
The injection mold with adjustable packaging thickness is further improved in that the cross section of the injection cavity is trapezoidal.
Drawings
FIG. 1 is a cross-sectional view of an injection mold with adjustable package thickness according to the present utility model.
Fig. 2 and 3 are schematic structural views of a packaging process of an injection mold with adjustable packaging thickness according to the present utility model.
Fig. 4 is a schematic structural view of another embodiment of an injection mold with adjustable package thickness according to the present utility model.
Fig. 5 is a schematic structural view of another embodiment of an injection mold with adjustable package thickness according to the present utility model.
Detailed Description
The utility model will be further described with reference to the drawings and the specific examples.
Referring to fig. 1, the utility model provides an injection mold with adjustable packaging thickness, which is suitable for packaging products with the same packaging type and different packaging thickness requirements, solves the problems that products with different packaging thicknesses need to be purchased and developed into different plastic packaging cavity molds and the replacement time is long, is provided with a base, is provided with a pressing plate pressed into an upper mold cavity, can be suitable for packaging products with different packaging thicknesses by adjusting the thickness of the different pressing plates, does not need to replace the molds, effectively reduces the cost caused by shopping molds, only needs 5 minutes for conversion among packaging operations with different thicknesses, does not need the process of heating and cooling the molds, can save the operation time, and avoids influencing the production efficiency. The injection mold with adjustable package thickness according to the present utility model will be described with reference to the accompanying drawings.
Referring to fig. 1, a cross-sectional view of an injection mold with adjustable package thickness in accordance with the present utility model is shown. The injection mold with adjustable package thickness according to the present utility model will be described with reference to fig. 1.
As shown in fig. 1, the injection mold with adjustable packaging thickness of the present utility model is used for packaging a product on a lead frame 10, and the injection mold comprises a lower mold 21, an upper mold 22 and a base 23, wherein a lower mold cavity 211 for accommodating the lead frame 10 and an injection port 212 arranged beside the lower mold cavity 211 are formed on the lower mold 21; the upper die 22 is arranged opposite to the lower die 21, an upper die cavity 221 corresponding to the lower die cavity 211 and used for accommodating a product on the lead frame 10 is arranged on the upper die 21, an injection cavity 222 opposite to the injection port 212 is also arranged on the upper die 21, the injection cavity 222 can be communicated with the lower die cavity 211, an opening 223 communicated with the upper die cavity 221 is also arranged on the upper die 21, the opening 223 is matched with the top size of the upper die cavity 221, and a limit column 224 is also arranged on the top of the upper die 22; the base 23 is disposed above the limit posts 224 of the upper mold 22, the base 23 has a pressing plate 231 adapted to the opening 223, the pressing plate 231 can be pressed into the upper mold cavity 221 from the opening 223 of the upper mold 21, and the thickness of the pressing plate 231 is adapted to the packaging thickness required by the lead frame 10, and the limit posts 224 can contact with the base 23 to limit the base 23, so that the position of the pressing plate 231 extending into the upper mold cavity 221 is limited, and the packaging thickness is ensured.
In use, as shown in fig. 1, the lead frame 10 is placed in the lower cavity 211 of the lower mold 21, then the upper mold 22 is placed on the lower mold 21, mold clamping is performed, the base 23 is placed on the upper mold 22, the pressing plate 231 on the base 23 is arranged in the opening 223, then, as shown in fig. 2, plastic package material is injected into the injection cavity 222 from the injection port 212, the plastic package material enters the lower cavity 211 and the upper cavity 221 from the injection cavity 222, then, the plastic package material is filled from one side to the other side of the lower cavity 211 and the upper cavity 221, when the plastic package reaches the final row of products, that is, the plastic package material and the other side walls of the upper cavity and the lower cavity have a certain gap, the filling of the plastic package material is stopped, the pressing machine is started to apply pressure to the upper side and the lower side of the upper mold and the lower mold, and the pressing plate 231 is pressed into the upper cavity, the base 23 is contacted with the limit posts 224 on the upper mold 22 in connection with fig. 3, the plastic package thickness of the products is ensured through the pressing plate, and the plastic package material is filled into the upper cavity and the lower cavity after the plastic package is completed in the pressing process.
In one embodiment of the present utility model, as shown in fig. 1, a support spring 24 is further included to support the connection between the upper mold 22 and the base 23.
The supporting spring 24 applies an elastic force to the base 23 to keep a certain adjustment distance between the bottom of the base 23 and the top of the limiting post 224, and the adjustment distance is the downward movement distance of the pressing plate 231.
Preferably, the number of the supporting springs 24 is plural.
The base 23 moves downwards to compress the supporting spring 24, after the encapsulation is completed, the pressure applied by the press is removed, and the base 23 can move upwards to reset under the action of the supporting spring 24.
In one embodiment of the present utility model, there are a plurality of limit posts 224 on the upper mold 22.
The limiting column 224 is vertically arranged and is cylindrical.
In one embodiment of the present utility model, as shown in fig. 1, a movable adjusting piston 25 is disposed at the injection port 212, and the molding compound at the injection port 212 can be pressed into the injection cavity 222 by moving the adjusting piston 25.
As shown in fig. 2 and 3, when the mold compound is stopped, the press is started to apply the mold clamping pressure to the upper mold and the lower mold, the piston 25 is pushed upward, so that the piston 25 presses the mold compound into the injection cavity 222, so that the mold compound can fill the upper mold cavity and the lower mold cavity.
