CN213785095U - Mould is used in wafer biscuit production of easy drawing of patterns - Google Patents

Mould is used in wafer biscuit production of easy drawing of patterns Download PDF

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Publication number
CN213785095U
CN213785095U CN202022824833.3U CN202022824833U CN213785095U CN 213785095 U CN213785095 U CN 213785095U CN 202022824833 U CN202022824833 U CN 202022824833U CN 213785095 U CN213785095 U CN 213785095U
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fixed
mould
sides
biscuit
die
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CN202022824833.3U
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Chinese (zh)
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杨淑山
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Longhai Jinshunlai Food Co ltd
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Longhai Jinshunlai Food Co ltd
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Abstract

The utility model discloses a mould is used in waffle production of easy drawing of patterns, including bed die main part, backup pad, supporting shoe, return spring and guide post, the both sides of bed die main part bottom all are fixed with the backup pad, and backup pad top one side is fixed with the supporting shoe, the central point department of putting of bed die main part bottom is fixed with the fixed block, and all slidable mounting has first connecting plate on the both sides outer wall of fixed block, the central point department of putting on bed die main part top installs biscuit mould down, the central point department of putting on first connecting plate top is fixed with the knockout pin, and the top of knockout pin extends to the outside of biscuit mould down, and one side on knockout pin top is fixed with sealed shutoff piece, the both sides on backup pad top all are fixed with the stand. The utility model discloses not only improve wafer's production efficiency, improve wafer's product quality, still strengthen the use convenience of mould.

