JPS59229826A - リ−ドフレ−ムに対する半導体ペレツトの供給装置 - Google Patents

リ−ドフレ−ムに対する半導体ペレツトの供給装置

Info

Publication number
JPS59229826A
JPS59229826A JP9753683A JP9753683A JPS59229826A JP S59229826 A JPS59229826 A JP S59229826A JP 9753683 A JP9753683 A JP 9753683A JP 9753683 A JP9753683 A JP 9753683A JP S59229826 A JPS59229826 A JP S59229826A
Authority
JP
Japan
Prior art keywords
wafer
collet
pick
wafer tray
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9753683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0427699B2 (enrdf_load_stackoverflow
Inventor
Masahiro Muraoka
村岡　正裕
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP9753683A priority Critical patent/JPS59229826A/ja
Publication of JPS59229826A publication Critical patent/JPS59229826A/ja
Publication of JPH0427699B2 publication Critical patent/JPH0427699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP9753683A 1983-05-31 1983-05-31 リ−ドフレ−ムに対する半導体ペレツトの供給装置 Granted JPS59229826A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9753683A JPS59229826A (ja) 1983-05-31 1983-05-31 リ−ドフレ−ムに対する半導体ペレツトの供給装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9753683A JPS59229826A (ja) 1983-05-31 1983-05-31 リ−ドフレ−ムに対する半導体ペレツトの供給装置

Publications (2)

Publication Number Publication Date
JPS59229826A true JPS59229826A (ja) 1984-12-24
JPH0427699B2 JPH0427699B2 (enrdf_load_stackoverflow) 1992-05-12

Family

ID=14194967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9753683A Granted JPS59229826A (ja) 1983-05-31 1983-05-31 リ−ドフレ−ムに対する半導体ペレツトの供給装置

Country Status (1)

Country Link
JP (1) JPS59229826A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0772229A3 (en) * 1995-10-30 1998-06-17 Delco Electronics Corporation Vertical wafer compact flip chip feeder
JP2003086611A (ja) * 2001-09-07 2003-03-20 Heiwa Kinzoku Kogyo Kk Ｉｃダイボンド装置
JP2009141025A (ja) * 2007-12-04 2009-06-25 Ueno Seiki Kk 半導体処理装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588944U (ja) * 1981-07-08 1983-01-20 日本電気ホームエレクトロニクス株式会社 半導体製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS588944U (ja) * 1981-07-08 1983-01-20 日本電気ホームエレクトロニクス株式会社 半導体製造装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0772229A3 (en) * 1995-10-30 1998-06-17 Delco Electronics Corporation Vertical wafer compact flip chip feeder
SG86987A1 (en) * 1995-10-30 2002-03-19 Delco Electronics Corp Vertical wafer compact flip clip feeder
JP2003086611A (ja) * 2001-09-07 2003-03-20 Heiwa Kinzoku Kogyo Kk Ｉｃダイボンド装置
JP2009141025A (ja) * 2007-12-04 2009-06-25 Ueno Seiki Kk 半導体処理装置

Also Published As

Publication number Publication date
JPH0427699B2 (enrdf_load_stackoverflow) 1992-05-12

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