In one embodiment of the present utility model, as shown in fig. 1, the thickness of the upper mold cavity 221 is greater than the thickest package thickness required for the leadframe.
Preferably, the thickness of the package required for the lead frame 10 is 0.55mm, 0.75mm, 0.95mm, etc., and the thickness of the upper mold cavity 221 is 1.5mm, which is greater than the thickest package required for the lead frame 10 by 0.95mm.
In one embodiment of the present utility model, as shown in fig. 1, the base 23 includes a top plate 232 having a size adapted to that of the upper mold 22 and a vertical slat 233 connected to the top plate 232, the vertical slat 233 being connected to the pressing plate 231.
Preferably, there are two vertical slats 233.
In one embodiment of the present utility model, as shown in fig. 5, in this example, the lower mold 21 has two lower mold cavities 211 thereon, and the two lower mold cavities 211 are located at both sides of the injection port 212;
the upper mold 22 also has two upper mold cavities 221 thereon, the two upper mold cavities 221 being located on either side of the injection cavity 222.
In this way, the injection mold can simultaneously perform plastic package on two lead frames, after the upper mold and the lower mold are buckled, the injection cavity 222 is communicated with the two lower mold cavities 211, so that plastic package materials can enter the two lower mold cavities 211 through the injection cavity 222.
In one embodiment of the present utility model, as shown in fig. 4, the upper mold cavity 221 has a square cross-sectional shape. The dimensions of the platen 231 are adapted to the dimensions of the upper mold cavity 221.
In one embodiment of the present utility model, as shown in FIG. 1, the upper mold cavity 221 has a trapezoidal cross-sectional shape.
The cross-sectional shape of injection cavity 222 is also trapezoidal.
The injection mold with adjustable mounting thickness is provided with the bases with various thickness specifications, the thickness of the pressing plates on the bases is different, when the injection mold is used, the corresponding pressing plates can be selected according to the required packaging thickness, different bases are used for different thicknesses, the molds with various specifications are not required to be configured, the cost can be effectively reduced, and when the injection mold is converted, only the bases are required to be replaced, the cooling and heating operations of the molds are not required, the time can be saved, and the influence on the production efficiency is avoided.
The present utility model has been described in detail with reference to the embodiments of the drawings, and those skilled in the art can make various modifications to the utility model based on the above description. Accordingly, certain details of the illustrated embodiments are not to be taken as limiting the utility model, which is defined by the appended claims.
Claims (9)
1. An injection mold with adjustable package thickness for packaging a product on a lead frame, the injection mold comprising:
a lower die, on which a lower die cavity for accommodating the lead frame is formed, and an injection molding opening arranged beside the lower die cavity;
the upper die is arranged opposite to the lower die, an upper die cavity which corresponds to the lower die cavity and is used for accommodating a product on the lead frame is arranged on the upper die, an injection cavity which is arranged opposite to the injection port is also arranged on the upper die, the injection cavity can be communicated with the lower die cavity, an opening which is communicated with the upper die cavity is also arranged on the upper die, the opening is matched with the top size of the upper die cavity, and a limit column is arranged at the top of the upper die; and
the base above the limit post of the upper die is provided with a pressing plate matched with the opening, the pressing plate can be pressed into the upper die cavity from the opening of the upper die, and the thickness of the pressing plate is matched with the packaging thickness required by the lead frame.
2. The injection mold of claim 1, further comprising a support spring supportingly coupled between the upper mold and the base.
3. The injection mold with adjustable packaging thickness as claimed in claim 1, wherein a movable adjustable piston is arranged at the injection port, and the plastic packaging material at the injection port can be pressed into the injection cavity by moving and adjusting the piston.
4. The adjustable package thickness injection mold of claim 1 wherein said upper mold cavity has a thickness greater than the thickest package thickness required for a lead frame.
5. The injection mold with adjustable packaging thickness as claimed in claim 1, wherein the lower mold is provided with two lower mold cavities, and the two lower mold cavities are positioned at two sides of the injection port;
the upper die is also provided with two upper die cavities which are positioned at two sides of the injection molding cavity.
6. The injection mold of claim 1, wherein the base comprises a top plate sized to fit the size of the upper mold and a vertical slat connected to the top plate;
the vertical slat is connected with the pressing plate.
7. The injection mold of claim 1, wherein the upper mold cavity has a square cross-sectional shape.
8. The injection mold of claim 1, wherein the upper mold cavity has a trapezoidal cross-sectional shape.
9. The injection mold of claim 1 wherein said injection cavity has a trapezoidal cross-sectional shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320633381.1U CN219820472U (en) | 2023-03-28 | 2023-03-28 | Injection mold with adjustable packaging thickness |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320633381.1U CN219820472U (en) | 2023-03-28 | 2023-03-28 | Injection mold with adjustable packaging thickness |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219820472U true CN219820472U (en) | 2023-10-13 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320633381.1U Active CN219820472U (en) | 2023-03-28 | 2023-03-28 | Injection mold with adjustable packaging thickness |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219820472U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117410238A (en) * | 2023-12-14 | 2024-01-16 | 青岛泰睿思微电子有限公司 | Wire bonding seed ball packaging structure of embedded chip |
-
2023
- 2023-03-28 CN CN202320633381.1U patent/CN219820472U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117410238A (en) * | 2023-12-14 | 2024-01-16 | 青岛泰睿思微电子有限公司 | Wire bonding seed ball packaging structure of embedded chip |
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