Description

Mould is used in wafer biscuit production of easy drawing of patterns
Technical Field
The utility model relates to a wafer mould technical field specifically is a mould is used in wafer biscuit production of easy drawing of patterns.
Background
When waffle production is carried out, in order to form waffles, special dies are often used, and the bottom of the inner side of a common die is provided with some reticular patterns so as to be convenient for demoulding when heating.
The moulds for producing wafer biscuits on the market are various and can basically meet the use requirements of people, but certain defects still exist, and the specific problems are as follows.
(1) The existing mould for producing the wafer biscuit is used for demoulding only through the reticular patterns, and the wafer biscuit is tightly bonded with the mould and is not easy to separate, so that the operation of workers is inconvenient;
(2) the existing mould for producing the wafer biscuits is in a separated state mostly when the mould is frequently used, so that time and labor are wasted in the using process, and the production efficiency of the wafer biscuits is reduced;
(3) when the existing mould for producing the wafer biscuits is used, an external weight is usually used for pressing the upper mould, so that the upper mould and the lower mould are firmly contacted, the wafer biscuits cooled by the method are easy to crack, and the product quality of the wafer biscuits is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a mould is used in waffle production of easy drawing of patterns to solve the inconvenient material of separating of the mould, mould simple structure and the inconvenient fixed problem of mould from top to bottom of proposing in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a mould for producing waffles easy to demould comprises a lower mould main body, a supporting plate, supporting blocks, return springs and guide columns, wherein the supporting plate is fixed on two sides of the bottom of the lower mould main body, the supporting block is fixed on one side of the top end of the supporting plate, a fixed block is fixed at the central position of the bottom of the lower mould main body, first connecting plates are slidably mounted on the outer walls of two sides of the fixed block, a lower biscuit mould is mounted at the central position of the top end of the lower mould main body, an ejector rod is fixed at the central position of the top end of the first connecting plate, the top end of the ejector rod extends to the outer part of the lower biscuit mould, a sealing block is fixed on one side of the top end of the ejector rod, stand columns are fixed on two sides of the top end of the supporting plate, the return springs are wound on one side of the surface of the stand columns, a second connecting plate is slidably mounted on one side of the surface of the stand columns, the guide columns are fixed on two sides of the top end of the second connecting plate, the top of guide post extends to the outside of bed die main part, all be provided with limit structure on the both sides outer wall of bed die main part, the both sides on bed die main part top all are fixed with contact block.
Preferably, a sliding groove is formed in one side of the inside of the supporting block, and a sliding block is slidably mounted on one side of the inside of the sliding groove.
Preferably, the outer walls of the two sides of the supporting block are provided with limiting grooves, one side of the surface of the sliding block is fixed with a connecting gasket, one side of the surface of the connecting gasket is provided with a positioning bolt, and the bottom end of the positioning bolt extends to the inside of the connecting gasket.
Preferably, one side at the top end of the guide post is fixed with an upper die main body, one side at the bottom end of the upper die main body is fixed with an upper biscuit die, and the outer walls of the two sides of the upper die main body are both fixed with limiting clamping plates.
Preferably, limit structure's inside has set gradually support, locating piece, spacing draw-in groove and locating pin, all be fixed with the support on the both sides outer wall of bed die main part, and all be fixed with the locating piece on the outer wall of support one side.
Preferably, one side of the inside of the positioning block is provided with a limiting clamping groove, the outer wall of one side of the positioning block is provided with a positioning pin, and one end of the positioning pin extends to the inside of the limiting clamping groove.
Compared with the prior art, the beneficial effects of the utility model are that: the mould for producing the wafer biscuit easy to demould not only improves the production efficiency of the wafer biscuit and the product quality of the wafer biscuit, but also enhances the use convenience of the mould;
(1) the sealing blocks and the ejector rods are arranged, materials are injected into the lower biscuit die, then the upper die body is manually pressed to drive the guide columns, the sealing blocks and the ejector rods to move downwards, the ejector rods push the first connecting plates to move downwards at the moment, the guide columns push the second connecting plates to move downwards, the return springs are in a compression state, the stand columns can limit the moving amplitude of the second connecting plates until the upper biscuit die completely stretches into the lower biscuit die, namely the upper biscuit die and the lower biscuit die are overlapped, the two groups of contact blocks at the top end of the lower die body are in contact with the bottom end of the upper die body, then the upper die body and the lower die body are fixed by the limiting structures, after the upper biscuit die body and the lower die body are fixed, the upper biscuit die body and the lower die body are pushed into the oven to be processed, and the integrated die structures are adopted, so that no separation state exists between the dies, and the production efficiency of wafer biscuits is improved;
(2) by arranging the limiting clamping groove and the positioning block, the limiting clamping plate extends into the limiting clamping groove, then the positioning pin is taken out and is sequentially driven into the limiting clamping groove, the limiting clamping plate and the positioning block, the limiting clamping plate is fixed inside the positioning block, namely the position between the upper die main body and the lower die main body is fixed, an external object is omitted for applying pressure to the upper die main body, the pressure balance between the upper biscuit die and the lower biscuit die is maintained all the time, and the product quality of the wafer biscuit is improved;
(3) through being provided with first connecting plate and slider, remove limit structure's fixed restriction, return spring's elasticity will force the second connecting plate to go upward this moment, because of the one end of second connecting plate passes through slider, connecting pad and first connecting plate fixed connection, then second connecting plate, first connecting plate are together gone upward, and the knockout pin can be ejecting with the waffle of biscuit mould inside down this moment, realizes the function of waffle automatic drawing of patterns promptly, strengthens the use convenience of mould.
Drawings
Fig. 1 is a schematic view of a front view cross-sectional structure of the present invention;
FIG. 2 is an enlarged schematic view of the structure at A of FIG. 1 according to the present invention;
FIG. 3 is a schematic top view of the lower mold body of the present invention;
FIG. 4 is an enlarged schematic view of the limiting structure of the present invention;
in the figure: 1. a lower mold body; 2. a support plate; 3. a support block; 4. a biscuit mould is arranged; 5. a fixed block; 6. a first connecting plate; 7. a column; 8. a return spring; 9. a second connecting plate; 10. a guide post; 11. an upper mold body; 12. ejecting the rod; 13. sealing the plugging block; 14. putting the biscuit mould; 15. a limiting clamping plate; 16. a limiting structure; 1601. a support; 1602. positioning blocks; 1603. a limiting clamping groove; 1604. positioning pins; 17. a sliding groove; 18. a slider; 19. a limiting groove; 20. connecting a gasket; 21. positioning the bolt; 22. and a contact block.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: a mould for producing waffles easy to demould comprises a lower mould main body 1, a supporting plate 2, supporting blocks 3, return springs 8 and guide posts 10, wherein the supporting plate 2 is fixed on two sides of the bottom of the lower mould main body 1, and the supporting blocks 3 are fixed on one side of the top end of the supporting plate 2;
a sliding groove 17 is formed in one side inside the supporting block 3, a sliding block 18 is slidably mounted on one side inside the sliding groove 17, limiting grooves 19 are formed in the outer walls of the two sides of the supporting block 3, a connecting gasket 20 is fixed on one side of the surface of the sliding block 18, a positioning bolt 21 is mounted on one side of the surface of the connecting gasket 20, and the bottom end of the positioning bolt 21 extends into the connecting gasket 20;
a fixed block 5 is fixed at the central position of the bottom of the lower die main body 1, first connecting plates 6 are slidably mounted on the outer walls of two sides of the fixed block 5, a lower biscuit die 4 is mounted at the central position of the top end of the lower die main body 1, an ejector rod 12 is fixed at the central position of the top end of the first connecting plate 6, the top end of the ejector rod 12 extends to the outside of the lower biscuit die 4, a sealing block 13 is fixed at one side of the top end of the ejector rod 12, upright posts 7 are fixed at two sides of the top end of the supporting plate 2, a return spring 8 is wound on one side of the surface of each upright post 7, a second connecting plate 9 is slidably mounted at one side of the surface of each upright post 7, guide posts 10 are fixed at two sides of the top end of the second connecting plate 9, and the top ends of the guide posts 10 extend to the outside of the lower die main body 1;
injecting materials into the lower biscuit mold 4, then manually pressing the upper mold main body 11 to drive the guide post 10, the sealing block 13 and the ejector rod 12 to move downwards, at the moment, the ejector rod 12 pushes the first connecting plate 6 to move downwards, the guide post 10 pushes the second connecting plate 9 to move downwards, the return spring 8 is in a compression state, the stand column 7 can limit the moving amplitude of the second connecting plate 9 until the upper biscuit mold 14 completely extends into the lower biscuit mold 4, namely the upper biscuit and the lower biscuit are overlapped, two groups of contact blocks 22 at the top end of the lower mold main body 1 are in contact with the bottom end of the upper mold main body 11, then the upper mold main body 11 and the lower mold main body 1 are fixed by using the limiting structure 16, after the fixing is finished, the upper biscuit is pushed into an oven to be processed, and through an integrated mold structure, no separation state exists between the molds, and the production efficiency of wafer biscuits is improved;
an upper die main body 11 is fixed on one side of the top end of the guide column 10, an upper biscuit die 14 is fixed on one side of the bottom end of the upper die main body 11, and limiting clamping plates 15 are fixed on the outer walls of two sides of the upper die main body 11;
contact blocks 22 are fixed on both sides of the top end of the lower die main body 1;
the fixing limit of the limiting structure 16 is released, at the moment, the elastic force of the return spring 8 forces the second connecting plate 9 to move upwards, and as one end of the second connecting plate 9 is fixedly connected with the first connecting plate 6 through the sliding block 18 and the connecting gasket 20, the second connecting plate 9 and the first connecting plate 6 move upwards together, and at the moment, the ejector rod 12 can eject the waffle inside the lower biscuit mold 4, so that the function of automatically demolding the waffle is realized, and the use convenience of the mold is enhanced;
the outer walls of the two sides of the lower die main body 1 are provided with limiting structures 16;
a support 1601, a positioning block 1602, a limiting clamping groove 1603 and a positioning pin 1604 are sequentially arranged in the limiting structure 16, the supports 1601 are fixed on the outer walls of two sides of the lower die main body 1, the positioning block 1602 is fixed on the outer wall of one side of the support 1601, the limiting clamping groove 1603 is arranged on one side of the inner portion of the positioning block 1602, the positioning pin 1604 is arranged on the outer wall of one side of the positioning block 1602, and one end of the positioning pin 1604 extends into the limiting clamping groove 1603;
spacing cardboard 15 will visit the inside of spacing draw-in groove 1603, take out locating pin 1604 afterwards, squeeze into the inside of spacing draw-in groove 1603, spacing cardboard 15 and locating piece 1602 with it in proper order, spacing cardboard 15 is fixed in the inside of locating piece 1602 this moment, and the position between mould main part 11 and the bed die main part 1 is fixed promptly, saves the external object and exerts pressure to mould main part 11.
The working principle is as follows: when the biscuit maker is used, firstly, materials are injected into the lower biscuit mold 4, then the upper mold body 11 is manually pressed to drive the guide columns 10, the sealing and blocking blocks 13 and the ejector rods 12 to move downwards, at the moment, the ejector rods 12 push the first connecting plates 6 to move downwards, the guide columns 10 push the second connecting plates 9 to move downwards, the return springs 8 are in a compression state, the stand columns 7 can limit the moving amplitude of the second connecting plates 9 until the upper biscuit mold 14 completely extends into the lower biscuit mold 4, namely, the upper biscuit mold 14 and the lower biscuit mold are overlapped, the two groups of contact blocks 22 at the top end of the lower mold body 1 are in contact with the bottom end of the upper mold body 11, then the upper mold body 11 and the lower mold body 1 are fixed by the limiting structures 16, after the fixing is finished, the upper biscuit is pushed into the oven to be processed, through the integrated mold structure, no separation state exists between the molds, and the production efficiency of wafer biscuits is improved, when the die is fixed by the limiting structure 16, the limiting clamping plate 15 extends into the limiting clamping groove 1603, then the positioning pin 1604 is taken out and is sequentially driven into the limiting clamping groove 1603, the limiting clamping plate 15 and the positioning block 1602, at the moment, the limiting clamping plate 15 is fixed inside the positioning block 1602, namely, the position between the upper die main body 11 and the lower die main body 1 is fixed, an external object is saved for pressing the upper die main body 11, pressure balance between the upper biscuit die 14 and the lower biscuit die 4 is always maintained, the product quality of the wafer is improved, the wafer is separated, the fixing limit of the limiting structure 16 is removed, at the moment, the elastic force of the return spring 8 forces the second connecting plate 9 to move upwards, and the second connecting plate 9 and the first connecting plate 6 move upwards together due to the fact that one end of the second connecting plate 9 is fixedly connected with the first connecting plate 6 through the sliding block 18 and the connecting gasket 20, at the moment, the ejector rod 12 can eject the wafer inside the lower wafer die 4, so that the function of automatically demolding the wafer is realized, and the use convenience of the die is enhanced.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (6)

1. The utility model provides a mould is used in waffle production of easy drawing of patterns, includes bed die main part (1), backup pad (2), supporting shoe (3), return spring (8) and guide post (10), its characterized in that: the biscuit production line is characterized in that supporting plates (2) are fixed on two sides of the bottom of the lower die body (1), supporting blocks (3) are fixed on one side of the top end of each supporting plate (2), a fixing block (5) is fixed at the central position of the bottom of the lower die body (1), first connecting plates (6) are slidably mounted on outer walls of two sides of each fixing block (5), a lower biscuit die (4) is mounted at the central position of the top end of the lower die body (1), an ejector rod (12) is fixed at the central position of the top end of each first connecting plate (6), the top end of each ejector rod (12) extends to the outer portion of the corresponding lower biscuit die (4), a sealing block (13) is fixed on one side of the top end of each ejector rod (12), stand columns (7) are fixedly arranged on two sides of the top end of each supporting plate (2), return springs (8) are wound on one sides of the surfaces of the stand columns (7), and second connecting plates (9) are slidably mounted on one sides of the surfaces of the stand columns (7), the both sides on second connecting plate (9) top all are fixed with guide post (10), and the top of guide post (10) extends to the outside of bed die main part (1), all be provided with limit structure (16) on the both sides outer wall of bed die main part (1), the both sides on bed die main part (1) top all are fixed with contact piece (22).
2. An easy-to-demould mould for wafer production according to claim 1, wherein: a sliding groove (17) is formed in one side of the interior of the supporting block (3), and a sliding block (18) is installed on one side of the interior of the sliding groove (17) in a sliding mode.
3. An easy-to-demould mould for wafer production according to claim 2, wherein: the supporting block is characterized in that limiting grooves (19) are formed in the outer walls of the two sides of the supporting block (3), a connecting gasket (20) is fixed to one side of the surface of the sliding block (18), a positioning bolt (21) is installed on one side of the surface of the connecting gasket (20), and the bottom end of the positioning bolt (21) extends to the inside of the connecting gasket (20).
4. An easy-to-demould mould for wafer production according to claim 1, wherein: one side on guide post (10) top is fixed with mould main part (11) on, and goes up one side of mould main part (11) bottom and be fixed with biscuit mould (14), all be fixed with spacing cardboard (15) on the both sides outer wall of going up mould main part (11).
5. An easy-to-demould mould for wafer production according to claim 1, wherein: the inside of limit structure (16) has set gradually support (1601), locating piece (1602), spacing draw-in groove (1603) and locating pin (1604), all be fixed with support (1601) on the both sides outer wall of bed die main part (1), and all be fixed with locating piece (1602) on the outer wall of support (1601) one side.
6. An easy-to-demould mould for wafer production according to claim 5, wherein: locating piece (1602) inside one side is provided with spacing draw-in groove (1603), installs locating pin (1604) on the outer wall of locating piece (1602) one side, and the one end of locating pin (1604) extends to the inside of spacing draw-in groove (1603).
CN202022824833.3U 2020-11-30 2020-11-30 Mould is used in wafer biscuit production of easy drawing of patterns Active CN213785095U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022824833.3U CN213785095U (en) 2020-11-30 2020-11-30 Mould is used in wafer biscuit production of easy drawing of patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022824833.3U CN213785095U (en) 2020-11-30 2020-11-30 Mould is used in wafer biscuit production of easy drawing of patterns

Publications (1)

Publication Number Publication Date
CN213785095U true CN213785095U (en) 2021-07-27

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CN (1) CN213785095U (en)

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